USD924953S1 - Gas inlet attachment for substrate processing apparatus - Google Patents

Gas inlet attachment for substrate processing apparatus Download PDF

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Publication number
USD924953S1
USD924953S1 US29/672,229 US201829672229F USD924953S US D924953 S1 USD924953 S1 US D924953S1 US 201829672229 F US201829672229 F US 201829672229F US D924953 S USD924953 S US D924953S
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Prior art keywords
processing apparatus
gas inlet
substrate processing
inlet attachment
attachment
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Active
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US29/672,229
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English (en)
Inventor
Hironori Shimada
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIMADA, HIRONORI
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US29/672,229 2018-07-19 2018-12-04 Gas inlet attachment for substrate processing apparatus Active USD924953S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-015808 2018-07-19
JPD2018-15808F JP1624352S (enrdf_load_stackoverflow) 2018-07-19 2018-07-19

Publications (1)

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USD924953S1 true USD924953S1 (en) 2021-07-13

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US (1) USD924953S1 (enrdf_load_stackoverflow)
JP (1) JP1624352S (enrdf_load_stackoverflow)
TW (1) TWD197467S (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots
USD964443S1 (en) * 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD1017561S1 (en) 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1089130S1 (en) 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20030159653A1 (en) * 2002-02-28 2003-08-28 Dando Ross S. Manifold assembly for feeding reactive precursors to substrate processing chambers
US20080302302A1 (en) * 2006-01-24 2008-12-11 Hitachi Kokusai Electric Inc. Substrate Processing System
US7700054B2 (en) * 2006-12-12 2010-04-20 Hitachi Kokusai Electric Inc. Substrate processing apparatus having gas side flow via gas inlet
US20130220221A1 (en) * 2012-02-23 2013-08-29 Applied Materials, Inc. Method and apparatus for precursor delivery
US20130276707A1 (en) * 2012-04-23 2013-10-24 Asm Ip Holding B.V. Vertical furnace with circumferentially distributed gas inlet system
US20140239091A1 (en) * 2013-02-23 2014-08-28 Hermes-Epitek Corporation Gas Injector and Cover Plate Assembly for Semiconductor Equipment
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20170073810A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
US20170241015A1 (en) * 2016-02-18 2017-08-24 Horiba Stec, Co., Ltd. Vaporizer and thin film deposition apparatus including the same
US20170283947A1 (en) * 2016-04-01 2017-10-05 Applied Materials, Inc. Apparatus And Method For Providing A Uniform Flow Of Gas
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
USD890572S1 (en) * 2018-07-19 2020-07-21 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
USD901564S1 (en) * 2019-01-28 2020-11-10 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20030159653A1 (en) * 2002-02-28 2003-08-28 Dando Ross S. Manifold assembly for feeding reactive precursors to substrate processing chambers
US20080302302A1 (en) * 2006-01-24 2008-12-11 Hitachi Kokusai Electric Inc. Substrate Processing System
US7700054B2 (en) * 2006-12-12 2010-04-20 Hitachi Kokusai Electric Inc. Substrate processing apparatus having gas side flow via gas inlet
US20130220221A1 (en) * 2012-02-23 2013-08-29 Applied Materials, Inc. Method and apparatus for precursor delivery
US20130276707A1 (en) * 2012-04-23 2013-10-24 Asm Ip Holding B.V. Vertical furnace with circumferentially distributed gas inlet system
US20140239091A1 (en) * 2013-02-23 2014-08-28 Hermes-Epitek Corporation Gas Injector and Cover Plate Assembly for Semiconductor Equipment
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
US20170073810A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
US20170241015A1 (en) * 2016-02-18 2017-08-24 Horiba Stec, Co., Ltd. Vaporizer and thin film deposition apparatus including the same
US20170283947A1 (en) * 2016-04-01 2017-10-05 Applied Materials, Inc. Apparatus And Method For Providing A Uniform Flow Of Gas
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
USD890572S1 (en) * 2018-07-19 2020-07-21 Kokusai Electric Corporation Gas supply nozzle for substrate processing apparatus
USD901564S1 (en) * 2019-01-28 2020-11-10 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots
USD964443S1 (en) * 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD1017561S1 (en) 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Also Published As

Publication number Publication date
TWD197467S (zh) 2019-05-11
JP1624352S (enrdf_load_stackoverflow) 2019-02-12

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