USD448740S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD448740S1
USD448740S1 US29/138,197 US13819701F USD448740S US D448740 S1 USD448740 S1 US D448740S1 US 13819701 F US13819701 F US 13819701F US D448740 S USD448740 S US D448740S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/138,197
Inventor
Mitsutaka Iwasaki
Hitoshi Toda
Hisashi Kawafuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASAKI, MITSUTAKA, KAWAFUJI, HISASHI, TODA, HITOSHI
Application granted granted Critical
Publication of USD448740S1 publication Critical patent/USD448740S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof; and,
FIG. 7 is a right side elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown.
US29/138,197 2000-11-30 2001-03-09 Semiconductor device Expired - Lifetime USD448740S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000034221 2000-11-30
JP12-034221 2000-11-30

Publications (1)

Publication Number Publication Date
USD448740S1 true USD448740S1 (en) 2001-10-02

Family

ID=18558594

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/138,197 Expired - Lifetime USD448740S1 (en) 2000-11-30 2001-03-09 Semiconductor device

Country Status (1)

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US (1) USD448740S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD458234S1 (en) 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1055880S1 (en) * 2022-12-13 2024-12-31 Delta Electronics, Inc. Power module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220298A (en) 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD401912S (en) 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220298A (en) 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD401912S (en) 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD421969S (en) 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Catalogue of Sanken Electric Co., Ltd., "Sanken Silicon Power MOS FET Array SLA5056," Specification No. SSE-21259, pp. 1-7 (with English Translation) (Undated).
Catalogue of Sanken Electronics Co., Ltd., "Sanken Silicon Power MOS FET Array SLA5075 (LF853)," Specification No. SSE-21515, pp. 1-8 (with English Translation) (Undated).
Catalogue of Toshiba Corp., "Semi Conductor Device" (Undated).

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD458234S1 (en) 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470463S1 (en) 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1055880S1 (en) * 2022-12-13 2024-12-31 Delta Electronics, Inc. Power module

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