USD884855S1 - Heater pedestal - Google Patents
Heater pedestal Download PDFInfo
- Publication number
- USD884855S1 USD884855S1 US29/711,377 US201929711377F USD884855S US D884855 S1 USD884855 S1 US D884855S1 US 201929711377 F US201929711377 F US 201929711377F US D884855 S USD884855 S US D884855S
- Authority
- US
- United States
- Prior art keywords
- view
- heater pedestal
- sectional
- heater
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a heater pedestal, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/711,377 USD884855S1 (en) | 2019-10-30 | 2019-10-30 | Heater pedestal |
TW109301975F TWD214069S (en) | 2019-10-30 | 2020-04-13 | Heater pedestal |
JPD2020-8775F JP1689809S (en) | 2019-10-30 | 2020-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/711,377 USD884855S1 (en) | 2019-10-30 | 2019-10-30 | Heater pedestal |
Publications (1)
Publication Number | Publication Date |
---|---|
USD884855S1 true USD884855S1 (en) | 2020-05-19 |
Family
ID=70615523
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/711,377 Active USD884855S1 (en) | 2019-10-30 | 2019-10-30 | Heater pedestal |
Country Status (3)
Country | Link |
---|---|
US (1) | USD884855S1 (en) |
JP (1) | JP1689809S (en) |
TW (1) | TWD214069S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD998112S1 (en) * | 2020-12-08 | 2023-09-05 | Bromic Pty Limited | Heater |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6278089B1 (en) | 1999-11-02 | 2001-08-21 | Applied Materials, Inc. | Heater for use in substrate processing |
US6544340B2 (en) | 2000-12-08 | 2003-04-08 | Applied Materials, Inc. | Heater with detachable ceramic top plate |
US6907924B2 (en) | 1997-01-02 | 2005-06-21 | Veeco Rochester Inc. | Thermally conductive chuck for vacuum processor |
US20060096972A1 (en) * | 2004-10-28 | 2006-05-11 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
US20070151517A1 (en) * | 2005-12-31 | 2007-07-05 | Ips Ltd. | Heater for depositing thin film |
USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
US7705275B2 (en) | 2005-08-17 | 2010-04-27 | Applied Materials, Inc. | Substrate support having brazed plates and resistance heater |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
US20120164829A1 (en) * | 2010-12-22 | 2012-06-28 | Applied Materials, Inc. | Fabrication of through-silicon vias on silicon wafers |
US20140014642A1 (en) * | 2012-06-12 | 2014-01-16 | Component Re-Engineering Company, Inc. | Multiple Zone Heater |
US20140251214A1 (en) * | 2013-03-06 | 2014-09-11 | Applied Materials, Inc. | Heated substrate support with flatness control |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
US20150108203A1 (en) * | 2011-11-30 | 2015-04-23 | Component Re-Engineering Company, Inc. | Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials |
US9673077B2 (en) * | 2012-07-03 | 2017-06-06 | Watlow Electric Manufacturing Company | Pedestal construction with low coefficient of thermal expansion top |
US20170204514A1 (en) * | 2014-08-08 | 2017-07-20 | Ok Ryul Kim | Cvd process chamber component having aluminum fluoride barrier film thereon |
USD807481S1 (en) | 2016-04-08 | 2018-01-09 | Applied Materials, Inc. | Patterned heater pedestal |
US20180251893A1 (en) * | 2017-03-03 | 2018-09-06 | Lam Research Corporation | Wafer level uniformity control in remote plasma film deposition |
US20190276366A1 (en) * | 2018-03-07 | 2019-09-12 | Applied Materials, Inc. | Y2O3-ZrO2 EROSION RESISTANT MATERIAL FOR CHAMBER COMPONENTS IN PLASMA ENVIRONMENTS |
USD862539S1 (en) * | 2017-12-04 | 2019-10-08 | Liqua-Tech Corporation | Register gear adapter plate |
US20200035520A1 (en) * | 2018-07-26 | 2020-01-30 | Samsung Electronics Co., Ltd. | Stable heater rebuild inspection and maintenance platform |
US20200098651A1 (en) * | 2015-11-17 | 2020-03-26 | Lam Research Corporation | Systems and Methods for Controlling Plasma Instability in Semiconductor Fabrication |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD859484S1 (en) | 2017-06-12 | 2019-09-10 | Asm Ip Holding B.V. | Heater block |
-
2019
- 2019-10-30 US US29/711,377 patent/USD884855S1/en active Active
-
2020
- 2020-04-13 TW TW109301975F patent/TWD214069S/en unknown
- 2020-04-30 JP JPD2020-8775F patent/JP1689809S/ja active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6907924B2 (en) | 1997-01-02 | 2005-06-21 | Veeco Rochester Inc. | Thermally conductive chuck for vacuum processor |
US6278089B1 (en) | 1999-11-02 | 2001-08-21 | Applied Materials, Inc. | Heater for use in substrate processing |
US6544340B2 (en) | 2000-12-08 | 2003-04-08 | Applied Materials, Inc. | Heater with detachable ceramic top plate |
US20060096972A1 (en) * | 2004-10-28 | 2006-05-11 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
US7705275B2 (en) | 2005-08-17 | 2010-04-27 | Applied Materials, Inc. | Substrate support having brazed plates and resistance heater |
US20070151517A1 (en) * | 2005-12-31 | 2007-07-05 | Ips Ltd. | Heater for depositing thin film |
USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
US20120164829A1 (en) * | 2010-12-22 | 2012-06-28 | Applied Materials, Inc. | Fabrication of through-silicon vias on silicon wafers |
US20150108203A1 (en) * | 2011-11-30 | 2015-04-23 | Component Re-Engineering Company, Inc. | Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials |
US20140014642A1 (en) * | 2012-06-12 | 2014-01-16 | Component Re-Engineering Company, Inc. | Multiple Zone Heater |
US9673077B2 (en) * | 2012-07-03 | 2017-06-06 | Watlow Electric Manufacturing Company | Pedestal construction with low coefficient of thermal expansion top |
US20140251214A1 (en) * | 2013-03-06 | 2014-09-11 | Applied Materials, Inc. | Heated substrate support with flatness control |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
US20170204514A1 (en) * | 2014-08-08 | 2017-07-20 | Ok Ryul Kim | Cvd process chamber component having aluminum fluoride barrier film thereon |
US20200098651A1 (en) * | 2015-11-17 | 2020-03-26 | Lam Research Corporation | Systems and Methods for Controlling Plasma Instability in Semiconductor Fabrication |
USD807481S1 (en) | 2016-04-08 | 2018-01-09 | Applied Materials, Inc. | Patterned heater pedestal |
US20180251893A1 (en) * | 2017-03-03 | 2018-09-06 | Lam Research Corporation | Wafer level uniformity control in remote plasma film deposition |
USD862539S1 (en) * | 2017-12-04 | 2019-10-08 | Liqua-Tech Corporation | Register gear adapter plate |
US20190276366A1 (en) * | 2018-03-07 | 2019-09-12 | Applied Materials, Inc. | Y2O3-ZrO2 EROSION RESISTANT MATERIAL FOR CHAMBER COMPONENTS IN PLASMA ENVIRONMENTS |
US20200035520A1 (en) * | 2018-07-26 | 2020-01-30 | Samsung Electronics Co., Ltd. | Stable heater rebuild inspection and maintenance platform |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD998112S1 (en) * | 2020-12-08 | 2023-09-05 | Bromic Pty Limited | Heater |
Also Published As
Publication number | Publication date |
---|---|
JP1689809S (en) | 2021-07-12 |
TWD214069S (en) | 2021-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |