USRE41862E1 - Method for producing a shielding case - Google Patents

Method for producing a shielding case Download PDF

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Publication number
USRE41862E1
USRE41862E1 US12/111,943 US11194399A USRE41862E US RE41862 E1 USRE41862 E1 US RE41862E1 US 11194399 A US11194399 A US 11194399A US RE41862 E USRE41862 E US RE41862E
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Prior art keywords
shielding
casing
sealing
section
passage
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US12/111,943
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English (en)
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Bernd Tiburtius
Helmut Kahl
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means

Definitions

  • casings were usually made from metal for obvious reasons, with the onset of the spread thereof on a large scale—for example in relation to mobile telephones or cordless telephones—for cost and weight reasons there has been a change over to making them in particular from plastic material.
  • the prefabricated, in particular injection-moulded casing portions are coated with a conductive material, for example by spraying on conductive lacquer, vapour deposition with aluminium or galvanisation.
  • Such casings were initially generally provided with prefabricated seals which comprise conductive elastomer and which were fitted upon assembly.
  • DE 38 12 943 A1 shows an internally coated shielding casing of fibre-reinforced plastic material with a prefabricated seal of that kind which was inserted between a groove and a tongue.
  • the casings described therein are composed of two portions which for electrical shielding of the interior of the casing (at least in portion-wise manner) comprise elastically conductive material or are coated with same and in the assembled condition form a Faraday's cage
  • a shielding seal which comprises an electrically conductive and at the same time elastic material and which adapts to surface tolerances and irregularities so that a very high level of quality in terms of shielding the interior of the casing can be guaranteed even on a mass production scale.
  • This shielding seal is produced directly on at least one of the casing portions while an additional carrier can also be incorporated into the structure.
  • the casing can be opened for example for maintenance purposes or to replace a power source and then easily closed again while maintaining the sealing and shielding effect.
  • a material with an advantageously high shielding action is a plastic material which is filled with a high proportion of silver powder but this is relatively expensive and has only limitedly satisfactory mechanical properties
  • DE39 34 845 A1 describes the production of a shielding casing with a two-layer shielding profile by the application of an elastic but non-conductive sealing profile to a casing portion and then spraying a conductive coating on to that sealing portion. This method basically makes it possible to save on material costs but it is technologically complicated and expensive and results in seals whose mechanical and in particular electromagnetic properties cannot be completely convincing.
  • the object of the present invention is to provide a method of producing a shielding casing of the kind set forth in the opening part of this specification, which permits simple and inexpensive production of shielding casings with very good mechanical and electromagnetic properties and with a long service life.
  • the invention includes the technical teaching of forming the shielding profile section in a single application step from (at least) two different. elastically setting components which however are optimised in regard to different functions, in such a way that they are firmly and durably connected together and thus form a reliably dual-functional unit.
  • both components can be applied to the casing at a high process speed in a thickness which is adequate for an excellent sealing and shielding effect.
  • the surfaces of both components in the initial condition, that is to say before the onset of any cross-linking or hardening are brought into contact with each other, they cross-link to each other or a diffusion interface is formed, which guarantees a practically non-releasable connection between the two profile sections.
  • the profile portion or section formed from the first material primarily involves the function of filling the gap space in order in spite of mechanical play in respect of the casing portions, which is caused by production tolerances or surface irregularities, to reliably protect the interior of the casing from moisture and dust and possibly prevent relative movements between the casing portions.
  • the mechanically optimised properties of the first material it is possible for the internal space in the casing to be durably hermetically sealed off.
  • the first profile section is naturally a carrier for a section of the electromagnetic shielding and ensures the closure integrity thereof.
  • the second material used is a plastic material of the same kind as the first material, with the second material being made conductive by virtue of electrically conductive inclusions.
  • the electrically conductive inclusions added are especially particles comprising a metal or an alloy with a high level of electrical conductivity, in particular silver or a silver-bearing alloy.
  • a silver-coated powder comprising another metal (nickel, copper or the like) or non-conducting carrier particles (for example of glass).
  • the metal content is typically over 25% by mass, or to achieve very high shielding effects in relation to mobile telephones etc possibly even markedly over 50% by mass, with respect to the mass of the silicone-metal mix.
  • metal powder it is also possible in particular to use short metal fibres or metal flakes which in the plastic matrix, if their dimensions are suitably adapted to match the properties of the matrix material and the method characteristics, can advantageously form a kind of metal lattice structure This can impart to the conductive profile portion a high level of conductivity with a relatively small proportion of metal and in conjunction therewith can at the same time afford advantages in terms of relatively low hardness and brittleness.
  • a non-conductive filler in particular an inexpensive oxidic or ceramic powder (SiO 2 , silicates or the like).
  • a bonding agent or primer can be used to increase the adhesion capability thereto when applying the first and/or second material.
  • the bonding agent can be added in particular to the material; alternatively however it can be applied beforehand, for example in the course of surface treatment of the casing portions
  • the second casing portion is preferably only brought into contact with the sealing and shielding profile section after substantially total hardening or setting of the first and/or second material.
  • sealing and shielding profile section involves the use of an applicator needle/nozzle in which the first passage is surrounded by the second passage, at least over a portion of the periphery of the first passage—in the simplest case, completely. More especially, it is possible to use an applicator needle or nozzle whose first passage is of substantially circular cross-section and is concentrically surrounded by the second passage, wherein the latter is of a cross-section that is substantially in the form of a segment of a circular ring.
  • the needle shape and cross-section are so selected that the second material is applied in the profile cross-section, in an irregular thickness.
  • the second material can be applied on the inside of the casing in a larger thickness than in the portion which is towards the casing portion and/or on the outside of the casing, whereby it is possible to implement a seal which tends to be ‘softer’.
  • the shielding profile section can be constructed by simultaneous application of three strands of material in sandwich structure from a triple-passage needle insofar as two strands of material of the mechanically optimised type (‘first material’) are applied and between them a strand of elastically conductive material which produces the electromagnetic shielding effect.
  • first material two strands of material of the mechanically optimised type
  • the arrangement of the profile portion consisting of electrically conductive material in a substantially deformation-free region between two deformable layers or strands of the elastic material advantageously counteracts crack formation in the electrically conductive material, which is of significance more especially in relation to constructions in which severe deformation of the shielding element can occur when assembling the casing portions. This arrangement is also particularly resistant to corrosion.
  • a long-chain, non-crosslinking siloxane to a cross-linkable silicone rubber which hardens by the cross-linking effect, forming a gel-like state.
  • the sealing and shielding profile section formed from such a mixture is distinguished by a high level of adhesive strength on the support to which it is applied and a Shore A hardness which can be set to low values and a high possible degree of deformation.
  • Relatively soft but nonetheless mechanically sufficiently resistant EMI-shielding profile sections can be produced with materials which contain about 5% by mass of bifunctional non-crosslinked siloxane, for example (poly-) dimethylsiloxane with methyl or hydroxyl terminal groups, of a viscosity in the range of between 10 and 10 3 mPa.s.
  • a silicone resin component in the sealing material preferably a proportion of over 3% by mass of a solution of a commercially available, heat-hardening or radiation-hardening resin component.
  • the degree of deformation of an approximately U-shaped two-component sealing and shielding profile section of solid material can be (relative to the height of the unloaded profile section) 30% or more, and for certain uses preferably up to over 50%.
  • special profile cross-sectional configurations for example the adoption of a lip profile which is at the same time compressible and flexurally deformable, it is possible to additionally deliberately and specifically influence an effective degree of deformation and elastic return force of the profile section.
  • the specified method steps and possibly additional geometrical measures make it possible to reliably shieldingly seal even gaps of a width which differs considerably over the longitudinal extent thereof. This permits greater tolerances in the prefabrication of the casing portions, in such a way as to reduce costs.
  • FIG. 1 is a view showing the principle of the way in which the invention is carried into effect
  • FIGS. 2a to 2 j are diagrammatic cross-sectional views of sealing and is shielding profile sections in accordance with preferred embodiments and the applicator needles respectively used for the production thereof.
  • FIG. 1 is a diagrammatic view showing the principle of a casing bottom portion 1 and a casing cover 2 of injection-moulded plastic material for an electronic device (in practice for example a mobile telephone), which are both provided with an inside metallisation layer 1 a and 2 a respectively.
  • Formed in both casing portions 1 , 2 are screw holes 1 b and 2 b respectively.
  • the screw holes 1 b in the casing bottom portion are provided for partially self-tappingly screwing in self-tapping screws 3 while the screw holes 2 b in the cover each have a countersink for accommodating the screw head of the respective screws 3 .
  • This screw connection permits the device casing 4 to be opened and re-closed repeatedly if required.
  • FIG. 1 diagrammatically shows the way in which an arm 5 of a coordinate-controlled handling device (not shown overall as such) guides an applicator needle 6 having two concentrically extending passages or ducts 6 a, 6 b, with hose connections 7 a, 7 b for feeding two seal starting materials 8 a, 8 b which are under pressure, in the direction of the arrow A, over the edge section of the casing bottom portion 1 .
  • an approximately U-shaped sealing and shielding material strand 9 whose core 9 a comprises the first starting material 8 a and whose surface layer 9 b comprises the second starting material 8 b is distributed on to the edge section and firmly adheres there.
  • the first starting material 8 a is an unfilled silicone mixture which is set to a pasty-gel-like condition and which hardens in air and at ambient temperature while the second starting material 8 b is a silicone conductive mixture which is set to a pasty condition and which is filled with a proportion of about 50% by mass of silvered nickel particles, the matrix of the silicone conductive mixture being of substantially the same composition as the first material 8 a to which however a surface active agent is additionally added as a bonding agent or primer, in a proportion of less than 1% by mass.
  • FIGS. 2a to 2 j are cross-sectional views showing various sealing and shielding profile sections in accordance with preferred embodiments together with the applicator needles which are respectively used for the production thereof.
  • the finished profile sections are each shown with parts of the adjacent casing surfaces 1 ′ and 2 respectively, wherein reference 1 ′ (unlike the specification relating to FIG. 1 ) stands for a metal casing bottom portion while the material adopted for the cover 2 is again plastic material with a metal coating 2 a. (It will be appreciated that the invention can also be applied in relation to an entirely metal casing.)
  • the sealing and shielding profile section 91 shown in FIG. 2a comprises a non-conductive base portion 91 a and a conductive layer 91 b which covers the base portion 91 a over rather more than half the periphery thereof, and it is applied to the casing portion 1 ′ by means of an applicator needle 61 diagrammatically shown in FIG. 2b , having a first duct or passage 61 a of circular cross-section and a second duct or passage 61 b, which partially surrounds it, of a cross-section which is in the form of a segment of a circular ring.
  • the sealing and shielding profile section 92 shown in FIG. 2c comprises a non-conductive base portion 92 a and a conductive flank portion 92 b which extends around same over somewhat less than half the periphery thereof, and is applied to the casing portion 1 ′ by means of an applicator needle 62 shown in FIG. 2d , having a first duct or passage 62 a of circular cross-section and a second duct or passage 62 b which partially surrounds it, of a cross-section which is approximately in the shape of a segment of a circular ring
  • the sealing and shielding profile section 93 shown in FIG. 2c differs from that shown in FIG.
  • the profile section 93 is produced by means of an applicator needle 63 as shown in FIG. 2d , with a first duct or passage 63 a of circular cross-section and two ducts or passages 63 b, 63 c which are arranged laterally thereof and which are of a cross-section that is approximately in the form of a segment of a circular ring.
  • a non-conductive core portion 94 a is completely encased by a conductive layer 94 b whose thickness however is smaller in the gap space in the proximity to the casing portions 1 ′, 2 .
  • This profile section is formed by means of an applicator needle 64 diagrammatically shown in FIG. 2h , having a first duct or passage 64 a of circular cross-section and a second duct or passage 64 b surrounding it, of ellipsoidal cross-section.
  • the sealing and shielding profile section 95 shown in FIG. 21 2 i is of a similar (three-component) structure to that shown in FIG. 2e , but the association of material is different: provided on each side of a conductive, shielding central portion 95 a is a respective non-conductive, sealing profile portion 95 b, 95 c.
  • the profile section 95 is produced by means of an applicator needle 65 as shown in FIG. 2d , with three ducts or passages 65 a to 65 c which are arranged in side-by-side relationship and which are of approximately rectangular cross-section.
  • the invention is not limited in terms of its implementation to the preferred embodiments described hereinbefore. On the contrary, it is possible to involve a number of variants which make use of the illustrated solution even in configurations of a different nature.
  • the specification of the first material as being ‘non-conductive’ is to be understood in the broad sense as meaning that this material is of markedly lower conductivity (for example corresponding to a markedly lower level of metallic filling) than the second material.
  • the use of a plastic material on a silicone basis is not a necessary feature; it is also possible to use a neoprene or other elastically setting material which also does not necessarily have to harden at ambient temperature.
  • the geometry of the profile section to be produced and the needle and nozzle cross-sectional shape which is to be adopted in relation thereto depend on the purpose of use and the specific configuration of the shielding casing and, besides the variants diagrammatically illustrated in FIGS. 2a to 2 j, many others can also be used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Glass Compositions (AREA)
  • Cable Accessories (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Adornments (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US12/111,943 1997-03-05 1998-03-05 Method for producing a shielding case Expired - Lifetime USRE41862E1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19713524 1997-03-05
DE19713524 1997-03-05
PCT/DE1998/000682 WO1998039957A1 (de) 1997-03-05 1998-03-05 Verfahren zur herstellung eines abschirmgehäuses

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USRE41862E1 true USRE41862E1 (en) 2010-10-26

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US12/111,943 Expired - Lifetime USRE41862E1 (en) 1997-03-05 1998-03-05 Method for producing a shielding case
US09/380,691 Ceased US6312550B1 (en) 1997-03-05 1998-03-05 Method for producing a shielding case

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US (2) USRE41862E1 (zh)
EP (2) EP1111981A1 (zh)
JP (1) JP2001504280A (zh)
KR (1) KR100362827B1 (zh)
CN (1) CN1143610C (zh)
AT (1) ATE319284T1 (zh)
AU (1) AU732032B2 (zh)
CA (1) CA2283867A1 (zh)
DE (3) DE59813417D1 (zh)
DK (1) DK0965255T3 (zh)
HK (1) HK1026806A1 (zh)
HU (1) HUP0004103A3 (zh)
NO (1) NO323017B1 (zh)
RU (1) RU2192717C2 (zh)
TR (1) TR199902208T2 (zh)
WO (1) WO1998039957A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3287330B2 (ja) 1999-04-22 2002-06-04 日本電気株式会社 高周波回路のシールド構造
DE10135038A1 (de) * 2001-07-18 2003-02-06 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung
US6784363B2 (en) 2001-10-02 2004-08-31 Parker-Hannifin Corporation EMI shielding gasket construction
US6902639B1 (en) 2002-01-26 2005-06-07 Reynolds Metals Company Seaming plastic film using solvent-based adhesive bead
US7794147B2 (en) * 2006-08-25 2010-09-14 Reynolds Packaging Llc Multiple applications of seaming solutions for heat shrunk bands and labels
CA2663148A1 (en) * 2006-09-11 2008-03-20 3M Innovative Properties Company Densified conductive materials and articles made from same
JP5176979B2 (ja) * 2009-01-22 2013-04-03 セイコーエプソン株式会社 弾性表面波装置およびその製造方法
DE102010036919A1 (de) 2010-08-09 2012-02-09 Aksys Gmbh Elektrisch leitfähige Dichtung
DE102013213233A1 (de) * 2013-07-05 2015-01-08 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Herstellen eines Gehäuses mit einer Schirmung vor elektrischer und/oder magnetischer Strahlung und Gehäuse mit Schirmung vor elektrischer und/oder magnetischer Strahlung
US10064317B1 (en) * 2015-10-27 2018-08-28 Anritsu Company High isolation shield gasket and method of providing a high isolation shield gasket
DE102017123653B4 (de) 2017-10-11 2022-04-28 Schaeffler Technologies AG & Co. KG Temperierbares Dichtungselement und Dichtungsanordnung mit diesem
CN109759780B (zh) * 2017-11-10 2022-03-22 深圳市欢太科技有限公司 制备中框的方法、中框及移动终端
CN113993633B (zh) 2019-05-10 2023-11-14 Atn霍尔泽尔有限公司 用于连续地按顺序施加两种或更多种粘性的材料的方法以及施加器
KR102228724B1 (ko) * 2019-10-15 2021-03-18 한국전력공사 틈새 매움 부재가 구비된 공가 봉인 밴드
US11017820B1 (en) * 2020-02-21 2021-05-25 Seagate Technology Llc Electromagnetic shielding for electronic devices
US11276436B1 (en) 2021-01-05 2022-03-15 Seagate Technology Llc Corrosive gas reduction for electronic devices

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098633A (en) 1977-01-24 1978-07-04 The United States Of America As Represented By The Secretary Of The Navy Method of making radiation seal
JPS60132171A (ja) 1983-12-19 1985-07-15 Nissan Motor Co Ltd 液体ガスケツトの塗布方法
GB2192354A (en) 1986-07-11 1988-01-13 Advanced Adhesives Ltd Dispenser for two-part adhesive
GB2217304A (en) 1988-04-19 1989-10-25 Gerd Dieter Maibach Container of fibre-reinforced plastics material with a current-conduction inner layer
DE3934845A1 (de) 1988-10-28 1990-05-03 Kitagawa Ind Co Ltd Leitfaehige dichtung
US4968854A (en) 1988-11-10 1990-11-06 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
US4977295A (en) 1989-07-28 1990-12-11 Raytheon Company Gasket impervious to electromagnetic energy
US5053924A (en) 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
GB2261324A (en) 1991-11-06 1993-05-12 Nokia Mobile Phones Ltd RF shielding arrangements
EP0629114A1 (de) 1993-06-14 1994-12-14 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
DE4319965A1 (de) 1993-06-14 1994-12-15 Emi Tec Elektronische Material Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses
EP0654962A1 (de) 1993-11-22 1995-05-24 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Abschirmelement und Verfahren zu dessen Herstellung
US5447761A (en) 1991-04-19 1995-09-05 Lafond; Luc Sealant strip incorporating flexing stress alleviating means
US5571991A (en) 1992-01-02 1996-11-05 International Business Machines Corporation Electro-magnetic shielding structure having surface layers connected to each other at edges
WO1997026782A2 (de) 1996-01-19 1997-07-24 Bernd Tiburtius Elektrisch abschirmendes gehäuse
DE19733627C1 (de) 1997-07-29 1998-06-18 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung und Verfahren zu deren Herstellung
US6096413A (en) 1993-09-10 2000-08-01 Chomerics, Inc. Form-in-place EMI gaskets
WO2001071223A2 (en) 2000-03-24 2001-09-27 Chemque, Inc. Gasket, method of manufacturing and apparatus for manufacturing same
DE10046557A1 (de) 2000-09-19 2002-04-04 Datron Electronic Gmbh Vorrichtung zum dosierten Ausbringen eines aus mehreren unterschiedlich viskosen Medien bestehenden Materialstranges mittels Koextrusion und mehrfunktionale Kombinationsdichtung
US6670545B2 (en) 1999-10-20 2003-12-30 Chemque, Inc. Conductive coating on a non-conductive flexible substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149399A (ja) † 1984-12-25 1986-07-08 Konishiroku Photo Ind Co Ltd 印刷用原版

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098633A (en) 1977-01-24 1978-07-04 The United States Of America As Represented By The Secretary Of The Navy Method of making radiation seal
JPS60132171A (ja) 1983-12-19 1985-07-15 Nissan Motor Co Ltd 液体ガスケツトの塗布方法
GB2192354A (en) 1986-07-11 1988-01-13 Advanced Adhesives Ltd Dispenser for two-part adhesive
GB2217304A (en) 1988-04-19 1989-10-25 Gerd Dieter Maibach Container of fibre-reinforced plastics material with a current-conduction inner layer
DE3812943A1 (de) 1988-04-19 1989-11-02 Maibach Fa Gerd D Behaelter aus faserverstaerktem kunststoff mit stromleitender innenschicht
DE3934845A1 (de) 1988-10-28 1990-05-03 Kitagawa Ind Co Ltd Leitfaehige dichtung
GB2224604A (en) 1988-10-28 1990-05-09 Kitagawa Ind Co Ltd A conductive seal
US4968854A (en) 1988-11-10 1990-11-06 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
EP0399028B1 (en) 1988-11-10 1998-02-18 Vanguard Products Corporation Dual elastomer gasket shield for electronic equipment
US4977295A (en) 1989-07-28 1990-12-11 Raytheon Company Gasket impervious to electromagnetic energy
EP0410701A2 (en) 1989-07-28 1991-01-30 Raytheon Company Gasket impervious to electromagnetic energy
HU210445B (en) 1990-03-30 1995-04-28 Motorola Inc Electromagnetic shield for electronic circuits formed on printed circuit card
WO1991015939A1 (en) 1990-03-30 1991-10-17 Motorola, Inc. Electromagnetic shield for electrical circuit
US5053924A (en) 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5447761A (en) 1991-04-19 1995-09-05 Lafond; Luc Sealant strip incorporating flexing stress alleviating means
GB2261324A (en) 1991-11-06 1993-05-12 Nokia Mobile Phones Ltd RF shielding arrangements
US5571991A (en) 1992-01-02 1996-11-05 International Business Machines Corporation Electro-magnetic shielding structure having surface layers connected to each other at edges
US5882729A (en) 1993-06-14 1999-03-16 Emi-Tec Elektronische Materialien, Gmbh Process for producing a casing providing a screen against electromagnetic radiation
EP0629114A1 (de) 1993-06-14 1994-12-14 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
DE4319965A1 (de) 1993-06-14 1994-12-15 Emi Tec Elektronische Material Verfahren zur Herstellung eines eine Abschirmung gegen elektromagnetische Abstrahlung aufweisenden Gehäuses
CA2125742A1 (en) 1993-06-14 1994-12-15 Helmut Kahl Process for Producing a Casing Providing a Screen Against Electromagnetic Radiation
EP0629114B1 (de) 1993-06-14 1996-11-20 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
US6096413A (en) 1993-09-10 2000-08-01 Chomerics, Inc. Form-in-place EMI gaskets
EP0654962A1 (de) 1993-11-22 1995-05-24 EMI-TEC, ELEKTRONISCHE MATERIALIEN GmbH Abschirmelement und Verfahren zu dessen Herstellung
US5731541A (en) 1993-11-22 1998-03-24 Emi-Tec Elektronische Materialien Gmbh Screening element and process for producing it
WO1997026782A2 (de) 1996-01-19 1997-07-24 Bernd Tiburtius Elektrisch abschirmendes gehäuse
US6323418B1 (en) 1996-01-19 2001-11-27 Bernd Tiburtius Electrically screening housing
DE19733627C1 (de) 1997-07-29 1998-06-18 Neuhaus Elektronik Gmbh Elektrisch leitfähige Dichtung und Verfahren zu deren Herstellung
US6254107B1 (en) 1997-07-29 2001-07-03 Neuhaus Elektronik Gmbh Electrically conductive seal and a process for the manufacture thereof
US6670545B2 (en) 1999-10-20 2003-12-30 Chemque, Inc. Conductive coating on a non-conductive flexible substrate
WO2001071223A2 (en) 2000-03-24 2001-09-27 Chemque, Inc. Gasket, method of manufacturing and apparatus for manufacturing same
DE10046557A1 (de) 2000-09-19 2002-04-04 Datron Electronic Gmbh Vorrichtung zum dosierten Ausbringen eines aus mehreren unterschiedlich viskosen Medien bestehenden Materialstranges mittels Koextrusion und mehrfunktionale Kombinationsdichtung

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US6312550B1 (en) 2001-11-06
AU7204498A (en) 1998-09-22
NO994289L (no) 1999-11-04
HUP0004103A3 (en) 2002-05-28
HK1026806A1 (en) 2000-12-22
DE59813417D1 (de) 2006-04-27
HUP0004103A1 (en) 2001-03-28
NO323017B1 (no) 2006-12-27
RU2192717C2 (ru) 2002-11-10
DE29824567U1 (de) 2001-08-16
NO994289D0 (no) 1999-09-03
AU732032B2 (en) 2001-04-12
CA2283867A1 (en) 1998-09-11
KR100362827B1 (ko) 2002-12-11
EP1111981A1 (de) 2001-06-27
EP0965255B2 (de) 2010-10-20
DK0965255T3 (da) 2006-04-10
WO1998039957A1 (de) 1998-09-11
CN1143610C (zh) 2004-03-24
KR20000076009A (ko) 2000-12-26
DE19880257D2 (de) 1999-09-02
DE19880257B4 (de) 2010-12-23
JP2001504280A (ja) 2001-03-27
ATE319284T1 (de) 2006-03-15
CN1251254A (zh) 2000-04-19
EP0965255A1 (de) 1999-12-22
TR199902208T2 (xx) 2000-06-21
EP0965255B1 (de) 2006-03-01

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