US20120261095A1

US20120261095A1 - Thermal module structure and manufacturing method thereof

Info

Publication number: US20120261095A1
Application number: US13/084,559
Authority: US
Inventors: Chun-Ming Wu
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2011-04-12
Filing date: 2011-04-12
Publication date: 2012-10-18

Abstract

A thermal module structure and a manufacturing method thereof. The thermal module includes a plastic layer and at least one heat pipe. The plastic layer has at least one channel and multiple locking sections. The heat pipe is disposed in the channel. The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost.

Description

FIELD OF THE INVENTION

The present invention relates to a thermal module structure and a manufacturing method thereof. The thermal module structure has lighter weight and is manufactured at lower material cost.

BACKGROUND OF THE INVENTION

Following the advance of the electronic technique, electronic components have higher and higher operation efficiency. To catch up this trend, the functional requirements for the heat dissipation unit have become higher and higher. Most of the conventional heat dissipation units have adopted stacked fin assemblies for enhancing heat dissipation effect. Many manufacturers have devoted to the research and development of high-performance heat dissipation units and tried to provide improved heat dissipation units with higher heat dissipation effect. The heat dissipation unit is positioned on an electronic component to dissipate the heat generated by the electronic component. The heat dissipation unit is generally a heat sink or a radiating fin assembly equipped with a cooling fan for dissipating the heat. Heat pipes can be further serially connected with the heat dissipation unit to conduct the heat to a remote place for dissipating the heat.
With a computer mainframe taken as an example, the central processing unit (CPU) in the computer mainframe generates most of the heat generated by the computer mainframe in operation. In case the heat is not efficiently dissipated, the temperature of the CPU will rise very quickly to cause deterioration of the execution efficiency. When the accumulated heat exceeds a tolerable limit, the computer will crash or even burn down in some more serious cases. Moreover, for solving the problem of electromagnetic radiation, the computer mainframe is often enclosed in a computer case. This will affect the dissipation of the heat generated by the computer mainframe. Therefore, it has become a critical issue how to quickly conduct out and dissipate the heat generated by the CPU and other heat-generating components.
A conventional thermal module mainly includes a heat conduction substrate and at least one heat pipe. The heat conduction substrate is integrally made of metal material and formed with multiple fixing holes on lateral sides. The heat pipe is fixed with the heat conduction substrate and the thermal module is fixedly mounted on a heat source. The heat pipe is attached to the heat source to conduct the heat generated by the heat source. Alternatively, the heat conduction substrate is attached to the heat source to conduct the heat to the heat pipe to achieve heat dissipation effect.
Currently, there is a trend to develop slimmer and slimmer electronic devices for easy carriage. Following the miniaturization of the electronic devices, it is necessary for the heat dissipation units for dissipating the heat generated by the electronic components to become slimmer and slimmer as well as lighter and lighter. However, the heat conduction substrate is integrally made of metal material and has heavier weight. Moreover, the metal-made heat conduction substrate is manufactured at higher material cost. Accordingly, the conventional thermal module has the following defects:

- 1. The heat conduction substrate is integrally made of metal material and has heavier weight.
- 2. The metal-made heat conduction substrate is manufactured at higher material cost.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide a thermal module structure and a manufacturing method thereof. The thermal module structure as a whole has a lighter weight.
A further object of the present invention is to provide the above thermal module structure and the manufacturing method thereof. The thermal module structure is manufactured at lower material cost.
To achieve the above and other objects, thermal module structure of the present invention includes a plastic layer and at least one heat pipe. The plastic layer has a bottom face and at least one channel formed on the bottom face. At least one locking section is formed on each lateral side of the plastic layer. The channel has a closed side and an open side. The heat pipe is disposed in the channel. The heat pipe has a heat absorption end and a heat dissipation end at two ends. The heat absorption end has a contact face corresponding to the open side and an inlay face correspondingly connected to the closed side.
The manufacturing method of the thermal module of the present invention includes steps of providing at least one heat pipe; forming a plastic layer on the heat pipe; and coating the heat absorption end of the heat pipe with the plastic layer to form an open side corresponding to a contact face of the heat absorption end. At least one locking section is formed on each lateral side of the plastic layer.
The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost.
Accordingly, the present invention has the following advantages:

- 1. The thermal module as a whole has a lighter weight.
- 2. The thermal module is manufactured at lower material cost.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:

FIG. 1 is a perspective view of a first embodiment of the thermal module structure of the present invention;

FIG. 2 is a sectional view of the first embodiment of the thermal module structure of the present invention;

FIG. 3 is a flow chart of a first embodiment of the manufacturing method of the thermal module structure of the present invention;

FIG. 4 is a perspective view of a second embodiment of the thermal module structure of the present invention;

FIG. 5 is a sectional view of the second embodiment of the thermal module structure of the present invention;

FIG. 6 is a flow chart of a second embodiment of the manufacturing method of the thermal module structure of the present invention;

FIG. 7 is a perspective view of a third embodiment of the thermal module structure of the present invention;

FIG. 8 is a sectional view of the third embodiment of the thermal module structure of the present invention;

FIG. 9 is a sectional view of the third embodiment of the thermal module structure of the present invention in another aspect;

FIG. 10 is a perspective view of a fourth embodiment of the thermal module structure of the present invention; and

FIG. 11 is a sectional view of the fourth embodiment of the thermal module structure of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1, 2 and 3. FIG. 1 is a perspective view of the thermal module structure of the present invention. FIG. 2 is a sectional view of the thermal module structure of the present invention. FIG. 3 is a flow chart of the manufacturing method of the thermal module structure of the present invention. According to a preferred embodiment, the thermal module structure 10 of the present invention includes a plastic layer 20 and at least one heat pipe 30. The plastic layer 20 has a bottom face 22 and at least one channel 21 formed on the bottom face 22. Multiple locking sections 23 are formed on two lateral sides of the plastic layer 20. The channel 21 has a closed side 211 and an open side 212. The heat pipe 30 is disposed in the channel 21 and attached to the closed side 211 thereof. The heat pipe 30 has a heat absorption end 31 and a heat dissipation end (not shown). A bottom section of the heat absorption end 31 has a contact face 311 corresponding to the open side 212, while a top section of the heat absorption end 31 has an inlay face 312 correspondingly connected to the closed side 211. In this embodiment, the contact face 311 is a plane face positioned in the open side 212 and extending to the bottom face 22.
Accordingly, when assembling the thermal module 10 with a heat source to dissipate the heat generated by the heat source, the contact face 311 of the heat absorption end 31 of the heat pipe 30 is attached to the heat source. Then the locking sections 23 of the lateral sides of the plastic layer 20 are locked on the heat source by means of locking members and cooperative springs (not shown). In this case, the heat pipe 30 can conduct the heat generated by the heat source. The thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost.
The manufacturing method of the thermal module 10 of the present invention includes:

- step SP11: providing at least one heat pipe;
- step SP12: forming a plastic layer on the heat pipe; and
- step SP13: coating the heat absorption end of the heat pipe with the plastic layer to form an open side corresponding to a contact face of the heat absorption end.

According to the above steps, at least one heat pipe 30 is first provided. The heat pipe 30 has the heat absorption end 31 and a heat dissipation end at two ends. The heat absorption end 31 has the contact face 311 and an inlay face 312. The plastic layer 20 is formed at the heat absorption end 31 by means of plastic injection molding. The plastic layer 20 is formed with the channel 21 and locking sections 23 corresponding to the heat absorption end 31. The channel 21 has a closed side 211 and an open side 212 on the bottom face 22 of the plastic layer 20. The closed side 211 corresponds to the inlay face 312, while the open side 212 corresponds to the contact face 311 in flush with the bottom face 22. The locking sections 23 are locked on the heat source by means of locking members and cooperative springs (not shown) to lock the thermal module 10 on the heat source. Accordingly, the heat pipe 30 can conduct the heat generated by the heat source and the thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost.
Please now refer to FIGS. 4, 5 and 6, which show a second embodiment of the present invention. The structure and the connection relationship between the components of the second embodiment are substantially identical to that of the first embodiment and thus will not be repeatedly described hereinafter. The second embodiment is only different from the first embodiment in that the thermal module 10 further includes a metal layer 40 having a first face and a second face. The metal layer 40 is inlaid in the plastic layer 20 with the first face in contact with the contact face 311 of the heat absorption end 31 corresponding to the open side 212 and with the second face in flush with the bottom face 22 of the plastic layer 20.
Accordingly, when assembling the thermal module 10 with a heat source to dissipate the heat generated by the heat source, the metal layer 40 is attached to the heat source to absorb the heat generated by the heat source and conduct the heat to the heat pipe 30. The locking sections 23 of the lateral sides of the plastic layer 20 are locked on the heat source, whereby the heat pipe 30 can conduct the heat generated by the heat source. The thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost.
Accordingly, the manufacturing method of the thermal module 10 of the present invention includes:

- step SP21: providing at least one heat pipe and a metal layer;
- step SP22: forming a plastic layer on the heat pipe and the metal layer; and
- step SP23: coating the heat absorption end of the heat pipe and the metal layer with the plastic layer to form an open side corresponding to a contact face of the heat absorption end and the metal layer.

According to the above steps, at least one heat pipe 30 and a metal layer 40 are first provided. The heat pipe 30 has the heat absorption end 31 and a heat dissipation end at two ends. The heat absorption end 31 has the contact face 311 and an inlay face 312. The plastic layer 20 is formed at the heat absorption end 31 and the metal layer 40 by means of plastic injection molding. The plastic layer 20 is formed with the channel 21 and locking sections 23 corresponding to the heat absorption end 31. The channel 21 has a closed side 211 and an open side 212 on the bottom face 22 of the plastic layer 20. The closed side 211 corresponds to the inlay face 312, while the open side 212 corresponds to the contact face 311 and the first face of the metal layer 40. The second face of the metal layer 40 is in flush with the bottom face 22 of the plastic layer 20. The locking sections 23 are locked on the heat source, whereby the heat pipe 30 can conduct the heat generated by the heat source and the thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost.
Please now refer to FIGS. 7, 8 and 9, which show a third embodiment of the present invention. The structure and the connection relationship between the components of the third embodiment are substantially identical to that of the second embodiment and thus will not be repeatedly described hereinafter. The third embodiment is only different from the second embodiment in that the metal layer 40 is formed with at least one locking section 41 instead of the locking section 23 formed on the plastic layer 20 (as shown in FIG. 5). The locking section 41 is exposed to outer side of the plastic layer 20. The metal layer 40 is inlaid in the plastic layer 20 with first face in contact with the contact face 311 of the heat absorption end 31 corresponding to the open side 212 and with the second face in flush with the bottom face 22 of the plastic layer 20. The locking section 41 is locked on the heat source by means of locking members and cooperative springs (not shown) to lock the thermal module 10 on the heat source with the metal layer 40 attached to the heat source. Accordingly, the heat pipe 30 can conduct the heat generated by the heat source and the thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost. Alternatively, as shown in FIG. 9, the locking section 41 can have the form of a leaf spring obliquely extending from the metal layer 40 by a certain angle. After the locking section 41 is pressed relative to the plastic layer 20, a rebounding effect is provided, whereby the thermal module 10 can be assembled with the heat source without using any spring. Accordingly, the assembling cost is lowered.
Please now refer to FIGS. 10 and 11, which show a fourth embodiment of the present invention. The structure and the connection relationship between the components of the fourth embodiment are substantially identical to that of the second embodiment and thus will not be repeatedly described hereinafter. The fourth embodiment is only different from the second embodiment in that the metal layer 40 is disposed between the plastic layer 20 and the heat pipe 30. The inlay face 312 of the heat absorption end 31 of the heat pipe 30 and the metal layer 40 are correspondingly connected to the closed side 211, while the contact face 311 corresponds to the open side 212. The contact face 311 is coplanar with the metal layer 40 in flush with the bottom face 22. Similarly, the locking section 23 is locked on the heat source and the heat pipe serves to conduct the heat generated by the heat source. The thermal module 10 as a whole has a lighter weight and is manufactured at lower material cost.
The above embodiments are only used to illustrate the present invention, not intended to limit the scope thereof. It is understood that many changes and modifications of the above embodiments can be made without departing from the spirit of the present invention. The scope of the present invention is limited only by the appended claims.

Claims

1. A thermal module structure comprising:

a plastic layer formed with at least one channel, the channel having a closed side and an open side; and

at least one heat pipe having a heat absorption end and a heat dissipation end, the heat absorption end having a contact face corresponding to the open side and an inlay face correspondingly connected to the closed side.

2. The thermal module structure as claimed in claim 1, wherein the plastic layer has a bottom face.

3. The thermal module structure as claimed in claim 1, further comprising a metal layer inlaid in the plastic layer.

4. The thermal module structure as claimed in claim 3, wherein the metal layer is disposed between the plastic layer and the heat pipe.

5. The thermal module structure as claimed in claim 3, wherein the plastic layer is disposed on one side of the heat pipe, while the metal layer is disposed on the other side of the heat pipe.

6. The thermal module structure as claimed in claim 1, wherein the plastic layer is further formed with at least one locking section.

7. The thermal module structure as claimed in claim 3, wherein the metal layer has at least one locking section exposed to outer side of the plastic layer.

8. The thermal module structure as claimed in claim 1, wherein the plastic layer is integrally formed by means of plastic injection molding.

9. A manufacturing method of a thermal module, comprising steps of:

providing at least one heat pipe;

forming a plastic layer on the heat pipe; and

coating the heat absorption end of the heat pipe with the plastic layer to form an open side corresponding to a contact face of the heat absorption end.

10. The manufacturing method of the thermal module as claimed in claim 9, wherein in the step of forming the plastic layer, at least one locking section is formed on a lateral side of the plastic layer.

11. The manufacturing method of the thermal module as claimed in claim 9, wherein in the step of forming the plastic layer, the plastic layer is formed with a bottom face on one side of the heat pipe.

12. The manufacturing method of the thermal module as claimed in claim 9, wherein in the step of forming the plastic layer, a metal layer is further disposed on one side of the heat pipe.

13. The manufacturing method of the thermal module as claimed in claim 12, wherein the metal layer is disposed between the plastic layer and the heat pipe.

14. The manufacturing method of the thermal module as claimed in claim 12, wherein the metal layer is positioned on the bottom face of the plastic layer.

15. The manufacturing method of the thermal module as claimed in claim 12, wherein the metal layer is exposed to outer side of the plastic layer and has at least one locking section.

16. The manufacturing method of the thermal module as claimed in claim 9, wherein the plastic layer is integrally formed by means of plastic injection molding.