USD813181S1 - Cover of seal cap for reaction chamber of semiconductor - Google Patents

Cover of seal cap for reaction chamber of semiconductor Download PDF

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Publication number
USD813181S1
USD813181S1 US29/591,907 US201729591907F USD813181S US D813181 S1 USD813181 S1 US D813181S1 US 201729591907 F US201729591907 F US 201729591907F US D813181 S USD813181 S US D813181S
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United States
Prior art keywords
cover
semiconductor
reaction chamber
seal cap
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/591,907
Inventor
Yusaku OKAJIMA
Shuhei SAIDO
Mika URUSHIHARA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
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Publication date
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Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: URUSHIHARA, Mika, OKAJIMA, YUSAKU, SAIDO, SHUHEI
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Publication of USD813181S1 publication Critical patent/USD813181S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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Description

FIG. 1 is a front, top and right side perspective view of a cover of seal cap for reaction chamber of semiconductor showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a left side elevational view; and,
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 4.

Claims (1)

    CLAIM
  1. The ornamental design for a cover of seal cap for reaction chamber of semiconductor, as shown and described.
US29/591,907 2016-07-26 2017-01-25 Cover of seal cap for reaction chamber of semiconductor Active USD813181S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP015868/2016 2016-07-26
JP2016015868 2016-07-26

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USD813181S1 true USD813181S1 (en) 2018-03-20

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US29/591,907 Active USD813181S1 (en) 2016-07-26 2017-01-25 Cover of seal cap for reaction chamber of semiconductor

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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD855027S1 (en) 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
USD602886S1 (en) * 2008-10-08 2009-10-27 Atheros Communications, Inc. Shield design
US20110018160A1 (en) * 2009-07-24 2011-01-27 Ziberna Frank J Method of Producing Covers for Electronics
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20160157359A1 (en) * 2014-11-07 2016-06-02 International Business Machines Corporation Customized module lid
US20170170030A1 (en) * 2015-12-09 2017-06-15 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
USD602886S1 (en) * 2008-10-08 2009-10-27 Atheros Communications, Inc. Shield design
US20110018160A1 (en) * 2009-07-24 2011-01-27 Ziberna Frank J Method of Producing Covers for Electronics
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
US20160157359A1 (en) * 2014-11-07 2016-06-02 International Business Machines Corporation Customized module lid
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20170170030A1 (en) * 2015-12-09 2017-06-15 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD855027S1 (en) 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933032S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933031S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus

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