USD504874S1 - Semiconductor device package - Google Patents

Semiconductor device package Download PDF

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Publication number
USD504874S1
USD504874S1 US29/211,046 US21104604F USD504874S US D504874 S1 USD504874 S1 US D504874S1 US 21104604 F US21104604 F US 21104604F US D504874 S USD504874 S US D504874S
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United States
Prior art keywords
semiconductor device
device package
package
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/211,046
Inventor
Phillip Celaya
Darrell D. Truhitte
Michael J. Seddon
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JPMorgan Chase Bank NA
Original Assignee
Semiconductor Components Industries LLC
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Filing date
Publication date
Assigned to SEMICONDUCTOR COMPONENT INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENT INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CELAYA, PHILLIP, SEDDON, MICHAEL J., TRUHITTE, DARRELL D.
Priority to US29/211,046 priority Critical patent/USD504874S1/en
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Publication of USD504874S1 publication Critical patent/USD504874S1/en
Application granted granted Critical
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH reassignment DEUTSCHE BANK AG NEW YORK BRANCH SECURITY INTEREST Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A. (ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Anticipated expiration legal-status Critical
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, FAIRCHILD SEMICONDUCTOR CORPORATION reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof; and,
FIG. 4 is an elevational view from the front side thereof.

Claims (1)

  1. We claim the ornamental design for a semiconductor device package, as shown and described.
US29/211,046 2004-08-11 2004-08-11 Semiconductor device package Expired - Lifetime USD504874S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/211,046 USD504874S1 (en) 2004-08-11 2004-08-11 Semiconductor device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/211,046 USD504874S1 (en) 2004-08-11 2004-08-11 Semiconductor device package

Publications (1)

Publication Number Publication Date
USD504874S1 true USD504874S1 (en) 2005-05-10

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US29/211,046 Expired - Lifetime USD504874S1 (en) 2004-08-11 2004-08-11 Semiconductor device package

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD990439S1 (en) * 2021-04-09 2023-06-27 Rohm Co., Ltd. Semiconductor module
USD992519S1 (en) * 2021-04-09 2023-07-18 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD990439S1 (en) * 2021-04-09 2023-06-27 Rohm Co., Ltd. Semiconductor module
USD992519S1 (en) * 2021-04-09 2023-07-18 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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