WO1981001610A1 - Telemetre automatique - Google Patents
Telemetre automatique Download PDFInfo
- Publication number
- WO1981001610A1 WO1981001610A1 PCT/JP1980/000285 JP8000285W WO8101610A1 WO 1981001610 A1 WO1981001610 A1 WO 1981001610A1 JP 8000285 W JP8000285 W JP 8000285W WO 8101610 A1 WO8101610 A1 WO 8101610A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- substrate
- emitting diode
- conductive
- light emitting
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000005259 measurement Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 4
- 241000406668 Loxodonta cyclotis Species 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000012780 transparent material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/46—Indirect determination of position data
- G01S17/48—Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C3/00—Measuring distances in line of sight; Optical rangefinders
- G01C3/10—Measuring distances in line of sight; Optical rangefinders using a parallactic triangle with variable angles and a base of fixed length in the observation station, e.g. in the instrument
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/30—Systems for automatic generation of focusing signals using parallactic triangle with a base line
- G02B7/32—Systems for automatic generation of focusing signals using parallactic triangle with a base line using active means, e.g. light emitter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Definitions
- the present invention relates to an automatic ranging device based on the principle of triangular ranging, which is suitable for being incorporated into an automatic focusing camera, and more particularly, projects light toward a subject to be measured, and
- the present invention relates to a distance measuring device of a type that receives reflected light from a distance measuring object by any one of a plurality of light receiving elements and measures a distance to the distance measuring object.
- two optical systems are arranged at a fixed base line distance, one of which is a light projection system and the other is a light receiving system, and distance measurement is performed via the light projection system.
- a camera that measures the distance to the object to be measured by guiding the reflected light of the light projected on the object to one of the multiple light receiving elements C5 arranged behind the light receiving system via the light receiving system.
- An automatic ranging device for automatic focus adjustment has been proposed.
- Fig. 1 is a principle diagram showing the principle of such a distance measuring device.
- (2) is a light source
- (4) is a lens of a light projection system
- (6) is a light source.
- (8a), (8b), (8c), and (8d) are the lenses of the light-receiving system, respectively.
- the light-receiving element placed behind (6), (10) is the output of each of the light-receiving elements (8a), (8b), (8c), and (8d), which are input separately.
- This is a detector that detects the distance to
- the subject object for distance measurement
- only the light receiving element (8a) receives the reflected light of the light projected by the light (f)
- the distance measurement is performed.
- the target is near the position (b)
- the optical element (8b) is located near the position (c)
- only the light receiving element (8c) is received, and if located near the position (d), only the light receiving element (8d) receives the reflected light.
- the position of each light receiving element is set. Then, the detection device (10) uses the light source (2) to aim at the distance measurement target.
- the spread of the luminous flux projected toward it may reduce the size.
- the base line length be as short as possible.
- FIG. 7 (b) of March 30, ⁇ ) in which a plurality of light receiving elements are fixed and wire-bonded, and are arranged in the base line length direction of the triangular distance measuring method.
- a concave portion for mounting a light emitting diode chip is formed at an end of the substrate arranged in parallel, and the light emitting diode chip is formed in the concave portion so that emitted light is emitted substantially parallel to the substrate.
- the present invention achieves the above object, and is used as a light source.
- a light emitting diode having a two-layered top is electrically connected to the first and second flat conductive frames arranged in parallel with the joining surface, and the bracket diode and A light source unit is created by integrally molding the electrical reading between the conductive frame and the conductive frame in the translucent material department, and this optical unit is applied to the base on which the light receiving elements are arranged. It is configured to attach. Therefore, the invention ('
- the light source unit is attached to the surface perpendicular to the base line length direction of the substrate through the first and second conductive frames, Nearly parallel to the frame, near the junction of the light emitting diode]
- the subject is irradiated. Therefore, according to this invention, there is no need to provide a reflecting member or the like for refracting the light from the light source toward the subject, and the number of parts can be reduced by that much and cost is reduced.
- FIG. 1 shows the principle of a triangulation-type distance measuring device that projects light toward the object to be measured and receives light reflected from the I-law m object to measure the distance
- Fig. 2 shows the present invention.
- FIG. 3 is a perspective view showing an example of an automatic measurement iig device
- FIG. 3 is a perspective view showing a light source unit of a distance measuring device according to another embodiment of the present invention
- FIG. 4 (a) is a view of the light source unit.
- FIG. 4 (b) is a perspective view of a main part showing a state in which the unit is mounted on the substrate ⁇ according to the method of FIG. 4 (a).
- Fig. (A) is a front view of a main part showing another mounting method
- Fig. 6 (a) is another embodiment of the present invention.
- FIG. 6 (b) is a perspective view of an essential part showing a method of attaching the light source unit to a substrate.
- FIG. 2 shows a light emitting diode comprising a junction structure of two semiconductor layers.
- FIG. 3 is a perspective view showing an example of a distance measuring device using side light of a pedestal
- (12) is a distance measuring substrate arranged substantially parallel to the base length direction in the triangular distance measuring method, and the surface of the substrate (12) has a distance measuring light receiving element.
- (8a), (8b), (8c), (8d) and the IC (14) acting as the detection device described above are fixed and electrically connected.
- (16) is a light emitting diode chip having a junction structure of two semiconductor layers (16a) and (16b), and the light emitting diode chip (16) is formed of two semiconductor layers (16a) and (16b).
- the side light emitted from the joint surface (16c) is arranged so as to be projected toward the object to be measured.
- One of the semiconductor layers (16a) of the light emitting diode chip (16) is bonded to one electrode (not shown) provided at a predetermined position on an end face of the substrate (12) by fixed bonding and electrical connection.
- the other semiconductor layer (16b) is connected to the other electrode (12a) provided in i-contact with the electrode.
- the light source acts as a light source on the end face of the substrate (12) having the light receiving element for distance measurement, that is, arranged substantially parallel to the base line length direction, that is, on the vertical surface in the base line length direction.
- the emitted light is parallel to the substrate arranged in parallel to the base line length direction as in the apparatus disclosed in FIG. 7 (b) of Japanese Patent Application Laid-Open No. 54-40662.
- a reflection member is needed to target the emitted light to the object to be measured, and the position, inclination, and other errors of the reflection member Influences the distance measurement accuracy and makes it difficult to maintain a certain distance measurement accuracy when mass-produced.
- the structure shown in Fig. 2 of the present invention is adopted as described above, that is, the light emitting diode is directly attached to the surface perpendicular to the base line length direction, the light emitting diode is obtained. Since a reflecting member for directing the light emitted from the light source to the object to be measured can be eliminated, it is possible to prevent the deterioration of the ranging accuracy due to the reflecting member as in the conventional example.
- FIG. 3 et seq. Show a preferred embodiment of the present invention.
- one of the semiconductor layers (16a) of the light emitting diode chip (16) having a junction structure of two semiconductor layers (16a) (16b) is a flat plate-shaped ⁇ 1 conductive material made of a conductive material. Die-bonded to one end of frame (20)]. Fixed and electrical connection is established.
- the other semiconductor layer (16b) of the light emitting diode chip (16) is made of a second conductive material made of a conductive material disposed close to and substantially on the same plane as the first conductive frame (20).
- An electrical connection is made to the frame (22) by wire (24).
- ⁇ . '? ⁇ Are molded by a package (26) made of a translucent material such as glass, plastic, etc.,-), and each of the first and second conductive frames (20) and (22). Only the remaining part protrudes from the package (26).
- (28) shows the side light emitted from the bonding surface (16c) of the light emitting diode chip (16), and the side light (28) is the light projected to the distance measurement target. used.
- the light emitting diode chip (16) can be attached simply by bonding to the first and second conductive frames 11 (20) and (22).
- the work can be simplified.
- the light emitting diode chip (16) and the wire (24) are molded by the transparent package (26), the light emitting diode chip (16) and the wire (24) are formed.
- FIG. 4 (a) is a partial perspective view showing a method of attaching the light source unit having the above-described configuration to a substrate).
- (12) is FIG.
- the substrate (12) is substantially fixed in the base length direction of the triangular distance measurement method, with a light receiving element for distance measurement and an IC chip fixed and electrically connected to the surface in the same manner as in the example of [1]. They are arranged in parallel.
- a concave portion (12b) into which a part of the package (26) can be fitted is formed, and on both sides of the concave portion (12b).
- a pair of electrodes (12c) and (12d) are provided.
- a part of the package (26) is fitted into the recess (12b).
- the first and second conductive frames (20) and (22) are fixed and electrically connected to the electrodes (12c) and (12d) by bonding or soldering to the substrate (12).
- Fig. 4 shows the light source attached to the board in this way.
- the light emitting diode chip (16) is fixed to the first conductive frame (20), the chip (16) and the first conductive frame (20) are fixed.
- the first conductive frame (20) is integrated with the conductive frame (20), and the first conductive frame (20) is provided with a light receiving element for distance measurement.
- FIG. 5 shows another method of attaching the light source unit shown in FIG. 3 to a substrate
- FIG. 5 (a) illustrates the method of attaching the unit.
- FIG. 5 (b) is a front view of the main part showing the mounting state.
- a substrate (12) on which a light-receiving element for distance measurement and an IC chip are arranged has an upper and lower two-layer structure, and a pair of electrodes (12c) (12d) is provided on an upper surface of a lower layer. It is provided with a concave portion (12e) into which a part of the light source package ( 26) can be fitted. Further, a cross-shaped through hole (12f) through which the entire light source unit can penetrate is formed in the upper layer.
- the package (26) is inserted into the through hole (12f), and the first and second conductive frames are inserted. (20) and (22) on the right side wall of the through hole (12f)
- the light source is inserted until it comes into contact with a pair of electrodes (12c) and (12d) provided on the upper surface of the lower layer of the substrate (12), and the first and second conductive frames (20) and (22) are transparent.
- the light source unit is in contact with the electrodes (12c) and (12d) while being in contact with the right side wall of the hole (12f),
- FIG. 5 (b) shows a state in which the light source unit is mounted on the substrate in this way.
- the light emitting diode chip (16) is fixed to the first conductive frame (20), the light emitting diode chip (16) is fixed to the first conductive frame (20).
- the tip (16) and the first conductive frame (20) are integrated! Further, the first conductive frame (20) is provided on a right side wall of a through-hole (12f) formed at a predetermined position of the substrate (12) on which the light receiving element for distance measurement is arranged. By being fixed to a surface perpendicular to the base line length direction, the relative positional relationship between the light source and the light receiving element,
- the recess (12e) formed in the lower layer of the substrate (12) is made to be a hole, and the first and second electrodes (12c) and (12d) provided in the lower layer are respectively provided.
- the conductive frames (20) and (22) may be configured to be in contact and fixed and electrically connected.
- FIG. 6 shows another embodiment of the present invention.
- FIG. 6 (a) is a front view of a light source unit of the present embodiment
- FIG. 6 (b) is a view of the light source unit. It is a principal part perspective view which shows the attachment method to a board
- the same reference numerals are given to members that operate in the same manner as those in FIGS. 3 and 4, and the description thereof is omitted.
- the two semiconductor layers (16a) and (16b) of the light emitting diode chip (16) are ... ...-— i9 is die-mounted on frames (20) and (22), so the first and second conductive frames (20) and (22) are coplanar with each other.
- Is located at FIG. 6 (b) shows a method of attaching the light source unit having such a configuration to the substrate.
- a part of the package (26) can be fitted in the end face of the substrate (12) on which the ICs are arranged.
- 3 ⁇ 4 A recess (12b) is formed, and the first and second recesses are formed on both sides of the recess (12b).
- a pair of electrodes (12c) and (12d) is provided to which the two conductive frames (20) and (22) can abut respectively. Then, the light source unit fits a part of the package (26) into the recess (12b).
- the first and second conductive frames (20) and (22) are fixed and electrically connected to the electrodes (12c) and (12d) by bonding or soldering, respectively. By connecting, it is attached to the substrate (12).
- the first and second conductive frames (20) and (22) may not be arranged on the same plane.
- the distance measuring apparatus of the present invention uses the principle of triangular ranging to receive a plurality of light beams reflected from the object to be measured from the light source toward the object to be measured.
- the surface is cut in a direction substantially perpendicular to the bonding surface due to the bonding configuration of the two semiconductor layers.
- One of the semiconductor layers of the chip is fixed and electrically read, and at least a part of the semiconductor layer is protruded from the package.
- the first conductive frame having a vertical plane formed on the light emitting surface and the other semiconductor layer of the light emitting diode chip are electrically read, At least a part of the light source unit has a second conductive frame having a plane perpendicular to the light emitting surface.
- the vertical surface of the projecting portion of the second conductive frame from the package is brought into contact with the vertical surface in the base line length direction of the substrate to which the plurality of light receiving elements are fixed.
- Both are fixed to and electrically connected to the base plate], so that the light source does not need to be wire-bonded to the substrate because it is configured to be attached to the substrate. j ?, and there is no danger of cutting the bonding wire, making it easy to handle.
- the distance measuring device of the present invention is projected toward a distance measuring object.
- the light used is narrow and intense light emitted from a surface cut in a direction substantially perpendicular to the junction surface between the two semiconductor layers, so that accurate distance measurement is possible and distance measurement is performed.
- the light source unit is attached to the surface perpendicular to the base line length direction of the substrate to which the light receiving element for light is fixed.
- the positional relationship can be easily guaranteed, and a distance measuring device with high accuracy suitable for mass production can be obtained.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Optics & Photonics (AREA)
- Measurement Of Optical Distance (AREA)
- Focusing (AREA)
- Automatic Focus Adjustment (AREA)
Abstract
Un telemetre automatique de mesure de la distance a un objet d'apres le principe de triangulation comprend une diode a emission lumineuse (16) de projection de la lumiere emise vers un objet dont la distance est a mesurer, et une pluralite d'elements de reception de lumiere (8a, 8b, 8c, 8d) etant disposee sur un substrat (12) de telle maniere que l'un d'eux puisse recevoir la lumiere reflechie provenant de l'objet. La diode a emission lumineuse (16) est electriquement connectee avec des cadres plans electriquement conducteurs (20, 22) et elle est moulee en utilisant un materiau transparent (26) de maniere a ce qu'elle forme une unite avec les cadres electriquement conducteurs. La diode a emission lumineuse (16) ainsi formee en une unite est montee sur le substrat au travers du cadre electriquement conducteur.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP79/153093 | 1979-11-26 | ||
JP15309379A JPS5675626A (en) | 1979-11-26 | 1979-11-26 | Distance measuring device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1981001610A1 true WO1981001610A1 (fr) | 1981-06-11 |
Family
ID=15554812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1980/000285 WO1981001610A1 (fr) | 1979-11-26 | 1980-11-21 | Telemetre automatique |
Country Status (3)
Country | Link |
---|---|
US (1) | US4419011A (fr) |
JP (1) | JPS5675626A (fr) |
WO (1) | WO1981001610A1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688933A (en) * | 1985-05-10 | 1987-08-25 | The Laitram Corporation | Electro-optical position determining system |
JPS622014U (fr) * | 1985-06-19 | 1987-01-08 | ||
US4939439A (en) * | 1985-09-26 | 1990-07-03 | Unisearch Limited | Robot vision and optical location systems |
GB2222047A (en) * | 1988-07-25 | 1990-02-21 | Unisearch Ltd | Optical mapping of field of view and information storage |
EP0479271B1 (fr) * | 1990-10-03 | 1998-09-09 | Aisin Seiki Kabushiki Kaisha | Système de commande de guidage latéral automatique |
US5202742A (en) * | 1990-10-03 | 1993-04-13 | Aisin Seiki Kabushiki Kaisha | Laser radar for a vehicle lateral guidance system |
US5390118A (en) * | 1990-10-03 | 1995-02-14 | Aisin Seiki Kabushiki Kaisha | Automatic lateral guidance control system |
US5298735A (en) * | 1992-10-07 | 1994-03-29 | Eastman Kodak Company | Laser diode and photodetector circuit assembly |
US5703351A (en) * | 1996-11-18 | 1997-12-30 | Eastman Kodak Company | Autofocus module having a diffractively achromatized toroidal lens |
GB9719514D0 (en) * | 1997-09-12 | 1997-11-19 | Thames Water Utilities | Non-contact measuring apparatus |
DE10118630A1 (de) * | 2001-04-12 | 2002-10-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements |
GB0223512D0 (en) * | 2002-10-10 | 2002-11-13 | Qinetiq Ltd | Bistatic laser radar apparatus |
JP5356123B2 (ja) * | 2009-06-19 | 2013-12-04 | シャープ株式会社 | 物体検出装置および電子機器 |
CN114644291B (zh) * | 2022-05-23 | 2022-08-05 | 安徽送变电工程有限公司 | 基于视觉处理的电力吊装作业用安全边界搭建装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258949A (en) * | 1975-11-11 | 1977-05-14 | Hagiwara Denki Kk | Photoelectric position detector |
JPS52110079A (en) * | 1976-03-12 | 1977-09-14 | Canon Inc | Photoelectric conversion unit |
JPS5440663A (en) * | 1977-09-06 | 1979-03-30 | Minolta Camera Co Ltd | Range finder |
JPS5440662A (en) * | 1977-09-06 | 1979-03-30 | Minolta Camera Co Ltd | Range finder |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL252939A (fr) * | 1959-10-19 | 1900-01-01 | ||
JPS50110181U (fr) * | 1974-02-20 | 1975-09-09 | ||
US3934105A (en) * | 1974-05-09 | 1976-01-20 | Amp Incorporated | Miniature switch with lighted indicator |
US3935501A (en) * | 1975-02-13 | 1976-01-27 | Digital Components Corporation | Micro-miniature light source assemblage and mounting means therefor |
US4313654A (en) * | 1977-09-06 | 1982-02-02 | Minolta Camera Kabushiki Kaisha | Automatic rangefinder system for photographic camera with light emitting and receiving means |
DE2802477C3 (de) * | 1978-01-20 | 1981-08-20 | Precitronic Gesellschaft für Feinmechanik und Electronik mbH, 2000 Hamburg | Einrichtung zum Senden und/oder Empfangen von Laserlicht mit mehreren Laserlicht emittierenden und/oder detektierenden optronischen Elementen |
-
1979
- 1979-11-26 JP JP15309379A patent/JPS5675626A/ja active Granted
-
1980
- 1980-11-21 WO PCT/JP1980/000285 patent/WO1981001610A1/fr unknown
- 1980-11-21 US US06/285,109 patent/US4419011A/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258949A (en) * | 1975-11-11 | 1977-05-14 | Hagiwara Denki Kk | Photoelectric position detector |
JPS52110079A (en) * | 1976-03-12 | 1977-09-14 | Canon Inc | Photoelectric conversion unit |
JPS5440663A (en) * | 1977-09-06 | 1979-03-30 | Minolta Camera Co Ltd | Range finder |
JPS5440662A (en) * | 1977-09-06 | 1979-03-30 | Minolta Camera Co Ltd | Range finder |
Also Published As
Publication number | Publication date |
---|---|
JPS5675626A (en) | 1981-06-22 |
JPS6313127B2 (fr) | 1988-03-24 |
US4419011A (en) | 1983-12-06 |
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