USD804435S1 - Flap in an adhesive tape for semiconductor manufacturing - Google Patents

Flap in an adhesive tape for semiconductor manufacturing Download PDF

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Publication number
USD804435S1
USD804435S1 US29/491,391 US201429491391F USD804435S US D804435 S1 USD804435 S1 US D804435S1 US 201429491391 F US201429491391 F US 201429491391F US D804435 S USD804435 S US D804435S
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US
United States
Prior art keywords
flap
adhesive tape
semiconductor manufacturing
view
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/491,391
Inventor
Kouhei Taniguchi
Takayuki Matsuzaki
Shinya Katou
Kouji Komorida
Michio Mashino
Tatsuya Sakuta
Rie Katou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US29/389,787 external-priority patent/USD686477S1/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to US29/491,391 priority Critical patent/USD804435S1/en
Assigned to HITACHI CHEMICAL COMPANY LTD. reassignment HITACHI CHEMICAL COMPANY LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATOU, RIE, KATOU, SHINYA, KOMORIDA, KOUJI, MASHINO, MICHIO, MATSUZAKI, TAKAYUKI, SAKUTA, TATSUYA, TANIGUCHI, KOUHEI
Application granted granted Critical
Publication of USD804435S1 publication Critical patent/USD804435S1/en
Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. CHANGE OF NAME Assignors: HITACHI CHEMICAL COMPANY, LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME Assignors: SHOWA DENKO MATERIALS CO., LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of a flap in an adhesive tape for semiconductor manufacturing incorporating our new design;
FIG. 2 is a bottom plan view of the flap of FIG. 1;
FIG. 3 is a cross-sectional view taken at line 3-3 in FIG. 1;
FIG. 4 is an enlarged view of portion 4-4, 4-4 in FIG. 1; and,
FIG. 5 is a perspective view of the flap in use.
The broken lines are included for the purpose of illustrating environmental structure and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a flap in an adhesive tape for semiconductor manufacturing, as shown and described.
US29/491,391 2010-10-15 2014-05-20 Flap in an adhesive tape for semiconductor manufacturing Active USD804435S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/491,391 USD804435S1 (en) 2010-10-15 2014-05-20 Flap in an adhesive tape for semiconductor manufacturing

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPD2010-024764 2010-10-15
JP2010024764 2010-10-15
US29/389,787 USD686477S1 (en) 2011-04-15 2011-04-15 Scissor handles
US29413518 2012-02-16
US29/491,391 USD804435S1 (en) 2010-10-15 2014-05-20 Flap in an adhesive tape for semiconductor manufacturing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29413518 Continuation 2010-10-15 2012-02-16

Publications (1)

Publication Number Publication Date
USD804435S1 true USD804435S1 (en) 2017-12-05

Family

ID=60451705

Family Applications (1)

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US29/491,391 Active USD804435S1 (en) 2010-10-15 2014-05-20 Flap in an adhesive tape for semiconductor manufacturing

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US (1) USD804435S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

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USD258019S (en) * 1978-02-21 1981-01-20 Wilmatchka Baronet Decorative strip
USD287683S (en) * 1983-12-23 1987-01-13 Syracuse China Corporation Decal for a plate or similar article
US5624033A (en) * 1994-07-11 1997-04-29 Fuji Photo Film Co., Ltd. Package for film product
USD392330S (en) * 1996-04-01 1998-03-17 Sucese Michael J Medallion holding plate with eccentrically headed screws
USD395641S (en) * 1996-12-02 1998-06-30 PFI Vacuum Forming Inc. Circular computer testing and carrying pallet
US5771524A (en) * 1996-12-31 1998-06-30 M.J. Woods, Inc. Disposable pad
US6464815B1 (en) * 2000-05-05 2002-10-15 Wallace J. Beaudry Method of manufacturing laminated pad
US6493898B1 (en) * 1998-12-09 2002-12-17 M. J. Woods, Inc. Laminated pads and methods of manufacture employing mechanically folded handles
USD480811S1 (en) * 2001-11-06 2003-10-14 Boehringer Ingelheim Pharmaceuticals, Inc. Adhesive patch
USD490470S1 (en) 2003-03-18 2004-05-25 Kenichi Fujii Adhesive tape
USD490854S1 (en) 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
USD490855S1 (en) 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
USD491228S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491227S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491226S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491229S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD492354S1 (en) 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
USD493838S1 (en) 2003-03-18 2004-08-03 Kenichi Fujii Adhesive tape
US6864295B2 (en) * 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
USD529096S1 (en) * 2005-03-02 2006-09-26 Jordan Neuroscience, Inc. Decal for an electroencephalogram jack box
USD544607S1 (en) * 2005-03-08 2007-06-12 Henry Steven D Medicine dispensing patch
USD549189S1 (en) * 2004-09-21 2007-08-21 Nitto Denko Corporation Dicing die-bonding film
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
US9076832B2 (en) * 2010-10-15 2015-07-07 Hitachi Chemical Company, Ltd. Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device

Patent Citations (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD258019S (en) * 1978-02-21 1981-01-20 Wilmatchka Baronet Decorative strip
USD287683S (en) * 1983-12-23 1987-01-13 Syracuse China Corporation Decal for a plate or similar article
US5624033A (en) * 1994-07-11 1997-04-29 Fuji Photo Film Co., Ltd. Package for film product
USD392330S (en) * 1996-04-01 1998-03-17 Sucese Michael J Medallion holding plate with eccentrically headed screws
USD395641S (en) * 1996-12-02 1998-06-30 PFI Vacuum Forming Inc. Circular computer testing and carrying pallet
US5771524A (en) * 1996-12-31 1998-06-30 M.J. Woods, Inc. Disposable pad
US6493898B1 (en) * 1998-12-09 2002-12-17 M. J. Woods, Inc. Laminated pads and methods of manufacture employing mechanically folded handles
US6464815B1 (en) * 2000-05-05 2002-10-15 Wallace J. Beaudry Method of manufacturing laminated pad
USD480811S1 (en) * 2001-11-06 2003-10-14 Boehringer Ingelheim Pharmaceuticals, Inc. Adhesive patch
US6864295B2 (en) * 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
USD490470S1 (en) 2003-03-18 2004-05-25 Kenichi Fujii Adhesive tape
USD490855S1 (en) 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
USD491228S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491227S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491226S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD491229S1 (en) 2003-03-18 2004-06-08 Kenichi Fujii Adhesive tape
USD492354S1 (en) 2003-03-18 2004-06-29 Kenichi Fujii Adhesive tape
USD493838S1 (en) 2003-03-18 2004-08-03 Kenichi Fujii Adhesive tape
USD490854S1 (en) 2003-03-18 2004-06-01 Kenichi Fujii Adhesive tape
US20070241436A1 (en) 2004-05-18 2007-10-18 Keisuke Ookubo Adhesive Bonding Sheet, Semiconductor Device using the Same, and Method for Manufacturing such Semiconductor Device
USD549189S1 (en) * 2004-09-21 2007-08-21 Nitto Denko Corporation Dicing die-bonding film
USD529096S1 (en) * 2005-03-02 2006-09-26 Jordan Neuroscience, Inc. Decal for an electroencephalogram jack box
USD544607S1 (en) * 2005-03-08 2007-06-12 Henry Steven D Medicine dispensing patch
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
USD621803S1 (en) * 2008-07-16 2010-08-17 The Furukawa Electric Co., Ltd. Semiconductor wafer processing tape
USD628170S1 (en) * 2008-07-16 2010-11-30 The Furukawa Electric Company Semiconductor wafer processing tape
US20100080989A1 (en) 2008-10-01 2010-04-01 Nitto Denko Corporation Pressure-sensitive adhesive sheet for laser processing and method for laser processing
USD621051S1 (en) * 2008-10-17 2010-08-03 Kinesio IP, LLC Adhesive tape
USD656909S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD656910S1 (en) * 2010-10-15 2012-04-03 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664511S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD664512S1 (en) * 2010-10-15 2012-07-31 Hitachi Chemical Comapany, Ltd. Adhesive tape for semiconductor manufacturing
USD680505S1 (en) * 2010-10-15 2013-04-23 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD689831S1 (en) * 2010-10-15 2013-09-17 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
USD690278S1 (en) * 2010-10-15 2013-09-24 Hitachi Chemical Company, Ltd. Adhesive tape for semiconductor manufacturing
US9076832B2 (en) * 2010-10-15 2015-07-07 Hitachi Chemical Company, Ltd. Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD998577S1 (en) 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

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