USD924953S1 - Gas inlet attachment for substrate processing apparatus - Google Patents
Gas inlet attachment for substrate processing apparatus Download PDFInfo
- Publication number
- USD924953S1 USD924953S1 US29/672,229 US201829672229F USD924953S US D924953 S1 USD924953 S1 US D924953S1 US 201829672229 F US201829672229 F US 201829672229F US D924953 S USD924953 S US D924953S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- gas inlet
- substrate processing
- inlet attachment
- attachment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-015808 | 2018-07-19 | ||
JPD2018-15808F JP1624352S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2018-07-19 | 2018-07-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD924953S1 true USD924953S1 (en) | 2021-07-13 |
Family
ID=65269374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/672,229 Active USD924953S1 (en) | 2018-07-19 | 2018-12-04 | Gas inlet attachment for substrate processing apparatus |
Country Status (3)
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD944661S1 (en) * | 2019-07-17 | 2022-03-01 | Kokusai Electric Corporation | Calibrator for wafer handling robots |
USD964443S1 (en) * | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
USD1017561S1 (en) | 2021-03-22 | 2024-03-12 | Kokusai Electric Corporation | Nozzle holder of substrate processing apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1089130S1 (en) | 2024-01-19 | 2025-08-19 | Applied Materials, Inc. | Process chamber manifold |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
US20030159653A1 (en) * | 2002-02-28 | 2003-08-28 | Dando Ross S. | Manifold assembly for feeding reactive precursors to substrate processing chambers |
US20080302302A1 (en) * | 2006-01-24 | 2008-12-11 | Hitachi Kokusai Electric Inc. | Substrate Processing System |
US7700054B2 (en) * | 2006-12-12 | 2010-04-20 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus having gas side flow via gas inlet |
US20130220221A1 (en) * | 2012-02-23 | 2013-08-29 | Applied Materials, Inc. | Method and apparatus for precursor delivery |
US20130276707A1 (en) * | 2012-04-23 | 2013-10-24 | Asm Ip Holding B.V. | Vertical furnace with circumferentially distributed gas inlet system |
US20140239091A1 (en) * | 2013-02-23 | 2014-08-28 | Hermes-Epitek Corporation | Gas Injector and Cover Plate Assembly for Semiconductor Equipment |
US20150240359A1 (en) * | 2014-02-25 | 2015-08-27 | Asm Ip Holding B.V. | Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same |
US20170051408A1 (en) * | 2015-07-17 | 2017-02-23 | Hitachi Kokusai Electric Inc. | Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium |
US20170073810A1 (en) * | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
US20170241015A1 (en) * | 2016-02-18 | 2017-08-24 | Horiba Stec, Co., Ltd. | Vaporizer and thin film deposition apparatus including the same |
US20170283947A1 (en) * | 2016-04-01 | 2017-10-05 | Applied Materials, Inc. | Apparatus And Method For Providing A Uniform Flow Of Gas |
US20180087156A1 (en) * | 2016-09-27 | 2018-03-29 | Tokyo Electron Limited | Gas Introduction Mechanism and Processing Apparatus |
USD890572S1 (en) * | 2018-07-19 | 2020-07-21 | Kokusai Electric Corporation | Gas supply nozzle for substrate processing apparatus |
USD901564S1 (en) * | 2019-01-28 | 2020-11-10 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
-
2018
- 2018-07-19 JP JPD2018-15808F patent/JP1624352S/ja active Active
- 2018-11-12 TW TW107306664F patent/TWD197467S/zh unknown
- 2018-12-04 US US29/672,229 patent/USD924953S1/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
US20030159653A1 (en) * | 2002-02-28 | 2003-08-28 | Dando Ross S. | Manifold assembly for feeding reactive precursors to substrate processing chambers |
US20080302302A1 (en) * | 2006-01-24 | 2008-12-11 | Hitachi Kokusai Electric Inc. | Substrate Processing System |
US7700054B2 (en) * | 2006-12-12 | 2010-04-20 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus having gas side flow via gas inlet |
US20130220221A1 (en) * | 2012-02-23 | 2013-08-29 | Applied Materials, Inc. | Method and apparatus for precursor delivery |
US20130276707A1 (en) * | 2012-04-23 | 2013-10-24 | Asm Ip Holding B.V. | Vertical furnace with circumferentially distributed gas inlet system |
US20140239091A1 (en) * | 2013-02-23 | 2014-08-28 | Hermes-Epitek Corporation | Gas Injector and Cover Plate Assembly for Semiconductor Equipment |
US20150240359A1 (en) * | 2014-02-25 | 2015-08-27 | Asm Ip Holding B.V. | Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same |
US20170051408A1 (en) * | 2015-07-17 | 2017-02-23 | Hitachi Kokusai Electric Inc. | Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium |
US20170073810A1 (en) * | 2015-09-11 | 2017-03-16 | Eugene Technology Co., Ltd. | Substrate processing apparatus |
US20170241015A1 (en) * | 2016-02-18 | 2017-08-24 | Horiba Stec, Co., Ltd. | Vaporizer and thin film deposition apparatus including the same |
US20170283947A1 (en) * | 2016-04-01 | 2017-10-05 | Applied Materials, Inc. | Apparatus And Method For Providing A Uniform Flow Of Gas |
US20180087156A1 (en) * | 2016-09-27 | 2018-03-29 | Tokyo Electron Limited | Gas Introduction Mechanism and Processing Apparatus |
USD890572S1 (en) * | 2018-07-19 | 2020-07-21 | Kokusai Electric Corporation | Gas supply nozzle for substrate processing apparatus |
USD901564S1 (en) * | 2019-01-28 | 2020-11-10 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD944661S1 (en) * | 2019-07-17 | 2022-03-01 | Kokusai Electric Corporation | Calibrator for wafer handling robots |
USD964443S1 (en) * | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
USD1017561S1 (en) | 2021-03-22 | 2024-03-12 | Kokusai Electric Corporation | Nozzle holder of substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1624352S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2019-02-12 |
TWD197467S (zh) | 2019-05-11 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |