USD428859S - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD428859S
USD428859S US29/106,586 US10658699F USD428859S US D428859 S USD428859 S US D428859S US 10658699 F US10658699 F US 10658699F US D428859 S USD428859 S US D428859S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/106,586
Inventor
Hisashi Kawafuji
Mitsutaka Iwasaki
Gourab Majumdar
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IWASAKI, MITSUTAKA, MAJUMDAR, GOURAB, SHINOHARA, TOSHIAKI, KAWAFUJI, HISASHI
Application granted granted Critical
Publication of USD428859S publication Critical patent/USD428859S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of a semiconductor device, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a cross-sectional view thereof, taken along line 7--7 in FIG. 1;
FIG. 8 is a cross-sectional view thereof, taken along line 8--8 in FIG. 1; and,
FIG. 9 is a front, right side and bottom perspective view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/106,586 1999-01-28 1999-06-15 Semiconductor device Expired - Lifetime USD428859S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP184199 1999-01-28
JP11-1841 1999-01-28

Publications (1)

Publication Number Publication Date
USD428859S true USD428859S (en) 2000-08-01

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ID=71740046

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/106,586 Expired - Lifetime USD428859S (en) 1999-01-28 1999-06-15 Semiconductor device

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US (1) USD428859S (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD504405S1 (en) * 2003-07-09 2005-04-26 Sanyo Electric Co., Ltd. Semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD288922S (en) * 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
USD359028S (en) * 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396211S (en) * 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD504405S1 (en) * 2003-07-09 2005-04-26 Sanyo Electric Co., Ltd. Semiconductor device
USD558694S1 (en) * 2005-10-11 2008-01-01 Gem Services, Inc. Quad-28JW surface mount package
USD560623S1 (en) * 2005-10-11 2008-01-29 Gem Services, Inc. Quad-24JW surface mount package
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

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