Classifications

• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
  • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
  • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
  • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
  • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
  • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
  • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
  • B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point

Definitions

• the present invention relates to a metal bond diamond sintered body which is particularly suitable for grinding lenses such as pellets or wheels. Obedience
• An object of the present invention is to solve the above-mentioned disadvantages of the nickel-based metal bonder and the ceramic sintered body.
• the present invention is to further improve these nickel-based metal bond sinters, and a part of nickel is replaced by relatively inexpensive copper. To provide a metal-bonded diamond sintered body containing at the same time soot and phosphorus.
• the metal bond holding the diamond powder has a copper content of 2 to 50 wt% and a tin of 1 to 40 wt%.
• the gist of the present invention is to select a suitable arrangement of copper, tin, and phosphorus in the nickel paste to obtain a well-known packet.
• Nickel used as pace metal in the present invention is Nickel used as pace metal in the present invention
• Nickel which is the main component of the mix, may be replaced by j collet in some cases.
• Copper forms a solid solution with nickel and facilitates precipitation of tin or intermetallic compounds of phosphorus and nickel.], 2 wt
• the elements tin and phosphorus contain copper in the matrix.
• the amount of powder added depends on the amount of intermetallic compound formed by the addition.
• the amount of cutting will decrease, and it will be difficult to sinter the matrix.
• the phosphorus is less than 0.2 wt, the variation in the cutting amount is large, and the effect of improving the cutting amount is small.
• each component is 5 to 20 copper, especially 5 to 15 wt%, soot 2 to 30 especially 5 to 15 wt%, and phosphorus 0.2 to 2 especially 0.5 to "! w ⁇ and nickel
• the above-mentioned nickel, copper, soot and phosphorus are powders having a particle size of 100 mesh or less. It is. This results in the formation of an intermetallic compound by each of the constituent elements of jP and the use of copper having a relatively low melting point as a part of nickel. ! Low-temperature sintering of up to 950 ° C is possible], which prevents the graphitization of the diamond.
• phosphorus may be added alone, it is easier to handle and uniform dispersion can be obtained by adding it as copper-lin or nickel-lin alloy powder. Stable sintering can be performed.
• the diamond powder used in the present invention is usually added in a range of 1 to 40 A in an amount of 0.1 to 10 wt. Particle size and addition amount
• ⁇ .- ⁇ are not limited to these.
• the sintered body of the present invention is formed by mixing a small amount of each component powder, diamond powder and, if desired, zinc stearate and other lubricants, and then press-molding the mixture, and then forming the mixture in a non-oxidizing atmosphere. Sintering is performed by the usual powder metallurgy method.]) Manufacturing is optimal in terms of mass productivity, but hot; Manufacturable by the resin method or the electric current sintering method
• the copper, nickel and nickel in the nickel base interact with each other to promote the sintering of the matrix. They also form intermetallic compounds, and the resulting intermetallic compounds are evenly dispersed in the matrix.
• a metal pin is formed, which is hard and wears homogeneously at an appropriate wear rate, and the pores formed during the formation of the intermetallic compound and the metal Due to the senorodo dressing effect, the cutting edge of the diamond is held and renewed effectively, and the cutting amount, especially the finish, and the cutting immediately during lap grinding are greatly improved.
• a practically very easy-to-use metal-bonded diamond sintered body can be obtained. Is great.
• Nickel powder with an average particle size of 5 mm, — 250 mesh ⁇ Using other raw material powders of ⁇ , adjust them to have the composition shown in the table, and add 1 wt. of diamond powder of 8 to 10 "to this. It is squeezed and then sintered at 800 to 900 ° G to form a metal pellet diamond with a diameter of 16 and a thickness of 5 thighs called diamond pellets.
• Samples 1 and 2 in the table were the products of the present invention, and samples 3 to ⁇ were nickel-copper metal ponds.
• Sample 7 shows a nickel-based comparative product
• Sample 8 shows a conventional copper-tin based comparative product.
• the metal-bonded diamond sintered body according to the present invention is much more excellent in cutting amount and cutting ratio than those of the conventional copper-tin alloy, and has a high nickel content.
• the cutting amount is superior and the variation in cutting amount is smaller than that of copper-based alloys.
• the metal bond sintered body according to the present invention is not limited to lens grinding, but is expected to be applied to a wide range of applications such as glass, ceramics, and metal semiconductor grinding. You can do it.

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• Chemical & Material Sciences (AREA)
• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Materials Engineering (AREA)
• Ceramic Engineering (AREA)
• Inorganic Chemistry (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Polishing Bodies And Polishing Tools (AREA)
• Powder Metallurgy (AREA)

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Publications (1)

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Family Applications (1)

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Cited By (2)

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Citations (4)

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• 1979
  • 1979-10-09 JP JP13040379A patent/JPS5655535A/ja active Granted
• 1980
  • 1980-10-08 WO PCT/JP1980/000242 patent/WO1981000981A1/ja not_active Ceased
  • 1980-10-08 US US06/269,013 patent/US4362535A/en not_active Expired - Fee Related
  • 1980-10-08 DE DE8080901971T patent/DE3070982D1/de not_active Expired
• 1981
  • 1981-04-21 EP EP80901971A patent/EP0037837B1/en not_active Expired

Patent Citations (4)

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