USD928105S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD928105S1
USD928105S1 US29/731,623 US202029731623F USD928105S US D928105 S1 USD928105 S1 US D928105S1 US 202029731623 F US202029731623 F US 202029731623F US D928105 S USD928105 S US D928105S
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semiconductor device
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design
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US29/731,623
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English (en)
Inventor
Koshun SAITO
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, KOSHUN
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US29/731,623 2019-10-28 2020-04-16 Semiconductor device Active USD928105S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-23880F JP1664528S (enrdf_load_stackoverflow) 2019-10-28 2019-10-28
JP2019-023880 2019-10-28

Publications (1)

Publication Number Publication Date
USD928105S1 true USD928105S1 (en) 2021-08-17

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US29/731,623 Active USD928105S1 (en) 2019-10-28 2020-04-16 Semiconductor device

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US (1) USD928105S1 (enrdf_load_stackoverflow)
JP (1) JP1664528S (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1699856S (ja) 2020-12-15 2021-11-15 半導体素子

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4951124A (en) 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
US5459350A (en) * 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5512784A (en) * 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6100580A (en) 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4951124A (en) 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
US6100580A (en) 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US5563441A (en) * 1992-12-11 1996-10-08 Mitsubishi Denki Kabushiki Kaisha Lead frame assembly including a semiconductor device and a resistance wire
US5459350A (en) * 1993-01-13 1995-10-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed type semiconductor device
US5512784A (en) * 1994-04-19 1996-04-30 Jerrold Communications, General Instrument Corporation Surge protector semiconductor subassembly for 3-lead transistor aotline package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6404065B1 (en) * 1998-07-31 2002-06-11 I-Xys Corporation Electrically isolated power semiconductor package
USD420983S (en) * 1998-10-16 2000-02-22 Ixys Corporation Semiconductor power package with three leads
US6362517B1 (en) * 1999-09-22 2002-03-26 Michael Ray Bell High voltage package for electronic device
USD489695S1 (en) * 2002-03-29 2004-05-11 Kabushiki Kaisha Toshiba Semiconductor device
USD515520S1 (en) * 2002-03-29 2006-02-21 Kabushiki Kaisha Toshiba Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD730911S1 (en) * 2014-05-02 2015-06-02 Samsung Electronics Co., Ltd. Memory card
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Notice of Allowance issued for U.S. Appl. No. 29/731,618, dated Mar. 8, 2021, 12 pages.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

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