USD901405S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD901405S1
USD901405S1 US29/619,201 US201729619201F USD901405S US D901405 S1 USD901405 S1 US D901405S1 US 201729619201 F US201729619201 F US 201729619201F US D901405 S USD901405 S US D901405S
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semiconductor device
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design
ornamental design
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Koshun SAITO
Keiichi Takahashi
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, KEIICHI, SAITO, KOSHUN
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US29/619,201 2017-03-28 2017-09-27 Semiconductor device Active USD901405S1 (en)

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JP2017-006385 2017-03-28
JPD2017-6385F JP1593817S (enrdf_load_stackoverflow) 2017-03-28 2017-03-28

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USD901405S1 true USD901405S1 (en) 2020-11-10

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JP (1) JP1593817S (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling

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USD684927S1 (en) * 2012-05-16 2013-06-25 Lem Intellectual Property Sa Current transducer
USD686989S1 (en) * 2012-05-16 2013-07-30 Lem Intellectual Property Sa Current transducer
USD742321S1 (en) * 2014-07-09 2015-11-03 Dai-Ichi Seiko Co., Ltd. Electric connector
USD765797S1 (en) * 2014-08-19 2016-09-06 Matej Banik Set of building blocks
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD777123S1 (en) * 2014-07-24 2017-01-24 Allen-Vanguard Corporation Mezzanine board
USD792845S1 (en) * 2015-07-02 2017-07-25 Flexterra, Inc. Charging stand
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
JP1633806S (enrdf_load_stackoverflow) * 2018-10-29 2019-06-10
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device

Patent Citations (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD289037S (en) * 1983-12-16 1987-03-31 Sumitomo Electric Industries, Ltd. Photodiode
USD288803S (en) * 1984-08-20 1987-03-17 Ross Capawana Circuit board cover
USD340907S (en) * 1991-06-14 1993-11-02 Astec International, Ltd. Power converter module
USD356291S (en) * 1992-10-12 1995-03-14 Nemic-Lambda K.K. DC stabilizing power supply
USD356994S (en) * 1992-10-12 1995-04-04 Nemic-Lambda K.K. DC stabilizing power supply
USD369778S (en) * 1992-10-12 1996-05-14 Nemic-Lambda K.K. Noise filter
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD340222S (en) * 1992-12-04 1993-10-12 ATC Power Systems, Inc. Power converter
US5761040A (en) * 1995-12-20 1998-06-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD394864S (en) * 1996-09-10 1998-06-02 Multi-Tech Systems, Inc. Peripheral connector
JPH10200024A (ja) 1996-10-01 1998-07-31 Internatl Rectifier Corp 表面実装用パッケージとその製造方法
JP2006210958A (ja) 1997-02-27 2006-08-10 Fujitsu Ltd 半導体装置
US20010019856A1 (en) * 1998-05-27 2001-09-06 Hitachi, Ltd. Semiconductor device and method for manufacturing the same
USD427567S (en) * 1999-07-08 2000-07-04 Mitsumi Electric Co., Ltd. Electronic connector
USD429345S (en) * 1999-11-30 2000-08-08 Anthony Forest Boone Decorative wall block
US20010030362A1 (en) * 2000-01-12 2001-10-18 International Rectifier Corporation Low cost power semiconductor module without substrate
USD452479S1 (en) * 2000-05-19 2001-12-25 J.S.T. Mfg. Co., Ltd. Connector for printed circuit boards
USD452845S1 (en) * 2000-05-19 2002-01-08 J.S.T.Mfg. Co., Ltd. Connector for printed circuit boards
USD465772S1 (en) * 2001-04-20 2002-11-19 3Com Corporation Printed circuit board
JP2003347491A (ja) 2002-05-28 2003-12-05 Renesas Technology Corp 半導体装置
USD505925S1 (en) * 2003-12-11 2005-06-07 Kyung Hee Koo Repeater circuit board design
US6946942B1 (en) * 2004-03-31 2005-09-20 Amphenol Taiwan Corporation Transformer
USD538445S1 (en) * 2006-01-13 2007-03-13 Joan Perotti Landscape edging block
USD556686S1 (en) * 2006-04-27 2007-12-04 Hitachi, Ltd. Power module for power inverter
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD590339S1 (en) * 2008-04-25 2009-04-14 System General Corporation Controller with DC brushless motor
USD648684S1 (en) * 2011-04-30 2011-11-15 Cheng Uei Precision Industry Co., Ltd. Plug connector
USD684927S1 (en) * 2012-05-16 2013-06-25 Lem Intellectual Property Sa Current transducer
USD686989S1 (en) * 2012-05-16 2013-07-30 Lem Intellectual Property Sa Current transducer
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD742321S1 (en) * 2014-07-09 2015-11-03 Dai-Ichi Seiko Co., Ltd. Electric connector
USD777123S1 (en) * 2014-07-24 2017-01-24 Allen-Vanguard Corporation Mezzanine board
USD765797S1 (en) * 2014-08-19 2016-09-06 Matej Banik Set of building blocks
USD792845S1 (en) * 2015-07-02 2017-07-25 Flexterra, Inc. Charging stand
USD824866S1 (en) * 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
JP1633806S (enrdf_load_stackoverflow) * 2018-10-29 2019-06-10

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* Cited by examiner, † Cited by third party
Title
"Integrated circuit element," Panasonic Corporation, Japan, Known Document No. HJ 2105279300, http://www.semicon.panasonic.co.jp/jp/pr/09Nov/USSMini3/index.html, Dec. 22, 2009, 3 pages including English translation.
"Light emitting diode driver," Rohm Co., Ltd., Japan, Known Document No. HC2201153000, Nov. 17, 2010, 3 pages including English translation.
"Semiconductor element," Vishay Intertechnology, Inc., United States of America, Known Document No. HJ2402218400, http://www.vishay.com/docs/89458/sma6f5.pdf, Jul. 27, 2012, 3 pages including English translation.
Company Information News Release/Ricoh Japan, Ricoh Ltd., Japan, Known Material No. HJ1803732900, http://www.ricoh.co.jp./release/by_field/device/2007/0219.html, Mar. 17, 2007, 10 pages with machine translation of News Release. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
High Efficiency Fast Recovery Diode/Latest Information/Rohm of Semi-Conductors, Rohm Co., Ltd., Japan, Known Material No. HJ2302123300, http://www.rohm.co.jp/ad/frd/index.html, Aug. 8, 2011. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
News/Rohm, Rohm Co., Ltd., Japan, Known Material No. HJ1900884800, http://www.rohm.co.jp/news/070329.html, May 8, 2007. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
Republic of Korea Design Trademark Publication, Republic of Korea, Known Material No. HH1851414100, Apr. 5, 2006. (Claims priority from JP1267586S cited herein. Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these).
Short Form Catalog, Rohm Co., Ltd., Japan, Known Material No. HC0601657500, Oct. 31, 1994. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
The General Catalog, Renesas East Japan Semiconductor, Japan, Known Material No. HC1903390400, Mar. 12, 2008. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
Toshiba Review, Toshiba, Japan, Known Material No. HA0101519700, Mar. 1, 1989. (Applicant was notified by the Examiner of the JPO that these references were reviewed during the examination of the corresponding applications in Japan, without information of the reasons for the review of these references).
Wikipedia Photodiode, [online], [retrieved on Dec. 2, 2019]. Retrieved from Internet ,<URL: https://en.wikipedia.org/wiki/Photodiode>. *
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
US12224218B2 (en) 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
USD1056862S1 (en) * 2022-08-24 2025-01-07 Wolfspeed, Inc. Semiconductor package

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