USD940669S1 - Boat for substrate processing apparatus - Google Patents
Boat for substrate processing apparatus Download PDFInfo
- Publication number
- USD940669S1 USD940669S1 US29/691,588 US201929691588F USD940669S US D940669 S1 USD940669 S1 US D940669S1 US 201929691588 F US201929691588 F US 201929691588F US D940669 S USD940669 S US D940669S
- Authority
- US
- United States
- Prior art keywords
- boat
- processing apparatus
- substrate processing
- view
- along line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The dashed-dot-dashed lines represent the boundary lines of the claimed design.
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.
Claims (1)
- We claim the ornamental design for a boat for substrate processing apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-025160 | 2018-11-19 | ||
| JPD2018-25160F JP1640260S (en) | 2018-11-19 | 2018-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD940669S1 true USD940669S1 (en) | 2022-01-11 |
Family
ID=67769575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/691,588 Active USD940669S1 (en) | 2018-11-19 | 2019-05-17 | Boat for substrate processing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD940669S1 (en) |
| JP (1) | JP1640260S (en) |
| TW (1) | TWD202463S (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD965542S1 (en) * | 2020-03-19 | 2022-10-04 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1053830S1 (en) * | 2022-03-04 | 2024-12-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
| USD1063875S1 (en) * | 2022-09-14 | 2025-02-25 | Kokusai Electric Corporation | Substrate lifter for semiconductor manufacturing equipment |
| USD1078667S1 (en) * | 2022-09-14 | 2025-06-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
| USD857021S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
| USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
| USD865689S1 (en) * | 2015-02-20 | 2019-11-05 | Microduino Inc. | Electrical module |
| USD866469S1 (en) * | 2015-11-23 | 2019-11-12 | Microduino Inc. | Electrical module |
| USD872038S1 (en) * | 2018-07-18 | 2020-01-07 | Haining Xincheng Electronics Co., Ltd. | LED chips on a printed circuit board |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD873783S1 (en) * | 2018-10-19 | 2020-01-28 | Haining Xincheng Electronics Co., Ltd. | LED chip |
| USD892754S1 (en) * | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD911298S1 (en) * | 2017-02-17 | 2021-02-23 | Stat Peel Ag | Chip |
| USD911986S1 (en) * | 2019-05-03 | 2021-03-02 | Raytheon Company | Handheld semiconductor wafer handling tool |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6536608B2 (en) | 2001-07-12 | 2003-03-25 | Saint-Gobain Ceramics & Plastics, Inc. | Single cast vertical wafer boat with a Y shaped column rack |
| JP4506125B2 (en) | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | Vertical boat for heat treatment and manufacturing method thereof |
| KR20150110207A (en) | 2014-03-24 | 2015-10-02 | 주식회사 테라세미콘 | Boat |
-
2018
- 2018-11-19 JP JPD2018-25160F patent/JP1640260S/ja active Active
-
2019
- 2019-05-07 TW TW108302587F patent/TWD202463S/en unknown
- 2019-05-17 US US29/691,588 patent/USD940669S1/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD865689S1 (en) * | 2015-02-20 | 2019-11-05 | Microduino Inc. | Electrical module |
| USD866469S1 (en) * | 2015-11-23 | 2019-11-12 | Microduino Inc. | Electrical module |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD857021S1 (en) * | 2016-05-25 | 2019-08-20 | Tdk Corporation | Piezoelectric element |
| USD858467S1 (en) * | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
| USD911298S1 (en) * | 2017-02-17 | 2021-02-23 | Stat Peel Ag | Chip |
| USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
| USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
| USD892754S1 (en) * | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
| USD872038S1 (en) * | 2018-07-18 | 2020-01-07 | Haining Xincheng Electronics Co., Ltd. | LED chips on a printed circuit board |
| USD873783S1 (en) * | 2018-10-19 | 2020-01-28 | Haining Xincheng Electronics Co., Ltd. | LED chip |
| USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
| USD911986S1 (en) * | 2019-05-03 | 2021-03-02 | Raytheon Company | Handheld semiconductor wafer handling tool |
Non-Patent Citations (4)
| Title |
|---|
| "Custom Quartz Wafer Carriers & Quartz Boats." May 15, 2018. MICQ. https://www.micquartz.com/quartz-glass-products/quartz-components/custom-quartz-wafer-carriers/. * |
| "Quartz Boat for Diffusion of Wafer Processing." Feb. 15, 2019. MTI Corporation. https://www.mtixtl.com/QuartzBoatEQ-QB-X025.aspx. * |
| "Substrate Processing Boat." (Design—© Questel) orbit.com. [Online PDF compilation of references] 89 pgs. Print Dates Range Nov. 28, 2019-May 31, 2013 [Retrieved Sep. 13, 2021]. * |
| "Wafer Boats." 10-15 Kyocera, https://global.kyocera.com/prdct/fc/product/category/sapphire/sapphire006.html. * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD965542S1 (en) * | 2020-03-19 | 2022-10-04 | Kokusai Electric Corporation | Boat of substrate processing apparatus |
| USD1053830S1 (en) * | 2022-03-04 | 2024-12-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
| USD1019582S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019581S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1019583S1 (en) * | 2022-05-30 | 2024-03-26 | Kokusai Electric Corporation | Inner tube of reaction tube for semiconductor manufacturing equipment |
| USD1063875S1 (en) * | 2022-09-14 | 2025-02-25 | Kokusai Electric Corporation | Substrate lifter for semiconductor manufacturing equipment |
| USD1078667S1 (en) * | 2022-09-14 | 2025-06-10 | Kokusai Electric Corporation | Wafer support of semiconductor manufacturing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1640260S (en) | 2019-09-02 |
| TWD202463S (en) | 2020-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |