USD974311S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD974311S1
USD974311S1 US29/765,197 US202129765197F USD974311S US D974311 S1 USD974311 S1 US D974311S1 US 202129765197 F US202129765197 F US 202129765197F US D974311 S USD974311 S US D974311S
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semiconductor module
view
design
semiconductor
module
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US29/765,197
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English (en)
Inventor
Okimoto KONDO
Yusuke NAKAKOHARA
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONDO, OKIMOTO, NAKAKOHARA, Yusuke
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US29/765,197 2020-07-31 2021-01-06 Semiconductor module Active USD974311S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2020-15961F JP1682283S (enrdf_load_stackoverflow) 2020-07-31 2020-07-31
JP2020-015961D 2020-07-31

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USD974311S1 true USD974311S1 (en) 2023-01-03

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JP (1) JP1682283S (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD990439S1 (en) * 2021-04-09 2023-06-27 Rohm Co., Ltd. Semiconductor module
USD992519S1 (en) * 2021-04-09 2023-07-18 Rohm Co., Ltd. Semiconductor module
USD1036385S1 (en) * 2021-09-17 2024-07-23 Coilcraft, Incorporated Electronic component
USD1036384S1 (en) 2021-09-17 2024-07-23 Coilcraft, Incorporated Electronic component
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil

Citations (25)

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JP1563907S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563809S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563811S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563908S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563910S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD853341S1 (en) * 2015-04-01 2019-07-09 Infineon Technologies Ag Semiconductor module
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
JP1692093S (enrdf_load_stackoverflow) * 2020-07-31 2021-08-10
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子
US20220190556A1 (en) * 2019-04-26 2022-06-16 Rohm Co., Ltd. Semiconductor light emitting device
US20220231003A1 (en) * 2021-01-15 2022-07-21 Rohm Co., Ltd. Semiconductor light-emitting device

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD853341S1 (en) * 2015-04-01 2019-07-09 Infineon Technologies Ag Semiconductor module
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
JP1563809S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563811S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563908S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563910S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
JP1563907S (enrdf_load_stackoverflow) 2016-03-24 2016-11-21
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD903611S1 (en) * 2019-03-29 2020-12-01 Mitsubishi Electric Corporation Semiconductor device
US20220190556A1 (en) * 2019-04-26 2022-06-16 Rohm Co., Ltd. Semiconductor light emitting device
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
JP1692093S (enrdf_load_stackoverflow) * 2020-07-31 2021-08-10
US20220231003A1 (en) * 2021-01-15 2022-07-21 Rohm Co., Ltd. Semiconductor light-emitting device
JP1711446S (ja) * 2021-10-13 2022-03-31 半導体素子

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
AP power, Announced on Sep. 30, 2020 [online], retrieved on Sep. 6, 2022, retrieved from internet, https://web.archive.org/web/20200930054949/https://www.xppower.com/resources/press-releases/high-voltage-dc-dc-power-module-for-scientific-and-semiconductor-applications. *
DigiKey, No Announcement Date [online], retrieved on Sep. 6, 2022, retrieved from internet, https://www.xppower.com/resources/press-releases/high-voltage-dc-dc-power-module-for-scientific-and-semiconductor-applications. *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1082727S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD1082726S1 (en) * 2020-12-02 2025-07-08 Murata Manufacturing Co., Ltd. Common mode choke coil
USD990439S1 (en) * 2021-04-09 2023-06-27 Rohm Co., Ltd. Semiconductor module
USD992519S1 (en) * 2021-04-09 2023-07-18 Rohm Co., Ltd. Semiconductor module
USD1036385S1 (en) * 2021-09-17 2024-07-23 Coilcraft, Incorporated Electronic component
USD1036384S1 (en) 2021-09-17 2024-07-23 Coilcraft, Incorporated Electronic component

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