USD1036385S1 - Electronic component - Google Patents
Electronic component Download PDFInfo
- Publication number
- USD1036385S1 USD1036385S1 US29/808,325 US202129808325F USD1036385S US D1036385 S1 USD1036385 S1 US D1036385S1 US 202129808325 F US202129808325 F US 202129808325F US D1036385 S USD1036385 S US D1036385S
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- US
- United States
- Prior art keywords
- electronic component
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- side elevation
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in the drawings illustrate portions of the electronic component that form no part of the claimed design.
Claims (1)
- We claim the ornamental design for an electronic component, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/808,325 USD1036385S1 (en) | 2021-09-17 | 2021-09-17 | Electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/808,325 USD1036385S1 (en) | 2021-09-17 | 2021-09-17 | Electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1036385S1 true USD1036385S1 (en) | 2024-07-23 |
Family
ID=91933933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/808,325 Active USD1036385S1 (en) | 2021-09-17 | 2021-09-17 | Electronic component |
Country Status (1)
Country | Link |
---|---|
US (1) | USD1036385S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1098025S1 (en) * | 2023-12-22 | 2025-10-14 | Molex, Llc | Connector |
Citations (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD357227S (en) * | 1993-09-24 | 1995-04-11 | Thermalloy, Inc. | Spring clip for retaining thermal contact between an electronic device package and a heat sink |
US20030201863A1 (en) | 2002-04-29 | 2003-10-30 | Yu-Lin Chung | Transformer structure |
US20040124950A1 (en) | 2001-04-30 | 2004-07-01 | Han-Cheng Hsu | Filtering induction device |
US20050236236A1 (en) * | 2004-04-26 | 2005-10-27 | Muhammad Farooq | Pad retaining clips |
US20050269589A1 (en) * | 2004-06-04 | 2005-12-08 | Lite-On It Technology Corporation | Power LED package module |
USD522849S1 (en) * | 2005-02-08 | 2006-06-13 | Flex Technologies, Inc. | Retaining clip |
USD528515S1 (en) * | 2003-09-09 | 2006-09-19 | Nichia Corporation | Light emitting diode |
USD587221S1 (en) * | 2006-08-04 | 2009-02-24 | Nichia Corporation | Light emitting diode |
US20090142145A1 (en) * | 2006-05-10 | 2009-06-04 | Christopher Martin | Clip-on connector to geogrid for segmental block reinforced soil retaining wall mechanical connection system |
USD624886S1 (en) * | 2010-01-11 | 2010-10-05 | Everlight Electronics Co., Ltd. | Light emitting diode package |
US20110005064A1 (en) | 2006-08-09 | 2011-01-13 | Coilcraft, Incorporated | Method of manufacturing an electronic component |
USD632267S1 (en) * | 2010-02-12 | 2011-02-08 | Lextar Electronics Corp. | Light emitting diode packaging carrier |
USD659654S1 (en) * | 2011-01-05 | 2012-05-15 | Harvatek Corporation | LED package base |
US20120176214A1 (en) | 2011-01-07 | 2012-07-12 | Wurth Electronics Midcom Inc. | Flatwire planar transformer |
USD668233S1 (en) * | 2011-10-24 | 2012-10-02 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
US20140335714A1 (en) * | 2011-12-22 | 2014-11-13 | Phoenix Contact Gmbh & Co. Kg | Electrical Connector |
US20150069901A1 (en) * | 2012-01-27 | 2015-03-12 | Cemm Mex, S.A. De C.V. | Module for an led lamp |
US20160148741A1 (en) | 2014-11-21 | 2016-05-26 | Toko, Inc. | Surface-mount inductor and a method for manufacturing the same |
US20180122552A1 (en) | 2015-04-23 | 2018-05-03 | Hitachi Metals, Ltd. | Surface-mounted reactor and manufacturing method therefor |
USD818442S1 (en) * | 2016-07-28 | 2018-05-22 | Panasonic Intellectual Property Management Co., Ltd. | Thermoelectric conversion module |
CN108987066A (en) | 2018-07-24 | 2018-12-11 | 深圳市伊戈尔沐磁科技有限公司 | A kind of vertical winding type flat transformer |
US20200411223A1 (en) | 2019-06-28 | 2020-12-31 | Murata Manufacturing Co., Ltd. | Inductor |
WO2021213801A1 (en) | 2020-04-21 | 2021-10-28 | Tdk Electronics Ag | Coil and method for producing the coil |
USD951203S1 (en) * | 2020-02-25 | 2022-05-10 | Ls Mtron Ltd. | Connector |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
US11658275B2 (en) * | 2019-10-28 | 2023-05-23 | Seoul Viosys Co., Ltd. | Light emitting device for display and LED display apparatus having the same |
US20230230753A1 (en) * | 2022-01-14 | 2023-07-20 | Coilcraft, Incorporated | Electronic component and methods relating to same |
-
2021
- 2021-09-17 US US29/808,325 patent/USD1036385S1/en active Active
Patent Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD357227S (en) * | 1993-09-24 | 1995-04-11 | Thermalloy, Inc. | Spring clip for retaining thermal contact between an electronic device package and a heat sink |
US20040124950A1 (en) | 2001-04-30 | 2004-07-01 | Han-Cheng Hsu | Filtering induction device |
US20030201863A1 (en) | 2002-04-29 | 2003-10-30 | Yu-Lin Chung | Transformer structure |
USD528515S1 (en) * | 2003-09-09 | 2006-09-19 | Nichia Corporation | Light emitting diode |
US20050236236A1 (en) * | 2004-04-26 | 2005-10-27 | Muhammad Farooq | Pad retaining clips |
US20050269589A1 (en) * | 2004-06-04 | 2005-12-08 | Lite-On It Technology Corporation | Power LED package module |
USD522849S1 (en) * | 2005-02-08 | 2006-06-13 | Flex Technologies, Inc. | Retaining clip |
US20090142145A1 (en) * | 2006-05-10 | 2009-06-04 | Christopher Martin | Clip-on connector to geogrid for segmental block reinforced soil retaining wall mechanical connection system |
USD587221S1 (en) * | 2006-08-04 | 2009-02-24 | Nichia Corporation | Light emitting diode |
US20190287707A1 (en) | 2006-08-09 | 2019-09-19 | Coilcraft, Incorporated | Method of manufacturing an electronic component |
US20110005064A1 (en) | 2006-08-09 | 2011-01-13 | Coilcraft, Incorporated | Method of manufacturing an electronic component |
USD624886S1 (en) * | 2010-01-11 | 2010-10-05 | Everlight Electronics Co., Ltd. | Light emitting diode package |
USD632267S1 (en) * | 2010-02-12 | 2011-02-08 | Lextar Electronics Corp. | Light emitting diode packaging carrier |
USD659654S1 (en) * | 2011-01-05 | 2012-05-15 | Harvatek Corporation | LED package base |
US20120176214A1 (en) | 2011-01-07 | 2012-07-12 | Wurth Electronics Midcom Inc. | Flatwire planar transformer |
USD668233S1 (en) * | 2011-10-24 | 2012-10-02 | Silitek Electronic (Guangzhou) Co., Ltd. | LED package |
US20140335714A1 (en) * | 2011-12-22 | 2014-11-13 | Phoenix Contact Gmbh & Co. Kg | Electrical Connector |
US20150069901A1 (en) * | 2012-01-27 | 2015-03-12 | Cemm Mex, S.A. De C.V. | Module for an led lamp |
US20160148741A1 (en) | 2014-11-21 | 2016-05-26 | Toko, Inc. | Surface-mount inductor and a method for manufacturing the same |
US20180122552A1 (en) | 2015-04-23 | 2018-05-03 | Hitachi Metals, Ltd. | Surface-mounted reactor and manufacturing method therefor |
USD818442S1 (en) * | 2016-07-28 | 2018-05-22 | Panasonic Intellectual Property Management Co., Ltd. | Thermoelectric conversion module |
CN108987066A (en) | 2018-07-24 | 2018-12-11 | 深圳市伊戈尔沐磁科技有限公司 | A kind of vertical winding type flat transformer |
US20200411223A1 (en) | 2019-06-28 | 2020-12-31 | Murata Manufacturing Co., Ltd. | Inductor |
US11658275B2 (en) * | 2019-10-28 | 2023-05-23 | Seoul Viosys Co., Ltd. | Light emitting device for display and LED display apparatus having the same |
USD951203S1 (en) * | 2020-02-25 | 2022-05-10 | Ls Mtron Ltd. | Connector |
WO2021213801A1 (en) | 2020-04-21 | 2021-10-28 | Tdk Electronics Ag | Coil and method for producing the coil |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
US20230230753A1 (en) * | 2022-01-14 | 2023-07-20 | Coilcraft, Incorporated | Electronic component and methods relating to same |
Non-Patent Citations (2)
Title |
---|
Patent Cooperation Treaty, International Searching Authority, Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, issued in International Application No. PCT/US2023/010809, May 12, 2023, 11 pp. |
Patent Cooperation Treaty, International Searching Authority, Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, issued in International Application No. PCT/US2023/010816, May 15, 2023, 9 pp. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1098025S1 (en) * | 2023-12-22 | 2025-10-14 | Molex, Llc | Connector |
USD1098023S1 (en) | 2023-12-22 | 2025-10-14 | Molex, Llc | Connector |
USD1098024S1 (en) * | 2023-12-22 | 2025-10-14 | Molex, Llc | Connector |
USD1098022S1 (en) | 2023-12-22 | 2025-10-14 | Molex, Llc | Connector |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |