USD717746S1 - Lower chamber liner - Google Patents

Lower chamber liner Download PDF

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Publication number
USD717746S1
USD717746S1 US29/471,943 US201329471943F USD717746S US D717746 S1 USD717746 S1 US D717746S1 US 201329471943 F US201329471943 F US 201329471943F US D717746 S USD717746 S US D717746S
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US
United States
Prior art keywords
lower chamber
chamber liner
view
liner
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/471,943
Inventor
Shu-Kwan Lau
Mehmet Tugrul Samir
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/471,943 priority Critical patent/USD717746S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAU, Shu-Kwan, SAMIR, MEHMET TUGRUL
Application granted granted Critical
Publication of USD717746S1 publication Critical patent/USD717746S1/en
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FIG. 1 is a top perspective view of a lower chamber liner showing our new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is another bottom perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is another side view thereof;
FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 5;
FIG. 11 is an enlarged portion view taken along lines 11-11 in FIG. 10; and,
FIG. 12 is an enlarged portion view taken along lines 12-12 in FIG. 10.
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lower chamber liner, as shown and described.
US29/471,943 2013-11-06 2013-11-06 Lower chamber liner Active USD717746S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/471,943 USD717746S1 (en) 2013-11-06 2013-11-06 Lower chamber liner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/471,943 USD717746S1 (en) 2013-11-06 2013-11-06 Lower chamber liner

Publications (1)

Publication Number Publication Date
USD717746S1 true USD717746S1 (en) 2014-11-18

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US29/471,943 Active USD717746S1 (en) 2013-11-06 2013-11-06 Lower chamber liner

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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1108379S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1108380S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US6884297B2 (en) * 2003-03-31 2005-04-26 Ips Ltd. Thin film deposition reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US8313578B2 (en) * 2008-01-28 2012-11-20 Applied Materials, Inc. Etching chamber having flow equalizer and lower liner
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US6884297B2 (en) * 2003-03-31 2005-04-26 Ips Ltd. Thin film deposition reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8313578B2 (en) * 2008-01-28 2012-11-20 Applied Materials, Inc. Etching chamber having flow equalizer and lower liner
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8282736B2 (en) * 2008-04-07 2012-10-09 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8118938B2 (en) * 2008-04-07 2012-02-21 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1049067S1 (en) * 2022-04-04 2024-10-29 Applied Materials, Inc. Ring for an anti-rotation process kit for a substrate processing chamber
USD1066275S1 (en) 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1069863S1 (en) * 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
US12553133B2 (en) 2022-08-04 2026-02-17 Applied Materials Inc. Substrate handling system, method, and apparatus
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1108379S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1108380S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus

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