USD904991S1 - Semiconductor element - Google Patents

Semiconductor element Download PDF

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Publication number
USD904991S1
USD904991S1 US29/705,412 US201929705412F USD904991S US D904991 S1 USD904991 S1 US D904991S1 US 201929705412 F US201929705412 F US 201929705412F US D904991 S USD904991 S US D904991S
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US
United States
Prior art keywords
semiconductor element
view
design
dash
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/705,412
Inventor
Hirotoshi Aoki
Kiyotaka Yoshida
Tomohiko YOSHINO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Assigned to TAMURA CORPORATION reassignment TAMURA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YOSHIDA, KIYOTAKA, AOKI, HIROTOSHI, YOSHINO, TOMOHIKO
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FIG. 1 is a perspective view of a semiconductor element showing our new design;
FIG. 2 is a front view of the semiconductor element of FIG. 1;
FIG. 3 is a rear view of the semiconductor element of FIG. 1;
FIG. 4 is a left side view of the semiconductor element of FIG. 1;
FIG. 5 is a right side view of the semiconductor element of FIG. 1;
FIG. 6 is a top view of the semiconductor element of FIG. 1; and,
FIG. 7 is a bottom view of the semiconductor element of FIG. 1.
The dash-dash broken line portions of the semiconductor element in FIGS. 1-7 represent unclaimed portions of the claimed design and form no part thereof. The dot-dash broken lines at the left sides of the cables in FIG. 1 represent the boundary of the claimed design and form no part thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor element, as shown and described.
US29/705,412 2019-03-15 2019-09-11 Semiconductor element Active USD904991S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-5629F JP1643025S (en) 2019-03-15 2019-03-15
JP2019-005629 2019-03-15

Publications (1)

Publication Number Publication Date
USD904991S1 true USD904991S1 (en) 2020-12-15

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ID=68095649

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/705,412 Active USD904991S1 (en) 2019-03-15 2019-09-11 Semiconductor element

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US (1) USD904991S1 (en)
JP (1) JP1643025S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US20080142948A1 (en) * 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US20160190915A1 (en) * 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD401567S (en) * 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
USD441726S1 (en) * 1999-07-14 2001-05-08 Kabushiki Kaisha Toyoda Jidoshokki Seisakusho Semiconductor element
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US20080142948A1 (en) * 2006-12-15 2008-06-19 Mitsubishi Electric Corporation Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
US20160190915A1 (en) * 2014-12-24 2016-06-30 Hitachi Power Semiconductor Device, Ltd. Semiconductor power module and power conversion apparatus using the same
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
US9418975B1 (en) * 2015-03-24 2016-08-16 Mitsubishi Electric Corporation Semiconductor module, power conversion device, and method for manufacturing semiconductor module
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD920937S1 (en) * 2019-03-29 2021-06-01 Shindengen Electric Manufacturing Co., Ltd. Power module device containing semiconductor elements
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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