USD940669S1 - Boat for substrate processing apparatus - Google Patents

Boat for substrate processing apparatus Download PDF

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Publication number
USD940669S1
USD940669S1 US29/691,588 US201929691588F USD940669S US D940669 S1 USD940669 S1 US D940669S1 US 201929691588 F US201929691588 F US 201929691588F US D940669 S USD940669 S US D940669S
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United States
Prior art keywords
boat
processing apparatus
substrate processing
view
along line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/691,588
Inventor
Makoto Sambu
Makoto Tsuri
Satoshi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJII, SATOSHI, SAMBU, MAKOTO, TSURI, MAKOTO
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FIG. 1 is a front, top and right side perspective view of a boat for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof.
FIG. 8 is an enlarged cross-sectional view take along line 8-8 in FIG. 2 thereof;
FIG. 9 is an enlarged cross-sectional view take along line 9-9 in FIG. 2 thereof;
FIG. 10 is an enlarged portion view taken along line 10-10 in FIG. 2. thereof;
FIG. 11 is an enlarged cross-sectional view take along line 11-11 in FIG. 8 thereof; and,
FIG. 12 is an enlarged perspective view, which looked at the part shown by the solid line from the upper part.
The dashed-dot-dashed lines represent the boundary lines of the claimed design.
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a boat for substrate processing apparatus, as shown and described.
US29/691,588 2018-11-19 2019-05-17 Boat for substrate processing apparatus Active USD940669S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-025160 2018-11-19
JPD2018-25160F JP1640260S (en) 2018-11-19 2018-11-19

Publications (1)

Publication Number Publication Date
USD940669S1 true USD940669S1 (en) 2022-01-11

Family

ID=67769575

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/691,588 Active USD940669S1 (en) 2018-11-19 2019-05-17 Boat for substrate processing apparatus

Country Status (3)

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US (1) USD940669S1 (en)
JP (1) JP1640260S (en)
TW (1) TWD202463S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1053830S1 (en) * 2022-03-04 2024-12-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus
USD1063875S1 (en) * 2022-09-14 2025-02-25 Kokusai Electric Corporation Substrate lifter for semiconductor manufacturing equipment
USD1078667S1 (en) * 2022-09-14 2025-06-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD857021S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD866469S1 (en) * 2015-11-23 2019-11-12 Microduino Inc. Electrical module
USD872038S1 (en) * 2018-07-18 2020-01-07 Haining Xincheng Electronics Co., Ltd. LED chips on a printed circuit board
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD873783S1 (en) * 2018-10-19 2020-01-28 Haining Xincheng Electronics Co., Ltd. LED chip
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD911298S1 (en) * 2017-02-17 2021-02-23 Stat Peel Ag Chip
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6536608B2 (en) 2001-07-12 2003-03-25 Saint-Gobain Ceramics & Plastics, Inc. Single cast vertical wafer boat with a Y shaped column rack
JP4506125B2 (en) 2003-07-16 2010-07-21 信越半導体株式会社 Vertical boat for heat treatment and manufacturing method thereof
KR20150110207A (en) 2014-03-24 2015-10-02 주식회사 테라세미콘 Boat

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD865689S1 (en) * 2015-02-20 2019-11-05 Microduino Inc. Electrical module
USD866469S1 (en) * 2015-11-23 2019-11-12 Microduino Inc. Electrical module
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD857021S1 (en) * 2016-05-25 2019-08-20 Tdk Corporation Piezoelectric element
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD911298S1 (en) * 2017-02-17 2021-02-23 Stat Peel Ag Chip
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD853979S1 (en) * 2017-12-27 2019-07-16 Kokusai Electric Corporation Reaction tube
USD892754S1 (en) * 2018-06-04 2020-08-11 Semikron Elektronik Gmbh & Co. Kg Power module
USD872038S1 (en) * 2018-07-18 2020-01-07 Haining Xincheng Electronics Co., Ltd. LED chips on a printed circuit board
USD873783S1 (en) * 2018-10-19 2020-01-28 Haining Xincheng Electronics Co., Ltd. LED chip
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD911986S1 (en) * 2019-05-03 2021-03-02 Raytheon Company Handheld semiconductor wafer handling tool

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Custom Quartz Wafer Carriers & Quartz Boats." May 15, 2018. MICQ. https://www.micquartz.com/quartz-glass-products/quartz-components/custom-quartz-wafer-carriers/. *
"Quartz Boat for Diffusion of Wafer Processing." Feb. 15, 2019. MTI Corporation. https://www.mtixtl.com/QuartzBoatEQ-QB-X025.aspx. *
"Substrate Processing Boat." (Design—© Questel) orbit.com. [Online PDF compilation of references] 89 pgs. Print Dates Range Nov. 28, 2019-May 31, 2013 [Retrieved Sep. 13, 2021]. *
"Wafer Boats." 10-15 Kyocera, https://global.kyocera.com/prdct/fc/product/category/sapphire/sapphire006.html. *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD965542S1 (en) * 2020-03-19 2022-10-04 Kokusai Electric Corporation Boat of substrate processing apparatus
USD1053830S1 (en) * 2022-03-04 2024-12-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus
USD1019582S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019581S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1019583S1 (en) * 2022-05-30 2024-03-26 Kokusai Electric Corporation Inner tube of reaction tube for semiconductor manufacturing equipment
USD1063875S1 (en) * 2022-09-14 2025-02-25 Kokusai Electric Corporation Substrate lifter for semiconductor manufacturing equipment
USD1078667S1 (en) * 2022-09-14 2025-06-10 Kokusai Electric Corporation Wafer support of semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1640260S (en) 2019-09-02
TWD202463S (en) 2020-02-01

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