USD924823S1 - Adiabatic plate for substrate processing apparatus - Google Patents

Adiabatic plate for substrate processing apparatus Download PDF

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Publication number
USD924823S1
USD924823S1 US29/672,222 US201829672222F USD924823S US D924823 S1 USD924823 S1 US D924823S1 US 201829672222 F US201829672222 F US 201829672222F US D924823 S USD924823 S US D924823S
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United States
Prior art keywords
processing apparatus
substrate processing
adiabatic plate
adiabatic
plate
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US29/672,222
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English (en)
Inventor
Koji Saiki
Makoto Tsuri
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAIKI, KOJI, TSURI, MAKOTO
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US29/672,222 2018-07-19 2018-12-04 Adiabatic plate for substrate processing apparatus Active USD924823S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2018-15809F JP1624353S (de) 2018-07-19 2018-07-19
JP2018-015809 2018-07-19

Publications (1)

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USD924823S1 true USD924823S1 (en) 2021-07-13

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US29/672,222 Active USD924823S1 (en) 2018-07-19 2018-12-04 Adiabatic plate for substrate processing apparatus

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US (1) USD924823S1 (de)
JP (1) JP1624353S (de)
TW (1) TWD197466S (de)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
US11367641B2 (en) * 2019-12-24 2022-06-21 Powertech Technology Inc. Wafer storage device, carrier plate and wafer cassette
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD962206S1 (en) * 2020-01-09 2022-08-30 Space Exploration Technologies Corp. Antenna apparatus
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD971192S1 (en) * 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD981972S1 (en) 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1016762S1 (en) * 2021-12-21 2024-03-05 Panasonic Intellectual Property Management Co., Ltd. Flexible printed circuit board

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
USD359476S (en) * 1993-08-06 1995-06-20 Sankyo Seiki Mfg. Co., Ltd. Circuit board with mounting flange
USD404374S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
US20020167122A1 (en) * 1999-07-26 2002-11-14 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
JP1568061S (de) 2016-03-30 2017-01-30
USD793352S1 (en) * 2016-07-11 2017-08-01 Asm Ip Holding B.V. Getter plate
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
USD843184S1 (en) * 2016-06-02 2019-03-19 David Harold Woodcock Cutting tool for adhesive tape dispensers
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US20200144053A1 (en) * 2016-11-28 2020-05-07 Mitsubishi Electric Corporation Semiconductor wafer, semiconductor device, and method for producing semiconductor device
USD900044S1 (en) * 2018-12-18 2020-10-27 SiFive, Inc. Circuit board
US10941787B2 (en) * 2017-04-25 2021-03-09 Shimadzu Corporation Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
USD359476S (en) * 1993-08-06 1995-06-20 Sankyo Seiki Mfg. Co., Ltd. Circuit board with mounting flange
USD404374S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
US20020167122A1 (en) * 1999-07-26 2002-11-14 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
JP1568061S (de) 2016-03-30 2017-01-30
USD843184S1 (en) * 2016-06-02 2019-03-19 David Harold Woodcock Cutting tool for adhesive tape dispensers
USD793352S1 (en) * 2016-07-11 2017-08-01 Asm Ip Holding B.V. Getter plate
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US20200144053A1 (en) * 2016-11-28 2020-05-07 Mitsubishi Electric Corporation Semiconductor wafer, semiconductor device, and method for producing semiconductor device
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
US10941787B2 (en) * 2017-04-25 2021-03-09 Shimadzu Corporation Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD900044S1 (en) * 2018-12-18 2020-10-27 SiFive, Inc. Circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971192S1 (en) * 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD1012070S1 (en) 2019-06-03 2024-01-23 Space Exploration Technologies Corp. Antenna apparatus
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
US11367641B2 (en) * 2019-12-24 2022-06-21 Powertech Technology Inc. Wafer storage device, carrier plate and wafer cassette
USD962206S1 (en) * 2020-01-09 2022-08-30 Space Exploration Technologies Corp. Antenna apparatus
USD981972S1 (en) 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1016762S1 (en) * 2021-12-21 2024-03-05 Panasonic Intellectual Property Management Co., Ltd. Flexible printed circuit board

Also Published As

Publication number Publication date
JP1624353S (de) 2019-02-12
TWD197466S (zh) 2019-05-11

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