USD574792S1

USD574792S1 - Lower heat insulating cylinder for manufacturing semiconductor wafers

Info

Publication number: USD574792S1
Application number: US29/272,820
Authority: US
Inventors: Izumi Sato
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2006-08-23
Filing date: 2007-02-20
Publication date: 2008-08-12
Anticipated expiration: 2022-08-12
Also published as: TWD121888S1

Description

FIG. 1 is a perspective view of the design for a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is another top view thereof which shows sectional line 9—9;

FIG. 9 is a sectional view thereof along line 9—9 of FIG. 8; and,

FIG. 10 shows a lower heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention in use wherein the broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Claims

CLAIM

The ornamental design for a lower heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.