USD493838S1 - Adhesive tape - Google Patents

Adhesive tape Download PDF

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Publication number
USD493838S1
USD493838S1 US29/177,839 US17783903F USD493838S US D493838 S1 USD493838 S1 US D493838S1 US 17783903 F US17783903 F US 17783903F US D493838 S USD493838 S US D493838S
Authority
US
United States
Prior art keywords
adhesive tape
elevational view
view
top plan
bottom plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/177,839
Inventor
Kenichi Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/177,839 priority Critical patent/USD493838S1/en
Application granted granted Critical
Publication of USD493838S1 publication Critical patent/USD493838S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of an adhesive tape showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan thereof;
FIG. 6 is a front elevational view thereof, wherein the upper portion of the embodiment of FIG. 1 is folded rearward;
FIG. 7 is a top plan view thereof;
FIG. 8 is a right side elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a bottom plan thereof;
FIG. 11 is a front elevational view of a second embodiment of an adhesive tape showing my new design;
FIG. 12 is a top plan view thereof;
FIG. 13 is a right side elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a bottom plan thereof;
FIG. 16 is a front elevational view thereof, wherein the upper portion of the embodiment of FIG. 11 is folded rearward;
FIG. 17 is a top plan view thereof;
FIG. 18 is a right side elevational view thereof;
FIG. 19 is a rear elevational view thereof; and,
FIG. 20 is a bottom plan thereof.
The portions of FIGS. 1-20 shown as even broken lines are for illustrative purposes only and form no part of claimed design. Moreover, the portions of FIGS. 1-20 shown as dot-dash broken lines define, but are not included in, the boundaries of the claimed design.

Claims (1)

  1. The ornamental design for an adhesive tape, as shown and described.
US29/177,839 2003-03-18 2003-03-18 Adhesive tape Expired - Lifetime USD493838S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/177,839 USD493838S1 (en) 2003-03-18 2003-03-18 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/177,839 USD493838S1 (en) 2003-03-18 2003-03-18 Adhesive tape

Publications (1)

Publication Number Publication Date
USD493838S1 true USD493838S1 (en) 2004-08-03

Family

ID=32769832

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/177,839 Expired - Lifetime USD493838S1 (en) 2003-03-18 2003-03-18 Adhesive tape

Country Status (1)

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US (1) USD493838S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD790629S1 (en) * 2013-03-15 2017-06-27 Snotco, Llc Masking tape
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Catalog, "1998 General Catalog," p. 193, Japanese Patent Office Document HC10012283, Accepted Jul. 10, 1998.
Catalog, "Ribbon Spring 2001," p. 7, Japanese Patent Office Document HC14009633, Accepted Mar. 2, 2002.
Japanese Design Application No. 2002-6791 filed Mar. 14, 2002.
Letraset Product Update Catalog, item 4113, black and white arrows, 1983, p. 216.*

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804435S1 (en) 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD790629S1 (en) * 2013-03-15 2017-06-27 Snotco, Llc Masking tape

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