WO1985002629A1 - Plant for the treating of objects by means of a liquid - Google Patents

Plant for the treating of objects by means of a liquid Download PDF

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Publication number
WO1985002629A1
WO1985002629A1 PCT/EP1984/000367 EP8400367W WO8502629A1 WO 1985002629 A1 WO1985002629 A1 WO 1985002629A1 EP 8400367 W EP8400367 W EP 8400367W WO 8502629 A1 WO8502629 A1 WO 8502629A1
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WO
WIPO (PCT)
Prior art keywords
liquid
nozzle
objects
individual
control valves
Prior art date
Application number
PCT/EP1984/000367
Other languages
German (de)
French (fr)
Inventor
Hans HÖLLMÜLLER
Original Assignee
Hoellmueller Hans
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoellmueller Hans filed Critical Hoellmueller Hans
Publication of WO1985002629A1 publication Critical patent/WO1985002629A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Definitions

  • the invention relates to a device for treating objects by means of a liquid, in particular an etching or developing machine for the production of printed circuit boards, the objects having a layer on the surface which is partially removed under the action of the liquid with the formation of a pattern with at least one nozzle assembly containing a plurality of nozzles, with at least one liquid sump, with at least one
  • the object of the present invention is to design a device of the type mentioned at the outset in such a way that a more variable spray pattern which can be better matched to the particular material to be treated is achieved, so that local over- or under-treatments can be avoided.
  • each nozzle is assigned an individual liquid supply line which leads to the liquid collecting line;
  • the invention is based on the knowledge that the disadvantages described above are inherent in the known devices of the type mentioned above mainly because the nozzles are arranged there directly on the liquid collecting line and their individual liquid throughput cannot be influenced.
  • liquid paths are provided which are individually assigned to the individual nozzles, it is possible to add a separate control valve to each nozzle, with which the amount of liquid flowing through this nozzle can be individually adjusted. In this way, spray patterns can be achieved that could not be achieved with known machines. In particular, certain areas of the material to be treated can be sprayed more or less; puddles can also be reliably avoided in this way.
  • control valves can be operated by hand and are arranged as a battery on the outside of the device.
  • control valves are electrically operated.
  • they can also be arranged directly on the nozzle, as a result of which the individual supply lines to the nozzles become particularly short.
  • Figure 1 schematically the side view of the etchant system of an etching machine
  • Figure 2 the top view of Figure 1, partially in section
  • the etchant system comprises a nozzle assembly 1, which is plate-shaped in the example shown.
  • the nozzle stock 1 carries in a regular arrangement twenty nozzles D1 to D20, the spray openings of which are directed downwards in FIG. 1.
  • Each nozzle D1 to D20 is connected to a connection A1 to A20 via an individual channel K1 to K20 which is assigned to it and runs in the nozzle assembly 1.
  • FIGS. 1 and 2 only the connections A3, A4 and A20 are drawn in FIGS. 1 and 2; the connections A1, A2 and A5 to AI9 were not shown in order to relieve the drawing.
  • connections A1 to A20 which are all located on the same longitudinal side of the nozzle assembly 1, are connected via flexible hose pieces S1 to S20, in each case a flow meter M1 to M20 and in each case a control valve V1 to V20 to an etching agent collecting line 2.
  • a flow meter M1 to M20 in each case a flow meter M1 to M20 and in each case a control valve V1 to V20 to an etching agent collecting line 2.
  • the collecting line 2 leads to a pump 3 which is immersed in the etching sump 4 of the etching machine.
  • the flow rate measurement can also be replaced by a dynamic pressure measurement upstream of the throttle point using the Bernoulli equation.
  • the flow meters M1 to M20 which are designed as pressure gauges, would have to be - unlike in the drawing upstream are installed by control valves V1 to V20 directly behind the pump '.
  • the use of pressure sensors operating as flow meters is advantageous for cost reasons and because of the simplicity with which the output signal can be processed further.
  • the pump 3 conveys etchant from the sump 4 to the collecting line 2. This branches there and flows via the control valves V1 to V20, the flow meters M1 to M20, the hose sections S1 to S20 and the channels K1 to K20 to the Nozzles D1 to D20.
  • the control valves V1 to V20 not only make it possible to shut off entire rows of nozzles D1 to D20. In this way, in the case of etching machines operating in a continuous process, the residence time of the etched material within the etching zone can be changed. In addition, the amount of etching agent emerging from each individual nozzle D1 to D20 can be adjusted individually, thereby achieving a spray pattern of the nozzle assembly 1 that is adapted to the specific etched material becomes. In this way, certain areas of the etched material can thus be exposed to the etchant in a targeted manner to a greater extent, while others can be exposed to the etchant, which in particular prevents undesired puddling.

Abstract

Plant for the treatment of objects by means of a liquid, particularly an aching or developing machine for manufacturing printed circuit boards wherein the amount of treatment liquid which flows to the different nozzles arranged in a rod of nozzles may be separately regulated for each nozzle. To this effect, there is associated to each nozzle an individual liquid supply line wherein there is provided a regulation valve. Thereby, it is possible to obtain spray patterns which may be adapted to the object to be treated in a manner which was impossible heretofore.

Description

Vorrichtung zur Behandlung von Gegenständen mittels einer Flüssigkeit. Device for treating objects using a liquid.
Beschreibungdescription
Die Erfindung betrifft eine Vorrichtung zur Behandlung von Gegenständen mittels einer Flüssigkeit, insbesondere Ätz- oder- Entwicklermaschine für die Herstellung von Leiterplatten wobei die Gegenstände an der Oberfläche eine Schicht aufwei¬ sen, welche unter der Einwirkung der Flüssigkeit unter Aus¬ bildung eines Musters teilweise entfernt wird, mit mindestens einem eine Vielzahl von Düsen enthaltenden Düsenstock, mit mindestens einem Flüssigkeitssumpf, mit mindestens einerThe invention relates to a device for treating objects by means of a liquid, in particular an etching or developing machine for the production of printed circuit boards, the objects having a layer on the surface which is partially removed under the action of the liquid with the formation of a pattern with at least one nozzle assembly containing a plurality of nozzles, with at least one liquid sump, with at least one
Pumpe, welche die Flüssigkeit aus dem Sumpf ansaugt und über mindestens eine Flüssigkeits-Sammelleitung den einzelnen Düse zuführt.Pump which sucks the liquid from the sump and feeds it to the individual nozzle via at least one liquid collecting line.
Bei der Herstellung von Leiterplatten mit geringem Leiter¬ bahnabstand und geringer Leiterbahnbreite oder bei Metall¬ formteilen mit feinen Strukturen entscheiden häufig Sekunden bei der Bearbeitungszeit über den Bearbeitungserfolg. Da die Bearbeitung erst dann beendet werden kann, wenn an allen Stellen die Schicht entfernt (also z.B. die gesamte freie Metallschicht durchgeätzt ist), müssen bei ungleichmäßigem Sprühvorgang bestimmte Bereiche des Ätzgutes übermäßig lang bearbeitet werden. An diesen Stellen kann es dann zu Dimen¬ sionsveränderungen und/oder ünterätzungen führen. Bei groß- flächigen Leiterplatten, die in Horizontallage bearbeitet werden müssen, kann es zudem zu unerwünschter Pfützenbildung kommen, wenn die Behandlungsf-lüssigkeit von oben nach unten auf die Oberfläche des Behandlungsgutes aufgesprüht wird.In the production of printed circuit boards with a small interconnect spacing and narrow interconnect width or in the case of metal molded parts with fine structures, seconds of the processing time often determine the processing success. Since the processing can only be ended when the layer has been removed at all points (e.g. the entire free metal layer has been etched through), certain areas of the etched material have to be processed excessively long if the spraying process is uneven. At these points it can then lead to dimensional changes and / or undercuts. In the case of large-area printed circuit boards that have to be processed in a horizontal position, undesirable puddles can also occur if the treatment liquid is sprayed onto the surface of the material to be treated from top to bottom.
Aufgabe der vorliegenden Erfindung ist es, eine Vorrichtung der eingangs genannten Art derart auszugestalten, daß ein variableres, besser auf das jeweilige Behandlungsgut abstimm¬ bares Sprühbild erzielt wird, so daß lokale Über- bzw. Unter¬ behandlungen vermieden werden können.The object of the present invention is to design a device of the type mentioned at the outset in such a way that a more variable spray pattern which can be better matched to the particular material to be treated is achieved, so that local over- or under-treatments can be avoided.
OMPIOMPI
, /Λ/ , 1PO Λ Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß, / Λ /, 1PO Λ This object is achieved in that
a) jeder Düse eine individuelle Flüssigkeits-Zufuhrleitung zugeordnet ist, welche zur Flüssigkeits-Sammelleitung führt;a) each nozzle is assigned an individual liquid supply line which leads to the liquid collecting line;
b) in jeder individuellen Flüssigkeits-Zufuhrleitung ein Regelventil vorgesehen ist.b) a control valve is provided in each individual liquid supply line.
Die Erfindung fußt auf der Erkenntnis, daß die oben geschil¬ derten Nachteile den bekannten Vorrichtungen der eingangs genannten Art hauptsächlich deshalb immanent sind, weil dort die Düsen unmittelbar an der Flüssigkeits-Sammelleitung ange¬ ordnet sind und deren individueller Flüssigkeitsdurchsatz nicht beeinflußbar ist. Dadurch, daß erfindungsgemäß Flüssig¬ keitswege vorgesehen werden, die den einzelnen Düsen indi¬ viduell zugeordnet sind, ist es möglich, jeder Düse ein eige¬ nes Regelventil beizugeben, mit dem die durch diese Düse flie de Flüssigkeitsmenge einzeln einstellbar ist. Auf diese Weise lassen sich Sprühbilder erzielen, die mit bekannten Maschinen nicht erreichbar waren. Insbesondere können bestimmte Flächen bereiche des Behandlungsgutes stärker oder schwächer besprüht werden; auch Pfützenbildungen lassen sich auf diese Weise zu¬ verlässig vermeiden.The invention is based on the knowledge that the disadvantages described above are inherent in the known devices of the type mentioned above mainly because the nozzles are arranged there directly on the liquid collecting line and their individual liquid throughput cannot be influenced. The fact that, according to the invention, liquid paths are provided which are individually assigned to the individual nozzles, it is possible to add a separate control valve to each nozzle, with which the amount of liquid flowing through this nozzle can be individually adjusted. In this way, spray patterns can be achieved that could not be achieved with known machines. In particular, certain areas of the material to be treated can be sprayed more or less; puddles can also be reliably avoided in this way.
Im einfachsten Falle sind die Regelventile von Hand betätig¬ bar und als Batterie an der Außenseite der Vorrichtung ange¬ ordnet.In the simplest case, the control valves can be operated by hand and are arranged as a battery on the outside of the device.
Bequemer und im Blick auf eine mögliche Einbindung in eine automatische Prozeßregelung ist es, wenn die Regelventile elektrisch betätigt sind. In diesem Falle können sie auch unmittelbar an der Düse angeordnet werden, wodurch die indi¬ viduellen Zufuhrleitungen zu den Düsen besonders kurz werden. Ausführungsbeispiele der Erfindung werden nachfolgend anhand der Zeichnung näher erläutert; es zeigenIt is more convenient and in view of a possible integration into an automatic process control if the control valves are electrically operated. In this case, they can also be arranged directly on the nozzle, as a result of which the individual supply lines to the nozzles become particularly short. Embodiments of the invention are explained in more detail below with reference to the drawing; show it
Figur 1 : schematisch die Seitenansicht des Ätzmittelsystems einer Ätzmaschine;Figure 1: schematically the side view of the etchant system of an etching machine;
Figur 2: die Draufsicht auf Figur 1, teilweise im Schnitt-Figure 2: the top view of Figure 1, partially in section
In Figur 1 ist das Ätzmittelsystem einer Ätzmaschine zur Lei terplattenherstellung schematisch dargestellt. Es steht stel vertretend für alle Flüssigkeitssysteme von Vorrichtungen der eingangs genannten Art, insbesondere auch für das Ent¬ wicklersystem einer Entwicklermaschine. Die weiteren bekann¬ ten Bestandteile der Ätzmaschine, insbesondere Wände, Förder systeme für das Ätzgut usw., sind der besseren Übersichtlich keit halber weggelassen.In Figure 1, the etchant system of an etching machine for Lei circuit board manufacture is shown schematically. It stands for all liquid systems of devices of the type mentioned at the outset, in particular also for the developer system of a developer machine. The other known components of the etching machine, in particular walls, conveyor systems for the etched material, etc. have been omitted for the sake of clarity.
Das Ätzmittelsystem umfaßt einen Düsenstock 1 , der im darge¬ stellten Beispiel plattenför ig ausgebildet ist. Der Düsen¬ stock 1 trägt in regelmäßiger Anordnung zwanzig Düsen D1 bis D20, deren Sprühöffnungen in Figur 1 nach unten gerichtet sind. Jede Düse D1 bis D20 ist über einen individuellen, ihr zugeordneten, im Düsenstock 1 verlaufenden Kanal K1 bis K20 mit- einem Anschluß A1 bis A20 verbunden. In Figur 2 sind nur die Kanäle K3 und K4 sowie teilweise der Kanal K20 darge¬ stellt. Der Verlauf der übrigen Kanäle K1 , K2 sowie K5 bis K19 ist strichpunktiert angedeutet. In entsprechender Weise sind in den Figuren 1 und 2 nur die Anschlüsse A3, A4 und A20 gezeichnet; auf die Darstellung der Anschlüsse A1 , A2 sowie A5 bis AI9 wurde zur Entlastung der Zeichnung verzich¬ tet.The etchant system comprises a nozzle assembly 1, which is plate-shaped in the example shown. The nozzle stock 1 carries in a regular arrangement twenty nozzles D1 to D20, the spray openings of which are directed downwards in FIG. 1. Each nozzle D1 to D20 is connected to a connection A1 to A20 via an individual channel K1 to K20 which is assigned to it and runs in the nozzle assembly 1. In Figure 2, only the channels K3 and K4 and partially the channel K20 are shown. The course of the other channels K1, K2 and K5 to K19 is indicated by dash-dotted lines. Correspondingly, only the connections A3, A4 and A20 are drawn in FIGS. 1 and 2; the connections A1, A2 and A5 to AI9 were not shown in order to relieve the drawing.
___O PI - «_ -___O PI - «_ -
Die Anschlüsse A1 bis A20, die sich alle an derselben Längs¬ seite des Düsenstocks 1 befinden, sind über flexible Schlauch stücke S1 bis S20, jeweils einen Durchflußmengenmesser M1 bis M20 sowie jeweils ein Regelventil V1 bis V20 mit einer Ätzmittel-Sammelleitung 2 verbunden. Für die zeichnerische Darstellung der Sehlauchstüc e S1 bis S20, der Durchflußmenge esser M1 bis M20 sowie der Regelventile V1 bis V20 gilt das oben für die Kanäle K1 -bis K20 und die Anschlüsse A1 bis A20 Gesagte entsprechend.The connections A1 to A20, which are all located on the same longitudinal side of the nozzle assembly 1, are connected via flexible hose pieces S1 to S20, in each case a flow meter M1 to M20 and in each case a control valve V1 to V20 to an etching agent collecting line 2. For the graphical representation of the hose pieces S1 to S20, the flow rate esser M1 to M20 and the control valves V1 to V20, what has been said above for channels K1 to K20 and connections A1 to A20 applies accordingly.
Die Sammelleitung 2 führt zu einer Pumpe 3, die in den Ätz¬ mittelsumpf 4 der Ätzmaschine eintaucht.The collecting line 2 leads to a pump 3 which is immersed in the etching sump 4 of the etching machine.
Als Durchflußmengenmesser M1 bis M20 kommen alle bekannten Bauarten in Frage, soweit sie gegenüber dem Ätzmittel resi- stent sind. So ist der Einsatz von Auftriebskörper-Messern möglich, bei denen ein im fließenden Ätzmittel frei angeord¬ neter Auftriebskörper vom Ätzmittel gegen die Wirkung der Schwerkraft mitgenommen wird. Die Höhe, in welcher der Auf- triebskörper schwebt, ist ein direktes Maß für die Durchfluß- menge und kann visuell ermittelt werden. Alternativ ist ein Mengenmesser mit im fließenden Ätzmittel laufender Turbine verwendbar, deren Drehzahl das Maß für die Durchflußmenge darstellt. Auchrein elektrische Methoden, beispielsweise mittels Ultraschall, bei denen die Sensoren um die durch¬ strömte Leitung herum angeordnet sind und keine bewegliche Teile in das Ätzmittel eintauchen, kommen in Frage.All known types can be used as flow meters M1 to M20 insofar as they are resistant to the etchant. This makes it possible to use buoyancy knives in which a buoyancy body freely arranged in the flowing etchant is carried along by the etchant against the effect of gravity. The height at which the float floats is a direct measure of the flow rate and can be determined visually. Alternatively, a flow meter with a turbine running in the flowing etchant can be used, the speed of which represents the measure of the flow rate. Also purely electrical methods, for example by means of ultrasound, in which the sensors are arranged around the flow through the line and no moving parts are immersed in the etchant.
Insbesondere dann, wenn es weniger auf absolute Zahlen der Durchflußmengen sondern auf relative Mengenmessungen (Ver¬ änderungen) ankommt, kann unter Ausnutzung der Bernoulli- schen Gleichung die Durchflußmengenmessung auch durch eine Staudruckmessung stromauf von der Drosselstelle ersetzt werden. Die als Druckmesser ausgebildeten Durchflußmengen- esser M1 bis M20 müßten .also - anders als in der Zeichnung stromauf' von den Regelventilen V1 bis V20 direkt hinter der Pumpe angebracht werden. Der Einsatz von als Durchflußmengen messer arbeitenden Drucksensoren ist aus Kostengründen und wegen der Einfachheit, mit welcher das Ausgangssignal weiter verarbeitet werden kann, von Vorteil.In particular, when it is less a question of absolute numbers of the flow rates but of relative flow measurements (changes), the flow rate measurement can also be replaced by a dynamic pressure measurement upstream of the throttle point using the Bernoulli equation. The flow meters M1 to M20, which are designed as pressure gauges, would have to be - unlike in the drawing upstream are installed by control valves V1 to V20 directly behind the pump '. The use of pressure sensors operating as flow meters is advantageous for cost reasons and because of the simplicity with which the output signal can be processed further.
Im Betrieb der Ätzmaschine fördert die Pumpe 3 aus dem Sumpf4 Ätzmittel zur Sammelleitung 2. Dieses verzweigt sich dort und fließt über die Regelventile V1 bis V20, die Durchflußmengen- messer M1 bis M20, die Schlauchstücke S1 bis S20 und die Kanä K1 bis K20 zu den Düsen D1 bis D20.When the etching machine is operating, the pump 3 conveys etchant from the sump 4 to the collecting line 2. This branches there and flows via the control valves V1 to V20, the flow meters M1 to M20, the hose sections S1 to S20 and the channels K1 to K20 to the Nozzles D1 to D20.
Durch die Regelventile V1 bis V20 ist es nicht nur möglich, ganze Reihen von Düsen D1 bis D20 abzustellen. Hierdurch kann bei im Durchlaufverfahren arbeitenden Ätzmaschinen die Ver¬ weildauer des Ätzgutes innerhalb der Ätzzone verändert werden Zusätzlich kann die aus jeder einzelnen Düse D1 bis D20 aus¬ tretende Ätzmittelmenge individuell eingestellt werden, wo¬ durch ein an das spezielle Ätzgut angepaßtes Sprühbild des Düsenstockes 1 erzielt wird. Auf diese Weise können also be¬ stimmte Bereiche des Ätzguts gezielt stärker, andere schwä¬ cher dem Ätzmittel ausgesetzt werden, wodurch insbesondere eine unerwünschte Pfützenbildung verhindert wird.The control valves V1 to V20 not only make it possible to shut off entire rows of nozzles D1 to D20. In this way, in the case of etching machines operating in a continuous process, the residence time of the etched material within the etching zone can be changed. In addition, the amount of etching agent emerging from each individual nozzle D1 to D20 can be adjusted individually, thereby achieving a spray pattern of the nozzle assembly 1 that is adapted to the specific etched material becomes. In this way, certain areas of the etched material can thus be exposed to the etchant in a targeted manner to a greater extent, while others can be exposed to the etchant, which in particular prevents undesired puddling.
OMPI OMPI

Claims

Patentansprüche Claims
1. Vorrichtung zur Behandlung von Gegenständen mittels einer Flüssigkeit, insbesondere Ätz- oder Entwicklermaschine für die Herstellung von Leiterplatten, wobei die Gegen¬ stände an der Oberfläche eine Schicht aufweisen, welche unter der Einwirkung der Flüssigkeit unter Ausbildung eines Musters teilweise entfernt wird, mit mindestens einem eine Vielzahl von Düsen enthaltenden Düsenstock, mit mindestens einem Flüssigkeitssumpf, mit mindestens einer Pumpe, welche die Flüssigkeit aus dem Sumpf ansaugt und über mindestens eine Flüssigkeits-Sammelleitung den einzelnen Düsen zuführt, dadurch gekennzeichnet, daß1. Device for the treatment of objects by means of a liquid, in particular an etching or developing machine for the production of printed circuit boards, the objects on the surface having a layer which is partially removed under the action of the liquid to form a pattern, with at least a nozzle assembly containing a plurality of nozzles, with at least one liquid sump, with at least one pump which draws the liquid from the sump and feeds the individual nozzles via at least one liquid collecting line, characterized in that
a) jeder Düse (D 1 bis D 20) eine individuelle Flüssig¬ keits-Zufuhrleitung (K 1 bis K 20, S 1 bis S 20)zuge¬ ordnet ist, welche zur Flüssigkeits-Sammelleitung (2) führt;a) each nozzle (D 1 to D 20) is assigned an individual liquid supply line (K 1 to K 20, S 1 to S 20), which leads to the liquid collecting line (2);
b) in jeder individuellen Flüssigkeits-Zufuhrleitung (K 1 bis K 20, S 1 bis S 20) ein Regelventil (V 1 bis V 20) vorgesehen ist.b) a control valve (V 1 to V 20) is provided in each individual liquid supply line (K 1 to K 20, S 1 to S 20).
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Regelventile (V 1 bis V 20) von Hand betätigbar und als Batterie an der Außenseite der Vorrichtung angeordne sind.2. Device according to claim 1, characterized in that the control valves (V 1 to V 20) can be operated by hand and are arranged as a battery on the outside of the device.
3. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, daß die Regelventile (V 1 bis V 20) elektrisch betätigbar sind.3. Apparatus according to claim 1, characterized in that the control valves (V 1 to V 20) are electrically actuated.
4. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß die Regelventile (V T bis V 20) unmittelbar an der Düse (D 1 bis D 20) angeordnet" sind. 4. The device according to claim 3, characterized in that the control valves (V T to V 20) are arranged directly on the nozzle (D 1 to D 20) ".
PCT/EP1984/000367 1983-12-14 1984-11-23 Plant for the treating of objects by means of a liquid WO1985002629A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19833345206 DE3345206A1 (en) 1983-12-14 1983-12-14 DEVICE FOR TREATING OBJECTS BY LIQUID
DEP3345206.7 1983-12-14

Publications (1)

Publication Number Publication Date
WO1985002629A1 true WO1985002629A1 (en) 1985-06-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611483A1 (en) * 1991-11-07 1994-08-24 ATOTECH USA INC. (a Delaware corp.) Method and apparatus for controlled spray etching

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0354266B1 (en) * 1988-08-12 1993-10-20 International Business Machines Corporation Etching process and apparatus for work pieces composed at least partly of metals
EP1885138B1 (en) * 2006-07-11 2012-06-06 Hewlett-Packard Development Company, L.P. Signalling gateway

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2001790A1 (en) * 1969-07-14 1971-02-18 Buckbee Mears Co Device and method for controlled etching without etchant cover

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2001790A1 (en) * 1969-07-14 1971-02-18 Buckbee Mears Co Device and method for controlled etching without etchant cover

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0611483A1 (en) * 1991-11-07 1994-08-24 ATOTECH USA INC. (a Delaware corp.) Method and apparatus for controlled spray etching
EP0611483A4 (en) * 1991-11-07 1995-05-03 Chemcut Corp Method and apparatus for controlled spray etching.

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DE3345206A1 (en) 1985-06-27
EP0164377A1 (en) 1985-12-18

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