USD717746S1 - Lower chamber liner - Google Patents
Lower chamber liner Download PDFInfo
- Publication number
- USD717746S1 USD717746S1 US29/471,943 US201329471943F USD717746S US D717746 S1 USD717746 S1 US D717746S1 US 201329471943 F US201329471943 F US 201329471943F US D717746 S USD717746 S US D717746S
- Authority
- US
- United States
- Prior art keywords
- lower chamber
- chamber liner
- view
- liner
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.
Claims (1)
- The ornamental design for a lower chamber liner, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/471,943 USD717746S1 (en) | 2013-11-06 | 2013-11-06 | Lower chamber liner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/471,943 USD717746S1 (en) | 2013-11-06 | 2013-11-06 | Lower chamber liner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD717746S1 true USD717746S1 (en) | 2014-11-18 |
Family
ID=51870536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/471,943 Active USD717746S1 (en) | 2013-11-06 | 2013-11-06 | Lower chamber liner |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD717746S1 (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD872037S1 (en) * | 2017-08-09 | 2020-01-07 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor manufacturing |
| USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| USD1042373S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| USD1042374S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1051867S1 (en) * | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1052546S1 (en) * | 2020-12-10 | 2024-11-26 | Nuflare Technology, Inc. | Cover ring of top plate for semiconductor manufacturing apparatus |
| USD1055006S1 (en) | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1066275S1 (en) | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| USD1108379S1 (en) * | 2023-09-29 | 2026-01-06 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
| USD1108380S1 (en) * | 2023-09-29 | 2026-01-06 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
| US12553133B2 (en) | 2022-08-04 | 2026-02-17 | Applied Materials Inc. | Substrate handling system, method, and apparatus |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340462A (en) * | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6170429B1 (en) * | 1998-09-30 | 2001-01-09 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
| US6884297B2 (en) * | 2003-03-31 | 2005-04-26 | Ips Ltd. | Thin film deposition reactor |
| US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
| US7011039B1 (en) * | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
| US7234412B2 (en) * | 2002-04-11 | 2007-06-26 | Micron Technology, Inc. | Semiconductor substrate deposition processor chamber liner apparatus |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20080041820A1 (en) * | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| USD593969S1 (en) * | 2006-10-10 | 2009-06-09 | Tokyo Electron Limited | Processing chamber for manufacturing semiconductors |
| USD600221S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD600222S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| US7987814B2 (en) * | 2008-04-07 | 2011-08-02 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| US8313578B2 (en) * | 2008-01-28 | 2012-11-20 | Applied Materials, Inc. | Etching chamber having flow equalizer and lower liner |
| USD678228S1 (en) * | 2011-03-30 | 2013-03-19 | Tokyo Electron Limited | Chamber block |
| USD699692S1 (en) * | 2012-01-19 | 2014-02-18 | Applied Materials, Inc. | Upper liner |
-
2013
- 2013-11-06 US US29/471,943 patent/USD717746S1/en active Active
Patent Citations (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4340462A (en) * | 1981-02-13 | 1982-07-20 | Lam Research Corporation | Adjustable electrode plasma processing chamber |
| USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| US6170429B1 (en) * | 1998-09-30 | 2001-01-09 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US6277237B1 (en) * | 1998-09-30 | 2001-08-21 | Lam Research Corporation | Chamber liner for semiconductor process chambers |
| US20020069970A1 (en) * | 2000-03-07 | 2002-06-13 | Applied Materials, Inc. | Temperature controlled semiconductor processing chamber liner |
| US7011039B1 (en) * | 2000-07-07 | 2006-03-14 | Applied Materials, Inc. | Multi-purpose processing chamber with removable chamber liner |
| US7234412B2 (en) * | 2002-04-11 | 2007-06-26 | Micron Technology, Inc. | Semiconductor substrate deposition processor chamber liner apparatus |
| US20080041820A1 (en) * | 2002-09-20 | 2008-02-21 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US6884297B2 (en) * | 2003-03-31 | 2005-04-26 | Ips Ltd. | Thin film deposition reactor |
| US20050229849A1 (en) * | 2004-02-13 | 2005-10-20 | Applied Materials, Inc. | High productivity plasma processing chamber |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD593969S1 (en) * | 2006-10-10 | 2009-06-09 | Tokyo Electron Limited | Processing chamber for manufacturing semiconductors |
| US20080121620A1 (en) * | 2006-11-24 | 2008-05-29 | Guo G X | Processing chamber |
| US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| US8313578B2 (en) * | 2008-01-28 | 2012-11-20 | Applied Materials, Inc. | Etching chamber having flow equalizer and lower liner |
| USD600221S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| USD600222S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Wafer boat |
| US7987814B2 (en) * | 2008-04-07 | 2011-08-02 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| US8282736B2 (en) * | 2008-04-07 | 2012-10-09 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| US8118938B2 (en) * | 2008-04-07 | 2012-02-21 | Applied Materials, Inc. | Lower liner with integrated flow equalizer and improved conductance |
| USD658693S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658691S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD658692S1 (en) * | 2011-03-30 | 2012-05-01 | Tokyo Electron Limited | Liner for plasma processing apparatus |
| USD678228S1 (en) * | 2011-03-30 | 2013-03-19 | Tokyo Electron Limited | Chamber block |
| USD699692S1 (en) * | 2012-01-19 | 2014-02-18 | Applied Materials, Inc. | Upper liner |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD786201S1 (en) * | 2015-10-19 | 2017-05-09 | Tymphany Hk Limited | Heat sink for woofer |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD840365S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD837754S1 (en) * | 2017-04-28 | 2019-01-08 | Applied Materials, Inc. | Plasma chamber liner |
| USD838681S1 (en) * | 2017-04-28 | 2019-01-22 | Applied Materials, Inc. | Plasma chamber liner |
| USD842259S1 (en) * | 2017-04-28 | 2019-03-05 | Applied Materials, Inc. | Plasma chamber liner |
| USD875055S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875054S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD875053S1 (en) * | 2017-04-28 | 2020-02-11 | Applied Materials, Inc. | Plasma connector liner |
| USD872037S1 (en) * | 2017-08-09 | 2020-01-07 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor manufacturing |
| USD925481S1 (en) * | 2018-12-06 | 2021-07-20 | Kokusai Electric Corporation | Inlet liner for substrate processing apparatus |
| USD1051867S1 (en) * | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1052546S1 (en) * | 2020-12-10 | 2024-11-26 | Nuflare Technology, Inc. | Cover ring of top plate for semiconductor manufacturing apparatus |
| USD1042373S1 (en) * | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Sliding ring for an interlocking process kit for a substrate processing chamber |
| USD1042374S1 (en) | 2022-03-18 | 2024-09-17 | Applied Materials, Inc. | Support pipe for an interlocking process kit for a substrate processing chamber |
| USD1055006S1 (en) | 2022-03-18 | 2024-12-24 | Applied Materials, Inc. | Support ring for an interlocking process kit for a substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1066275S1 (en) | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| US12553133B2 (en) | 2022-08-04 | 2026-02-17 | Applied Materials Inc. | Substrate handling system, method, and apparatus |
| USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
| USD1108379S1 (en) * | 2023-09-29 | 2026-01-06 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
| USD1108380S1 (en) * | 2023-09-29 | 2026-01-06 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| USD717746S1 (en) | Lower chamber liner | |
| USD716239S1 (en) | Upper chamber liner | |
| USD716240S1 (en) | Lower chamber liner | |
| USD711331S1 (en) | Upper chamber liner | |
| USD743357S1 (en) | Susceptor | |
| USD728757S1 (en) | Gasket | |
| USD738779S1 (en) | Vase | |
| USD717606S1 (en) | Cup | |
| USD700799S1 (en) | Lid | |
| USD733598S1 (en) | Biometric monitor | |
| USD759342S1 (en) | Shaped tortilla | |
| USD717605S1 (en) | Tumbler | |
| USD756023S1 (en) | Reflector | |
| USD761103S1 (en) | Container | |
| USD757258S1 (en) | Container seal | |
| USD715594S1 (en) | Bowl liner | |
| USD702993S1 (en) | Food processor | |
| USD717464S1 (en) | Base assembly | |
| USD708953S1 (en) | Container | |
| USD732419S1 (en) | Diamond jewelry | |
| USD706274S1 (en) | Tablet computer holder | |
| USD697372S1 (en) | Bowl | |
| USD714098S1 (en) | Glass | |
| USD747965S1 (en) | Container | |
| USD717463S1 (en) | Base |