USD904991S1 - Semiconductor element - Google Patents
Semiconductor element Download PDFInfo
- Publication number
- USD904991S1 USD904991S1 US29/705,412 US201929705412F USD904991S US D904991 S1 USD904991 S1 US D904991S1 US 201929705412 F US201929705412 F US 201929705412F US D904991 S USD904991 S US D904991S
- Authority
- US
- United States
- Prior art keywords
- semiconductor element
- view
- design
- dash
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The dash-dash broken line portions of the semiconductor element in FIGS. 1-7 represent unclaimed portions of the claimed design and form no part thereof. The dot-dash broken lines at the left sides of the cables in FIG. 1 represent the boundary of the claimed design and form no part thereof.
Claims (1)
- The ornamental design for a semiconductor element, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-5629F JP1643025S (en) | 2019-03-15 | 2019-03-15 | |
JP2019-005629 | 2019-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD904991S1 true USD904991S1 (en) | 2020-12-15 |
Family
ID=68095649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/705,412 Active USD904991S1 (en) | 2019-03-15 | 2019-09-11 | Semiconductor element |
Country Status (2)
Country | Link |
---|---|
US (1) | USD904991S1 (en) |
JP (1) | JP1643025S (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD401567S (en) * | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
US20080142948A1 (en) * | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
US20160190915A1 (en) * | 2014-12-24 | 2016-06-30 | Hitachi Power Semiconductor Device, Ltd. | Semiconductor power module and power conversion apparatus using the same |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
US9418975B1 (en) * | 2015-03-24 | 2016-08-16 | Mitsubishi Electric Corporation | Semiconductor module, power conversion device, and method for manufacturing semiconductor module |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD884662S1 (en) * | 2018-06-01 | 2020-05-19 | Fuji Electric Co., Ltd. | Semiconductor module |
-
2019
- 2019-03-15 JP JPD2019-5629F patent/JP1643025S/ja active Active
- 2019-09-11 US US29/705,412 patent/USD904991S1/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD401567S (en) * | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US20080142948A1 (en) * | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
US20160190915A1 (en) * | 2014-12-24 | 2016-06-30 | Hitachi Power Semiconductor Device, Ltd. | Semiconductor power module and power conversion apparatus using the same |
USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
US9418975B1 (en) * | 2015-03-24 | 2016-08-16 | Mitsubishi Electric Corporation | Semiconductor module, power conversion device, and method for manufacturing semiconductor module |
USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
USD884662S1 (en) * | 2018-06-01 | 2020-05-19 | Fuji Electric Co., Ltd. | Semiconductor module |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD923591S1 (en) * | 2019-03-15 | 2021-06-29 | Tamura Corporation | Semiconductor driving circuit module |
USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JP1643025S (en) | 2019-10-07 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |