USD993201S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD993201S1
USD993201S1 US29/806,373 US202129806373F USD993201S US D993201 S1 USD993201 S1 US D993201S1 US 202129806373 F US202129806373 F US 202129806373F US D993201 S USD993201 S US D993201S
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Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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US29/806,373
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English (en)
Inventor
Koshun SAITO
Kota ISE
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ISE, KOTA, SAITO, KOSHUN
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US29/806,373 2021-03-09 2021-09-02 Semiconductor module Active USD993201S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2021-4834F JP1695980S (enrdf_load_stackoverflow) 2021-03-09 2021-03-09
JP2021-004834D 2021-03-09

Publications (1)

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USD993201S1 true USD993201S1 (en) 2023-07-25

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US (1) USD993201S1 (enrdf_load_stackoverflow)
JP (1) JP1695980S (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1577511S (enrdf_load_stackoverflow) 2016-11-15 2017-05-29
JP1580899S (enrdf_load_stackoverflow) 2016-11-15 2017-07-10
US10068871B2 (en) * 2016-04-12 2018-09-04 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
US20190333885A1 (en) * 2016-05-02 2019-10-31 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
US20200365497A1 (en) * 2019-05-13 2020-11-19 Rohm Co., Ltd. Semiconductor device
US10930615B2 (en) * 2018-05-10 2021-02-23 Rohm Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US10985030B2 (en) * 2018-11-19 2021-04-20 Rohm Co., Ltd Method for manufacturing semiconductor device
US11257777B2 (en) * 2018-11-07 2022-02-22 Rohm Co., Ltd. Semiconductor device
US11373935B2 (en) * 2016-02-15 2022-06-28 Rohm Co., Ltd. Semiconductor package with plurality of leads and sealing resin
US11417623B2 (en) * 2019-03-29 2022-08-16 Rohm Co., Ltd. Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11373935B2 (en) * 2016-02-15 2022-06-28 Rohm Co., Ltd. Semiconductor package with plurality of leads and sealing resin
US10068871B2 (en) * 2016-04-12 2018-09-04 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
US20190333885A1 (en) * 2016-05-02 2019-10-31 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
JP1580899S (enrdf_load_stackoverflow) 2016-11-15 2017-07-10
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
JP1577511S (enrdf_load_stackoverflow) 2016-11-15 2017-05-29
US10930615B2 (en) * 2018-05-10 2021-02-23 Rohm Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US11257777B2 (en) * 2018-11-07 2022-02-22 Rohm Co., Ltd. Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
US10985030B2 (en) * 2018-11-19 2021-04-20 Rohm Co., Ltd Method for manufacturing semiconductor device
US11417623B2 (en) * 2019-03-29 2022-08-16 Rohm Co., Ltd. Semiconductor chip and semiconductor device including a copper pillar and an intermediate layer
US20200365497A1 (en) * 2019-05-13 2020-11-19 Rohm Co., Ltd. Semiconductor device
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Rohm semiconductor UT6MA3, dated Sep. 18, 2015, [online], [site visited Mar. 23, 2023]. Available from Internet, URL: https://fscdn.rohm.com/en/products/databook/datasheet/discrete/transistor/mosfet/ut6ma3tcr-e.pdf (Year: 2015). *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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