JP1643025S - - Google Patents
Info
- Publication number
- JP1643025S JP1643025S JPD2019-5629F JP2019005629F JP1643025S JP 1643025 S JP1643025 S JP 1643025S JP 2019005629 F JP2019005629 F JP 2019005629F JP 1643025 S JP1643025 S JP 1643025S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-5629F JP1643025S (en) | 2019-03-15 | 2019-03-15 | |
| US29/705,412 USD904991S1 (en) | 2019-03-15 | 2019-09-11 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-5629F JP1643025S (en) | 2019-03-15 | 2019-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1643025S true JP1643025S (en) | 2019-10-07 |
Family
ID=68095649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-5629F Active JP1643025S (en) | 2019-03-15 | 2019-03-15 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD904991S1 (en) |
| JP (1) | JP1643025S (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1643024S (en) * | 2019-03-15 | 2019-10-07 | ||
| USD920937S1 (en) * | 2019-03-29 | 2021-06-01 | Shindengen Electric Manufacturing Co., Ltd. | Power module device containing semiconductor elements |
| JP1680788S (en) * | 2020-07-31 | 2021-03-08 | ||
| JP1682283S (en) * | 2020-07-31 | 2021-03-29 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
| USD401567S (en) * | 1997-04-25 | 1998-11-24 | Micron Technology, Inc. | Temporary package for semiconductor dice |
| EP0884781A3 (en) * | 1997-06-12 | 1999-06-30 | Hitachi, Ltd. | Power semiconductor module |
| USD441726S1 (en) * | 1999-07-14 | 2001-05-08 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Semiconductor element |
| USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
| JP5041798B2 (en) * | 2006-12-15 | 2012-10-03 | 三菱電機株式会社 | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
| USD762185S1 (en) * | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
| JP6382097B2 (en) * | 2014-12-24 | 2018-08-29 | 株式会社 日立パワーデバイス | Semiconductor power module and power converter using the same |
| USD748595S1 (en) * | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
| JP6362560B2 (en) * | 2015-03-24 | 2018-07-25 | 三菱電機株式会社 | Semiconductor module, power conversion device, and method of manufacturing semiconductor module |
| USD824866S1 (en) * | 2016-09-30 | 2018-08-07 | Rohm Co., Ltd. | Semiconductor device |
| JP1632173S (en) * | 2018-06-01 | 2019-05-27 |
-
2019
- 2019-03-15 JP JPD2019-5629F patent/JP1643025S/ja active Active
- 2019-09-11 US US29/705,412 patent/USD904991S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD904991S1 (en) | 2020-12-15 |