USD664512S1 - Adhesive tape for semiconductor manufacturing - Google Patents

Description

FIG. 1 is a top plan view of our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a left side view;

FIG. 4 is a right side view;

FIG. 5 is a rear side view;

FIG. 6 is a front side view;

FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view; and,

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

Claims (1)

1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

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