USD829673S1 - Combined liquid cooling cold plate and vapor chamber - Google Patents

Combined liquid cooling cold plate and vapor chamber Download PDF

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Publication number
USD829673S1
USD829673S1 US29/624,683 US201729624683F USD829673S US D829673 S1 USD829673 S1 US D829673S1 US 201729624683 F US201729624683 F US 201729624683F US D829673 S USD829673 S US D829673S
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United States
Prior art keywords
liquid cooling
cold plate
vapor chamber
combined liquid
cooling cold
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US29/624,683
Inventor
Ali Mira
Yashar Mira
Michael Mira
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HEATSCAPE, LLC
Original Assignee
HeatscapeCom Inc
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Priority to US29/624,683 priority Critical patent/USD829673S1/en
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Assigned to HEATSCAPE, LLC reassignment HEATSCAPE, LLC CHANGE OF NAME Assignors: HEATSCAPE.COM, INC.
Assigned to EAST WEST BANK reassignment EAST WEST BANK SECURITY INTEREST Assignors: HEATSCAPE, LLC
Active legal-status Critical Current
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Description

FIG. 1 is a top perspective view of a combined liquid cooling cold plate and vapor chamber showing our new design;
FIG. 2 is a top perspective disassembled view corresponding to FIG. 1;
FIG. 3 is a left side elevational view of FIG. 1;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a front elevational view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a combined liquid cooling cold plate and vapor chamber, as shown and described.
US29/624,683 2016-02-22 2017-11-02 Combined liquid cooling cold plate and vapor chamber Active USD829673S1 (en)

Priority Applications (1)

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US29/624,683 USD829673S1 (en) 2016-02-22 2017-11-02 Combined liquid cooling cold plate and vapor chamber

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US29/555,494 USD803169S1 (en) 2016-02-22 2016-02-22 Combined liquid cooling cold plate and vapor chamber
US29/624,683 USD829673S1 (en) 2016-02-22 2017-11-02 Combined liquid cooling cold plate and vapor chamber

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US29/555,494 Division USD803169S1 (en) 2016-02-22 2016-02-22 Combined liquid cooling cold plate and vapor chamber

Publications (1)

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USD829673S1 true USD829673S1 (en) 2018-10-02

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US29/624,683 Active USD829673S1 (en) 2016-02-22 2017-11-02 Combined liquid cooling cold plate and vapor chamber

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US29/555,494 Active USD803169S1 (en) 2016-02-22 2016-02-22 Combined liquid cooling cold plate and vapor chamber

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD848960S1 (en) * 2017-11-10 2019-05-21 Auras Technology Co., Ltd. Water cooling radiator
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
USD971862S1 (en) 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
US11602078B1 (en) * 2022-02-17 2023-03-07 Marcellus Lloyd Clifton, III System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport
USD1110287S1 (en) * 2024-02-21 2026-01-27 Bitspower International Co., Ltd. Computer cooling device

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
US20080007915A1 (en) * 2006-07-06 2008-01-10 Chao-Chuan Chen Heat sink device for a heat generating element
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20120261095A1 (en) * 2011-04-12 2012-10-18 Asia Vital Components Co., Ltd. Thermal module structure and manufacturing method thereof
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
US20160327996A1 (en) * 2015-05-08 2016-11-10 Fujitsu Limited Cooling module and electronic device
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
US20160366788A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
US20160363967A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation device thereof
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD778852S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080007915A1 (en) * 2006-07-06 2008-01-10 Chao-Chuan Chen Heat sink device for a heat generating element
USD561711S1 (en) * 2006-12-08 2008-02-12 Thermaltake Technology Co., Ltd. Heat sink
USD553170S1 (en) * 2007-02-09 2007-10-16 Amulaire Thermal Technology, Inc Cold plate heat sink
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US20090044929A1 (en) * 2007-08-15 2009-02-19 Xigmatek Co., Ltd Liquid cooling module
US20090268409A1 (en) * 2008-04-28 2009-10-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation assembly
US20120261095A1 (en) * 2011-04-12 2012-10-18 Asia Vital Components Co., Ltd. Thermal module structure and manufacturing method thereof
USD715747S1 (en) * 2013-09-06 2014-10-21 Mitsubishi Electric Corporation Cooling jacket
USD715750S1 (en) * 2013-11-26 2014-10-21 Kilpatrick Townsend & Stockton Llp Power heat sink with imbedded fly cut heat pipes
USD778852S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US20160118317A1 (en) * 2014-10-27 2016-04-28 Ebullient, Llc Microprocessor assembly adapted for fluid cooling
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
US20160327996A1 (en) * 2015-05-08 2016-11-10 Fujitsu Limited Cooling module and electronic device
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
US20160366788A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Liquid supply mechanism and liquid cooling system
US20160363967A1 (en) * 2015-06-11 2016-12-15 Cooler Master Co., Ltd. Electronic device and liquid cooling heat dissipation device thereof
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD848960S1 (en) * 2017-11-10 2019-05-21 Auras Technology Co., Ltd. Water cooling radiator
USD971862S1 (en) 2018-12-28 2022-12-06 Furukawa Electric Co., Ltd. Heatsink
USD954005S1 (en) * 2019-09-12 2022-06-07 Furukawa Electric Co., Ltd. Heatsink
US11602078B1 (en) * 2022-02-17 2023-03-07 Marcellus Lloyd Clifton, III System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport
USD1110287S1 (en) * 2024-02-21 2026-01-27 Bitspower International Co., Ltd. Computer cooling device

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