USD764424S1 - Substrate for an electronic circuit - Google Patents

Substrate for an electronic circuit Download PDF

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Publication number
USD764424S1
USD764424S1 US29/500,896 US201429500896F USD764424S US D764424 S1 USD764424 S1 US D764424S1 US 201429500896 F US201429500896 F US 201429500896F US D764424 S USD764424 S US D764424S
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US
United States
Prior art keywords
substrate
electronic circuit
view
elevational view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/500,896
Inventor
Manabu Matsumoto
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2014-10420F external-priority patent/JP1520123S/ja
Priority claimed from JPD2014-10421F external-priority patent/JP1520124S/ja
Priority claimed from JPD2014-10419F external-priority patent/JP1520122S/ja
Priority claimed from JPD2014-10418F external-priority patent/JP1519751S/ja
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, MANABU, OZAWA, ISAO
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to US29/564,493 priority Critical patent/USD778850S1/en
Priority to US29/564,531 priority patent/USD778852S1/en
Priority to US29/564,507 priority patent/USD778851S1/en
Application granted granted Critical
Publication of USD764424S1 publication Critical patent/USD764424S1/en
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a substrate for an electronic circuit showing our new design;
FIG. 2 is a rear perspective view thereof,
FIG. 3 is a front elevational view thereof,
FIG. 4 is a rear elevational view thereof,
FIG. 5 is a right side elevational view, a left side elevational view being a mirror image thereof,
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the drawings represent portions of the substrate for an electronic circuit that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate for an electronic circuit, as shown and described.
US29/500,896 2014-05-15 2014-08-29 Substrate for an electronic circuit Active USD764424S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/564,507 USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,531 USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,493 USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2014-010418 2014-01-23
JP2014-010420 2014-05-15
JP2014-010421 2014-05-15
JP2014-010419 2014-05-15
JPD2014-10421F JP1520124S (en) 2014-05-15 2014-05-15
JPD2014-10419F JP1520122S (en) 2014-05-15 2014-05-15
JPD2014-10418F JP1519751S (en) 2014-05-15 2014-05-15
JPD2014-10420F JP1520123S (en) 2014-05-15 2014-05-15

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US29/564,531 Division USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,507 Division USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,493 Division USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Publications (1)

Publication Number Publication Date
USD764424S1 true USD764424S1 (en) 2016-08-23

Family

ID=56682979

Family Applications (4)

Application Number Title Priority Date Filing Date
US29/500,896 Active USD764424S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit
US29/564,507 Active USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,531 Active USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,493 Active USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

Family Applications After (3)

Application Number Title Priority Date Filing Date
US29/564,507 Active USD778851S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,531 Active USD778852S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit
US29/564,493 Active USD778850S1 (en) 2014-05-15 2016-05-13 Substrate for an electronic circuit

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US (4) USD764424S1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD778850S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD1031678S1 (en) * 2021-05-13 2024-06-18 Mississippi State University, Office of Technology Management Combined electrical enclosure and mount for wearable plug and play device

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USD757693S1 (en) * 2013-09-26 2016-05-31 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD892774S1 (en) * 2013-09-26 2020-08-11 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD742581S1 (en) 2013-12-09 2015-11-03 Kenall Manufacturing Company Driver housing
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
CA169446S (en) * 2016-01-22 2017-02-21 Shenzhen Longsys Electronics Co Ltd Ssd storage module
USD803169S1 (en) * 2016-02-22 2017-11-21 Heatscape.Com, Inc. Combined liquid cooling cold plate and vapor chamber
TWD188043S (en) 2016-09-29 2018-01-21 新世紀光電股份有限公司 Light emitting diode package
TWD186014S (en) 2016-09-29 2017-10-11 新世紀光電股份有限公司 Portion of light emitting diode module
TWD192227S (en) 2017-03-16 2018-08-11 新世紀光電股份有限公司 Part of the LED package
TWD189698S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189699S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189696S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189697S (en) 2017-06-21 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
TWD189700S (en) 2017-06-30 2018-04-11 軒帆光電科技股份有限公司 Portion of light source module
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module
TWD243324S (en) 2021-10-15 2026-03-11 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure
JP1724477S (en) 2021-10-15 2022-09-12 Stamp parts for microstructure transfer
TWD240715S (en) 2021-10-15 2025-10-01 日商信越化學工業股份有限公司 (日本) Stamp component for transferring microstructure

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US5858481A (en) * 1996-01-30 1999-01-12 Matsushita Electric Industrial Co., Ltd. Electronic circuit substrate
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
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USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
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USD608741S1 (en) * 2008-03-13 2010-01-26 Panasonic Corporation Substrate for electric circuit
US20100326710A1 (en) * 2009-06-29 2010-12-30 Guigen Zhang Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
USD633673S1 (en) * 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) * 2010-02-10 2011-03-01 The Libman Company Pad
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USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD730304S1 (en) * 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit

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US20050013106A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Peripheral card with hidden test pins
US7416132B2 (en) * 2003-07-17 2008-08-26 Sandisk Corporation Memory card with and without enclosure
EP1649410A2 (en) * 2003-07-17 2006-04-26 SanDisk Corporation Memory card with raised portion
JP4673411B2 (en) * 2005-11-07 2011-04-20 テレフオンアクチーボラゲット エル エム エリクソン（パブル） Method and apparatus in a mobile communication network
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD716743S1 (en) * 2014-03-25 2014-11-04 Transcend Information, Inc. Printed circuit board of solid-state memory
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
JP1529446S (en) * 2014-10-16 2015-07-21
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module

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Publication number Priority date Publication date Assignee Title
US5858481A (en) * 1996-01-30 1999-01-12 Matsushita Electric Industrial Co., Ltd. Electronic circuit substrate
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD471524S1 (en) 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20030094628A1 (en) * 2001-11-21 2003-05-22 Yeh Nai Hua Memory module structure
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
US20060168721A1 (en) * 2005-01-28 2006-08-03 Mcguire Carney J Portable, flexible cushion for poolside use
US20080123318A1 (en) * 2006-11-08 2008-05-29 Atmel Corporation Multi-component electronic package with planarized embedded-components substrate
USD608741S1 (en) * 2008-03-13 2010-01-26 Panasonic Corporation Substrate for electric circuit
US20100326710A1 (en) * 2009-06-29 2010-12-30 Guigen Zhang Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US20110051351A1 (en) * 2009-08-25 2011-03-03 Elpida Memory, Inc. Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
USD633673S1 (en) * 2010-02-10 2011-03-01 The Libman Company Cloth
USD633672S1 (en) * 2010-02-10 2011-03-01 The Libman Company Pad
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD730304S1 (en) * 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10070176B2 (en) 2013-03-13 2018-09-04 Nagrastar, Llc Systems and methods for performing transport I/O
US10382816B2 (en) 2013-03-13 2019-08-13 Nagrastar, Llc Systems and methods for performing transport I/O
USD840404S1 (en) * 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD778852S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778851S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778850S1 (en) * 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD821987S1 (en) * 2016-04-27 2018-07-03 Ngk Insulators, Ltd. Flexible printed circuits
USD843334S1 (en) * 2016-05-11 2019-03-19 Ngk Insulators, Ltd. Flexible printed circuits
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD1031678S1 (en) * 2021-05-13 2024-06-18 Mississippi State University, Office of Technology Management Combined electrical enclosure and mount for wearable plug and play device

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USD778850S1 (en) 2017-02-14
USD778852S1 (en) 2017-02-14
USD778851S1 (en) 2017-02-14

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