JP1624352S - - Google Patents
Info
- Publication number
- JP1624352S JP1624352S JPD2018-15808F JP2018015808F JP1624352S JP 1624352 S JP1624352 S JP 1624352S JP 2018015808 F JP2018015808 F JP 2018015808F JP 1624352 S JP1624352 S JP 1624352S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-15808F JP1624352S (ja) | 2018-07-19 | 2018-07-19 | |
| TW107306664F TWD197467S (zh) | 2018-07-19 | 2018-11-12 | 基板處理裝置用氣體導入管 |
| US29/672,229 USD924953S1 (en) | 2018-07-19 | 2018-12-04 | Gas inlet attachment for substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-15808F JP1624352S (ja) | 2018-07-19 | 2018-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1624352S true JP1624352S (ja) | 2019-02-12 |
Family
ID=65269374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2018-15808F Active JP1624352S (ja) | 2018-07-19 | 2018-07-19 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD924953S1 (ja) |
| JP (1) | JP1624352S (ja) |
| TW (1) | TWD197467S (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD964443S1 (en) | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1651622S (ja) * | 2019-07-17 | 2020-01-27 | ||
| JP1700780S (ja) | 2021-03-22 | 2021-11-29 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| US20030159653A1 (en) * | 2002-02-28 | 2003-08-28 | Dando Ross S. | Manifold assembly for feeding reactive precursors to substrate processing chambers |
| JP5137366B2 (ja) * | 2006-01-24 | 2013-02-06 | 株式会社日立国際電気 | 基板処理システム及び液体材料供給装置 |
| US7700054B2 (en) * | 2006-12-12 | 2010-04-20 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus having gas side flow via gas inlet |
| WO2013126323A1 (en) * | 2012-02-23 | 2013-08-29 | Applied Materials, Inc. | Method and apparatus for precursor delivery |
| US20130276707A1 (en) * | 2012-04-23 | 2013-10-24 | Asm Ip Holding B.V. | Vertical furnace with circumferentially distributed gas inlet system |
| TWI473903B (zh) * | 2013-02-23 | 2015-02-21 | Hermes Epitek Corp | 應用於半導體設備的噴射器與上蓋板總成 |
| US10683571B2 (en) * | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
| JP6578243B2 (ja) * | 2015-07-17 | 2019-09-18 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | ガス供給ノズル、基板処理装置、半導体装置の製造方法およびプログラム |
| KR101710944B1 (ko) * | 2015-09-11 | 2017-02-28 | 주식회사 유진테크 | 기판처리장치 |
| KR102483924B1 (ko) * | 2016-02-18 | 2023-01-02 | 삼성전자주식회사 | 기화기 및 이를 구비하는 박막 증착 장치 |
| TWI689619B (zh) * | 2016-04-01 | 2020-04-01 | 美商應用材料股份有限公司 | 用於提供均勻流動的氣體的設備及方法 |
| JP6710134B2 (ja) * | 2016-09-27 | 2020-06-17 | 東京エレクトロン株式会社 | ガス導入機構及び処理装置 |
| JP1624354S (ja) * | 2018-07-19 | 2019-02-12 | ||
| JP1648531S (ja) * | 2019-01-28 | 2019-12-23 |
-
2018
- 2018-07-19 JP JPD2018-15808F patent/JP1624352S/ja active Active
- 2018-11-12 TW TW107306664F patent/TWD197467S/zh unknown
- 2018-12-04 US US29/672,229 patent/USD924953S1/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD964443S1 (en) | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD197467S (zh) | 2019-05-11 |
| USD924953S1 (en) | 2021-07-13 |