USD911985S1 - Gas introduction plate for plasma etching apparatus for etching semiconductor wafer - Google Patents

Gas introduction plate for plasma etching apparatus for etching semiconductor wafer Download PDF

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Publication number
USD911985S1
USD911985S1 US29/671,716 US201829671716F USD911985S US D911985 S1 USD911985 S1 US D911985S1 US 201829671716 F US201829671716 F US 201829671716F US D911985 S USD911985 S US D911985S
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United States
Prior art keywords
semiconductor wafer
gas introduction
introduction plate
plasma etching
etching
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Active
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US29/671,716
Inventor
Takaaki Nezu
Yoshitaka Tamura
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NEZU, TAKAAKI, TAMURA, YOSHITAKA
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FIG. 1 is a top plan view of a gas introduction plate for plasma etching apparatus for etching semiconductor wafer, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is an enlarged portion view labeled, “FIG. 3” in FIG. 2;
FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. 3; and,
FIG. 5 is an enlarged portion view labeled, “FIG. 5” in FIG. 4.
The broken lines shown in the drawings represent portions of the gas introduction plate for plasma etching apparatus for etching semiconductor wafer that form no part of the claimed design. The dot-dash broken lines of FIGS. 2-5 define the bounds of the enlarged portion views of FIGS. 3 and 5 and form no part of the claimed design. All sides not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a gas introduction plate for plasma etching apparatus for etching semiconductor wafer, as shown and described.
US29/671,716 2018-06-08 2018-11-29 Gas introduction plate for plasma etching apparatus for etching semiconductor wafer Active USD911985S1 (en)

Applications Claiming Priority (2)

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JPD2018-12651F JP1624668S (en) 2018-06-08 2018-06-08
JP2018-012651 2018-06-08

Publications (1)

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USD911985S1 true USD911985S1 (en) 2021-03-02

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US29/671,716 Active USD911985S1 (en) 2018-06-08 2018-11-29 Gas introduction plate for plasma etching apparatus for etching semiconductor wafer

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JP (1) JP1624668S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1005974S1 (en) * 2022-05-19 2023-11-28 Asm Ip Holding B.V. Gas distributor for semiconductor manufacturing apparatus
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6379466B1 (en) * 1992-01-17 2002-04-30 Applied Materials, Inc. Temperature controlled gas distribution plate
US20050056218A1 (en) * 2002-02-14 2005-03-17 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US20050252447A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Gas blocker plate for improved deposition
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20090159002A1 (en) * 2007-12-19 2009-06-25 Kallol Bera Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
USD654882S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
USD655261S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
USD655260S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
US8206506B2 (en) * 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
US8402918B2 (en) * 2009-04-07 2013-03-26 Lam Research Corporation Showerhead electrode with centering feature
US8419959B2 (en) * 2009-09-18 2013-04-16 Lam Research Corporation Clamped monolithic showerhead electrode
US8573152B2 (en) * 2010-09-03 2013-11-05 Lam Research Corporation Showerhead electrode
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD733257S1 (en) * 2014-02-14 2015-06-30 Hansgrohe Se Overhead shower
USD736348S1 (en) * 2014-07-07 2015-08-11 Jiangmen Triumph Rain Showers Co., LTD Spray head for a shower
USD745641S1 (en) * 2011-06-20 2015-12-15 Neoperl Gmbh Stream straightener for faucet
USD751176S1 (en) * 2014-08-07 2016-03-08 Hansgrohe Se Overhead shower
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379466B1 (en) * 1992-01-17 2002-04-30 Applied Materials, Inc. Temperature controlled gas distribution plate
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) * 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US20050056218A1 (en) * 2002-02-14 2005-03-17 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US20050252447A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Gas blocker plate for improved deposition
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20090159002A1 (en) * 2007-12-19 2009-06-25 Kallol Bera Gas distribution plate with annular plenum having a sloped ceiling for uniform distribution
US8206506B2 (en) * 2008-07-07 2012-06-26 Lam Research Corporation Showerhead electrode
US8402918B2 (en) * 2009-04-07 2013-03-26 Lam Research Corporation Showerhead electrode with centering feature
US8419959B2 (en) * 2009-09-18 2013-04-16 Lam Research Corporation Clamped monolithic showerhead electrode
US8573152B2 (en) * 2010-09-03 2013-11-05 Lam Research Corporation Showerhead electrode
USD655260S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
USD654882S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
USD655261S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Gas-separating plate for reactor for manufacturing semiconductor
USD745641S1 (en) * 2011-06-20 2015-12-15 Neoperl Gmbh Stream straightener for faucet
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD733257S1 (en) * 2014-02-14 2015-06-30 Hansgrohe Se Overhead shower
USD736348S1 (en) * 2014-07-07 2015-08-11 Jiangmen Triumph Rain Showers Co., LTD Spray head for a shower
USD751176S1 (en) * 2014-08-07 2016-03-08 Hansgrohe Se Overhead shower
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1005974S1 (en) * 2022-05-19 2023-11-28 Asm Ip Holding B.V. Gas distributor for semiconductor manufacturing apparatus
USD1037778S1 (en) * 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

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JP1624668S (en) 2019-02-18

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