USD786810S1 - Dummy wafer - Google Patents

Dummy wafer Download PDF

Info

Publication number
USD786810S1
USD786810S1 US29/524,912 US201529524912F USD786810S US D786810 S1 USD786810 S1 US D786810S1 US 201529524912 F US201529524912 F US 201529524912F US D786810 S USD786810 S US D786810S
Authority
US
United States
Prior art keywords
dummy wafer
view
dummy
taken along
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/524,912
Other languages
English (en)
Inventor
Yutaka Motoyama
Kohei Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUSHIMA, KOHEI, MOTOYAMA, YUTAKA
Application granted granted Critical
Publication of USD786810S1 publication Critical patent/USD786810S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/524,912 2014-11-13 2015-04-24 Dummy wafer Active USD786810S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-025307 2014-02-13
JPD2014-25307F JP1534137S (sv) 2014-11-13 2014-11-13

Publications (1)

Publication Number Publication Date
USD786810S1 true USD786810S1 (en) 2017-05-16

Family

ID=54206979

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/524,912 Active USD786810S1 (en) 2014-11-13 2015-04-24 Dummy wafer

Country Status (3)

Country Link
US (1) USD786810S1 (sv)
JP (1) JP1534137S (sv)
TW (1) TWD171961S (sv)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD832017S1 (en) 2016-06-13 2018-10-30 Herman Miller, Inc. Chair component
USD841340S1 (en) * 2016-06-13 2019-02-26 Herman Miller, Inc. Suspension textile sheet
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer
USD918599S1 (en) * 2019-03-12 2021-05-11 Hornwood, Inc. Fabric

Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US198816A (en) 1878-01-01 Improvement in carpet-linings
US415734A (en) * 1889-11-26 Fire-kindler
US1769409A (en) 1928-05-11 1930-07-01 Charles L Armstrong Vermin repellent
US4244761A (en) * 1977-09-09 1981-01-13 Societe Europeenne Des Produits Refractaires Thermally insulating slabs made of refractory fibers for the insulation of furnaces and the like
US4374906A (en) 1981-09-29 1983-02-22 United Technologies Corporation Ribbed electrode substrates
USD273582S (en) * 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
USD273860S (en) * 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
US4450212A (en) 1982-09-30 1984-05-22 Engelhard Corporation Edge seal for a porous gas distribution plate of a fuel cell
US4460634A (en) 1979-12-29 1984-07-17 Masaaki Hasegawa Adhesive sheet and method for manufacturing the same
USD308247S (en) * 1987-03-10 1990-05-29 Bramec Corporation Air conditioner support
USD320361S (en) 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5458938A (en) 1993-08-03 1995-10-17 Minnesota Mining And Manufacturing Company Mounting laminate having recessed adhesive areas
US5514439A (en) 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
US5662758A (en) 1996-01-10 1997-09-02 The Procter & Gamble Company Composite material releasably sealable to a target surface when pressed thereagainst and method of making
US5766702A (en) 1995-10-05 1998-06-16 Lin; Chii-Hsiung Laminated ornamental glass
US5773110A (en) 1994-02-28 1998-06-30 Creative Minds Foundation Window painting apparatus and method
US5804281A (en) 1991-06-28 1998-09-08 The Proctor & Gamble Company Cellulosic fibrous structures having at least three regions distinguished by intensive properties
US5853840A (en) 1996-06-25 1998-12-29 Nisshinbo Industries, Inc. Dummy wafer
USD417235S (en) 1998-12-10 1999-11-30 Mark Malik Personal identification number card
USD425113S (en) 1998-06-03 2000-05-16 The Mead Corporation Watermark on a paper
US6150023A (en) 1995-05-19 2000-11-21 Kabushiki Kaisha Kobe Seiko Sho Dummy wafer
US6340514B1 (en) 1999-08-13 2002-01-22 Milliken & Company Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber
US6550092B1 (en) 2000-04-26 2003-04-22 S. C. Johnson & Son, Inc. Cleaning sheet with particle retaining cavities
US6589631B1 (en) 2000-10-04 2003-07-08 Milliken & Company Flashless rubber floor mat and method
US6610390B1 (en) 1999-08-13 2003-08-26 First Quality Nonwovens, Inc. Nonwoven with non-symmetrical bonding configuration
USD483187S1 (en) 2002-08-09 2003-12-09 Chiu-Fu Cheng Fabric with decorative pattern
US20050170616A1 (en) 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
USD508180S1 (en) 2003-08-21 2005-08-09 Better Life Technology, Llc Floor covering
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US20060079160A1 (en) 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7030046B2 (en) 2000-11-01 2006-04-18 The Procter & Gamble Company Multi-layer substrate for a premoistened wipe capable of controlled fluid release
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD562568S1 (en) 2004-08-17 2008-02-26 Johnston Nik L Two-dimensional sheet material
US7462094B2 (en) 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD589472S1 (en) 2006-10-10 2009-03-31 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US7572173B2 (en) 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
USD598380S1 (en) 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
US7632170B2 (en) 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD609652S1 (en) 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD676672S1 (en) 2011-08-25 2013-02-26 Lg Hausys, Ltd. Sheet for vehicle seats
USD677062S1 (en) 2011-08-25 2013-03-05 Lg Hausys, Ltd. Sheet for vehicle seats
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD699908S1 (en) 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD720313S1 (en) 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD733960S1 (en) 2014-02-18 2015-07-07 Southpac Trust International Inc. Light fixture lens with elevated strip features
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD740035S1 (en) 2013-04-29 2015-10-06 Vorwek & Co. Interholding Gmbh Floor covering with dot pattern
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD766850S1 (en) 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Patent Citations (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US198816A (en) 1878-01-01 Improvement in carpet-linings
US415734A (en) * 1889-11-26 Fire-kindler
US1769409A (en) 1928-05-11 1930-07-01 Charles L Armstrong Vermin repellent
US4244761A (en) * 1977-09-09 1981-01-13 Societe Europeenne Des Produits Refractaires Thermally insulating slabs made of refractory fibers for the insulation of furnaces and the like
US4460634A (en) 1979-12-29 1984-07-17 Masaaki Hasegawa Adhesive sheet and method for manufacturing the same
USD273582S (en) * 1981-09-08 1984-04-24 Bolt William S Holding pallet for PC boards
USD273860S (en) * 1981-09-08 1984-05-15 Bolt William S Holding pallet for PC boards
US4374906A (en) 1981-09-29 1983-02-22 United Technologies Corporation Ribbed electrode substrates
US4450212A (en) 1982-09-30 1984-05-22 Engelhard Corporation Edge seal for a porous gas distribution plate of a fuel cell
USD308247S (en) * 1987-03-10 1990-05-29 Bramec Corporation Air conditioner support
USD320361S (en) 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5804281A (en) 1991-06-28 1998-09-08 The Proctor & Gamble Company Cellulosic fibrous structures having at least three regions distinguished by intensive properties
US5458938A (en) 1993-08-03 1995-10-17 Minnesota Mining And Manufacturing Company Mounting laminate having recessed adhesive areas
US5773110A (en) 1994-02-28 1998-06-30 Creative Minds Foundation Window painting apparatus and method
US5514439A (en) 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
US6150023A (en) 1995-05-19 2000-11-21 Kabushiki Kaisha Kobe Seiko Sho Dummy wafer
US5766702A (en) 1995-10-05 1998-06-16 Lin; Chii-Hsiung Laminated ornamental glass
US5662758A (en) 1996-01-10 1997-09-02 The Procter & Gamble Company Composite material releasably sealable to a target surface when pressed thereagainst and method of making
US5853840A (en) 1996-06-25 1998-12-29 Nisshinbo Industries, Inc. Dummy wafer
USD425113S (en) 1998-06-03 2000-05-16 The Mead Corporation Watermark on a paper
USD417235S (en) 1998-12-10 1999-11-30 Mark Malik Personal identification number card
US6610390B1 (en) 1999-08-13 2003-08-26 First Quality Nonwovens, Inc. Nonwoven with non-symmetrical bonding configuration
US6340514B1 (en) 1999-08-13 2002-01-22 Milliken & Company Cushioned rubber floor mat article comprising at least one integrated rubber protrusion and at least two layers of rubber
US6988942B2 (en) 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6550092B1 (en) 2000-04-26 2003-04-22 S. C. Johnson & Son, Inc. Cleaning sheet with particle retaining cavities
US6589631B1 (en) 2000-10-04 2003-07-08 Milliken & Company Flashless rubber floor mat and method
US7030046B2 (en) 2000-11-01 2006-04-18 The Procter & Gamble Company Multi-layer substrate for a premoistened wipe capable of controlled fluid release
USD483187S1 (en) 2002-08-09 2003-12-09 Chiu-Fu Cheng Fabric with decorative pattern
USD508180S1 (en) 2003-08-21 2005-08-09 Better Life Technology, Llc Floor covering
US20050170616A1 (en) 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
USD562568S1 (en) 2004-08-17 2008-02-26 Johnston Nik L Two-dimensional sheet material
US20060079160A1 (en) 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
USD540272S1 (en) * 2005-04-18 2007-04-10 Murata Manufacturing Co., Ltd. Semiconductor module
USD552565S1 (en) 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD544452S1 (en) 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
US7462094B2 (en) 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD589472S1 (en) 2006-10-10 2009-03-31 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US7572173B2 (en) 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US7632170B2 (en) 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD598380S1 (en) 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD609652S1 (en) 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
USD633672S1 (en) 2010-02-10 2011-03-01 The Libman Company Pad
USD633673S1 (en) 2010-02-10 2011-03-01 The Libman Company Cloth
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD651991S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD655256S1 (en) * 2010-08-17 2012-03-06 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD704155S1 (en) 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD670917S1 (en) 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD676672S1 (en) 2011-08-25 2013-02-26 Lg Hausys, Ltd. Sheet for vehicle seats
USD677062S1 (en) 2011-08-25 2013-03-05 Lg Hausys, Ltd. Sheet for vehicle seats
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD695241S1 (en) 2012-03-20 2013-12-10 Veeco Instruments Inc. Wafer carrier having pockets
USD699908S1 (en) 2012-08-04 2014-02-18 Hangzhou Jeenor Cleaning Supplies Co., Ltd. Big dot pattern wiper
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD703162S1 (en) 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD740035S1 (en) 2013-04-29 2015-10-06 Vorwek & Co. Interholding Gmbh Floor covering with dot pattern
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD733960S1 (en) 2014-02-18 2015-07-07 Southpac Trust International Inc. Light fixture lens with elevated strip features
USD766850S1 (en) 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD720313S1 (en) 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/524,897, filed Apr. 24, 2015, Tokyo Electron Limited.
U.S. Appl. No. 29/524,898, filed Apr. 24, 2015, Tokyo Electron Limited.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD832017S1 (en) 2016-06-13 2018-10-30 Herman Miller, Inc. Chair component
USD841340S1 (en) * 2016-06-13 2019-02-26 Herman Miller, Inc. Suspension textile sheet
USD897974S1 (en) * 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer
USD918599S1 (en) * 2019-03-12 2021-05-11 Hornwood, Inc. Fabric

Also Published As

Publication number Publication date
JP1534137S (sv) 2015-09-28
TWD171961S (zh) 2015-11-21

Similar Documents

Publication Publication Date Title
USD995090S1 (en) Shoe
USD878862S1 (en) Blending system
USD880862S1 (en) Insulating device
USD731012S1 (en) Checking dummy
USD795679S1 (en) Tie down
USD762623S1 (en) Earphone
USD759633S1 (en) Earphone
USD754100S1 (en) Soundbar
USD726572S1 (en) Bracelet
USD729724S1 (en) Tire
USD765308S1 (en) Electronic cigarette
USD743872S1 (en) Tyre
USD749543S1 (en) Speaker
USD741703S1 (en) Package
USD724471S1 (en) Bangle
USD753584S1 (en) Tire
USD737717S1 (en) Earring
USD728886S1 (en) Iron fill basin
USD764339S1 (en) Camera bracelet
USD767250S1 (en) Belt
USD746148S1 (en) Bottle
USD842148S1 (en) Clamp meter
USD791626S1 (en) Spectrometer
USD773432S1 (en) Amplifier
USD782600S1 (en) Tie down