USD706232S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD706232S1
USD706232S1 US29/458,663 US201329458663F USD706232S US D706232 S1 USD706232 S1 US D706232S1 US 201329458663 F US201329458663 F US 201329458663F US D706232 S USD706232 S US D706232S
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United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
accommodate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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US29/458,663
Inventor
Hideyo Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
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Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAMURA, HIDEYO
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FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is a rear view of the semiconductor device of FIG. 1;
FIG. 3 is a left side view of the semiconductor device of FIG. 1;
FIG. 4 is a right side view of the semiconductor device of FIG. 1;
FIG. 5 is a top view of the semiconductor device of FIG. 1;
FIG. 6 is a bottom view of the semiconductor device of FIG. 1; and,
FIG. 7 is a perspective view of the semiconductor device of FIG. 1.
The ornamental design of the present disclosure is a semiconductor device forming a case that may accommodate a plurality of semiconductor modules arranged in a line.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/458,663 2012-12-21 2013-06-21 Semiconductor device Active USD706232S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2012-031250 2012-12-21
JP2012031250 2012-12-21

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD825501S1 (en) * 2016-10-14 2018-08-14 Hitachi Kokusai Electric Inc. Air flow controller for heater of substrate processing apparatus
USD949808S1 (en) * 2020-11-27 2022-04-26 Sansha Electric Manufacturing Co., Ltd. Semiconductor device

Citations (21)

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US5057648A (en) * 1989-11-20 1991-10-15 Westinghouse Electric Corp. High voltage hybrid package
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US5761040A (en) * 1995-12-20 1998-06-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057648A (en) * 1989-11-20 1991-10-15 Westinghouse Electric Corp. High voltage hybrid package
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
USD357672S (en) * 1993-09-16 1995-04-25 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD364383S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364385S (en) * 1994-05-11 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
USD364384S (en) * 1994-05-23 1995-11-21 Fuji Electric Co., Ltd. Semi-conductor element with terminal casing
US5761040A (en) * 1995-12-20 1998-06-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396450S (en) * 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6078501A (en) * 1997-12-22 2000-06-20 Omnirel Llc Power semiconductor module
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
US7425757B2 (en) * 2003-12-22 2008-09-16 Fuji Electric Device Technology Co., Ltd. Semiconductor power module
US20110044012A1 (en) * 2006-12-15 2011-02-24 Mitsubishi Electric Corporation Semiconductor device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD606951S1 (en) * 2008-11-14 2009-12-29 Fuji Electric Device Technology Co, Ltd. Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD774479S1 (en) 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD814433S1 (en) 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD772184S1 (en) 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD825501S1 (en) * 2016-10-14 2018-08-14 Hitachi Kokusai Electric Inc. Air flow controller for heater of substrate processing apparatus
USD949808S1 (en) * 2020-11-27 2022-04-26 Sansha Electric Manufacturing Co., Ltd. Semiconductor device

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