USD829673S1 - Combined liquid cooling cold plate and vapor chamber - Google Patents
Combined liquid cooling cold plate and vapor chamber Download PDFInfo
- Publication number
- USD829673S1 USD829673S1 US29/624,683 US201729624683F USD829673S US D829673 S1 USD829673 S1 US D829673S1 US 201729624683 F US201729624683 F US 201729624683F US D829673 S USD829673 S US D829673S
- Authority
- US
- United States
- Prior art keywords
- liquid cooling
- cold plate
- vapor chamber
- combined liquid
- cooling cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a combined liquid cooling cold plate and vapor chamber, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/624,683 USD829673S1 (en) | 2016-02-22 | 2017-11-02 | Combined liquid cooling cold plate and vapor chamber |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/555,494 USD803169S1 (en) | 2016-02-22 | 2016-02-22 | Combined liquid cooling cold plate and vapor chamber |
| US29/624,683 USD829673S1 (en) | 2016-02-22 | 2017-11-02 | Combined liquid cooling cold plate and vapor chamber |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/555,494 Division USD803169S1 (en) | 2016-02-22 | 2016-02-22 | Combined liquid cooling cold plate and vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD829673S1 true USD829673S1 (en) | 2018-10-02 |
Family
ID=60312954
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/555,494 Active USD803169S1 (en) | 2016-02-22 | 2016-02-22 | Combined liquid cooling cold plate and vapor chamber |
| US29/624,683 Active USD829673S1 (en) | 2016-02-22 | 2017-11-02 | Combined liquid cooling cold plate and vapor chamber |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/555,494 Active USD803169S1 (en) | 2016-02-22 | 2016-02-22 | Combined liquid cooling cold plate and vapor chamber |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | USD803169S1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD848960S1 (en) * | 2017-11-10 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling radiator |
| USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
| USD971862S1 (en) | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
| US11602078B1 (en) * | 2022-02-17 | 2023-03-07 | Marcellus Lloyd Clifton, III | System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport |
| USD1110287S1 (en) * | 2024-02-21 | 2026-01-27 | Bitspower International Co., Ltd. | Computer cooling device |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
| US20080007915A1 (en) * | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
| USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
| USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
| US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
| US20090268409A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation assembly |
| US20120261095A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
| USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
| USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
| US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
| US20160327996A1 (en) * | 2015-05-08 | 2016-11-10 | Fujitsu Limited | Cooling module and electronic device |
| USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
| USD773408S1 (en) * | 2015-06-11 | 2016-12-06 | Ebullient, Inc. | Redundant heat sink module |
| US20160366788A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
| US20160363967A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
| USD774473S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
| USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
-
2016
- 2016-02-22 US US29/555,494 patent/USD803169S1/en active Active
-
2017
- 2017-11-02 US US29/624,683 patent/USD829673S1/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080007915A1 (en) * | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
| USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
| USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
| USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
| US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
| US20090268409A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation assembly |
| US20120261095A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
| USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
| USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
| USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
| US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
| US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
| USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
| US20160327996A1 (en) * | 2015-05-08 | 2016-11-10 | Fujitsu Limited | Cooling module and electronic device |
| USD774473S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
| USD773408S1 (en) * | 2015-06-11 | 2016-12-06 | Ebullient, Inc. | Redundant heat sink module |
| US20160366788A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
| US20160363967A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
| USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD848960S1 (en) * | 2017-11-10 | 2019-05-21 | Auras Technology Co., Ltd. | Water cooling radiator |
| USD971862S1 (en) | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
| USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
| US11602078B1 (en) * | 2022-02-17 | 2023-03-07 | Marcellus Lloyd Clifton, III | System for a remote, active phase-transition cooling system utilizing a solid-state modular connector system as a method for heat-transport |
| USD1110287S1 (en) * | 2024-02-21 | 2026-01-27 | Bitspower International Co., Ltd. | Computer cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| USD803169S1 (en) | 2017-11-21 |
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Legal Events
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|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
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| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |