USD699199S1 - Electrode plate for a plasma processing apparatus - Google Patents

Electrode plate for a plasma processing apparatus Download PDF

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Publication number
USD699199S1
USD699199S1 US29/417,062 US201229417062F USD699199S US D699199 S1 USD699199 S1 US D699199S1 US 201229417062 F US201229417062 F US 201229417062F US D699199 S USD699199 S US D699199S
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United States
Prior art keywords
processing apparatus
electrode plate
plasma processing
view
ornamental design
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US29/417,062
Inventor
Yusei Kuwabara
Keiichi Nagakubo
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUWABARA, YUSEI, NAGAKUBO, KEIICHI
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FIG. 1 is a front view of an electrode plate for a plasma processing apparatus showing our new design, the rear view being identical;
FIG. 2 is a right side view thereof, the left side view being identical;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged view of a portion of the electrode plate for a plasma processing apparatus of FIG. 1 taken along line 1-1 and line 2-2 of FIG. 3;
FIG. 6 is an enlarged cross sectional view thereof, taken along line 3-3 of FIG. 5; and,
FIG. 7 is a perspective view of the electrode plate for a plasma processing apparatus of FIG. 1.
The features shown only in broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an electrode plate for a plasma processing apparatus, as shown and described.
US29/417,062 2011-09-30 2012-03-29 Electrode plate for a plasma processing apparatus Active USD699199S1 (en)

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JP2011022448 2011-09-30
JPD2011-022448 2011-09-30

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USD699199S1 true USD699199S1 (en) 2014-02-11

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US29/417,062 Active USD699199S1 (en) 2011-09-30 2012-03-29 Electrode plate for a plasma processing apparatus

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US (1) USD699199S1 (en)
TW (1) TWD155119S (en)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD870719S1 (en) * 2018-05-23 2019-12-24 Annex Products Pty. Ltd. Adhesive base
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD904305S1 (en) * 2019-02-25 2020-12-08 Petram Technologies, Inc. Electrode cage for a plasma blasting probe
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1108380S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1108379S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus

Citations (20)

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Publication number Priority date Publication date Assignee Title
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
US6818097B2 (en) * 2002-04-22 2004-11-16 Nisshinbo Industries, Inc. Highly heat-resistant plasma etching electrode and dry etching device including the same
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US7479304B2 (en) * 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD363464S (en) * 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
US7479304B2 (en) * 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US6818097B2 (en) * 2002-04-22 2004-11-16 Nisshinbo Industries, Inc. Highly heat-resistant plasma etching electrode and dry etching device including the same
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD648289S1 (en) * 2010-10-21 2011-11-08 Novellus Systems, Inc. Electroplating flow shaping plate having offset spiral hole pattern
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Taiwanese Office Action, Application No. 101301746, dated Oct. 24, 2012.

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD793572S1 (en) * 2015-06-10 2017-08-01 Tokyo Electron Limited Electrode plate for plasma processing apparatus
USD789888S1 (en) * 2016-01-08 2017-06-20 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD870719S1 (en) * 2018-05-23 2019-12-24 Annex Products Pty. Ltd. Adhesive base
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD904305S1 (en) * 2019-02-25 2020-12-08 Petram Technologies, Inc. Electrode cage for a plasma blasting probe
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1099858S1 (en) * 2022-05-19 2025-10-28 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1108380S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus
USD1108379S1 (en) * 2023-09-29 2026-01-06 Hitachi High-Tech Corporation Electrode cover for a plasma processing apparatus

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