US9730677B2 - Matrix ultrasound probe with passive heat dissipation - Google Patents

Matrix ultrasound probe with passive heat dissipation Download PDF

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Publication number
US9730677B2
US9730677B2 US14/113,384 US201214113384A US9730677B2 US 9730677 B2 US9730677 B2 US 9730677B2 US 201214113384 A US201214113384 A US 201214113384A US 9730677 B2 US9730677 B2 US 9730677B2
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Prior art keywords
frame
probe
heatspreader
ultrasonic transducer
transducer array
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US14/113,384
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US20140058270A1 (en
Inventor
Richard Edward Davidsen
Steven Russell Freeman
Bernard Joseph Savord
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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Priority to US14/113,384 priority Critical patent/US9730677B2/en
Assigned to KONINKLIJKE PHILIPS ELECTRONICS N.V. reassignment KONINKLIJKE PHILIPS ELECTRONICS N.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DAVIDSEN, Richard Edward, FREEMAN, STEVEN RUSSELL, SAVORD, Bernard Joseph
Publication of US20140058270A1 publication Critical patent/US20140058270A1/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/54—Control of the diagnostic device
    • A61B8/546—Control of the diagnostic device involving monitoring or regulation of device temperature
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/42—Details of probe positioning or probe attachment to the patient
    • A61B8/4209—Details of probe positioning or probe attachment to the patient by using holders, e.g. positioning frames
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
    • G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
    • G01S15/8925—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52079—Constructional features
    • G01S7/5208—Constructional features with integration of processing functions inside probe or scanhead
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
    • G01S7/52096—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging related to power management, e.g. saving power or prolonging life of electronic components

Definitions

  • This invention relates to medical diagnostic systems and, in particular, to matrix array transducer probes with passive heat dissipation.
  • a beamformer ASIC (microbeamformer) is employed in the probe with integrated drive circuitry and receive circuitry for the transducer elements in the probe itself.
  • the beamformer ASIC controls and performs at least part of the transmit and receive beamforming so that only a relatively few signal path conductors are needed in the cable, enabling the use of a practical, thin cable for the 3D imaging probe.
  • Active cooling with a coolant requires the necessary space and apparatus to circulate the coolant as well as the hazard of coolant leaks, and both approaches complicate the component complexity and spacing inside the probe. What is needed is a passive cooling technique which is more effective than that of Martin et al. and without the complications of the active cooling approaches. It is further desirable for such a passive cooling technique to avoid the development of hotspots in the probe which can concentrate heat at a specific point or points of the probe case and hence into the hand of the probe user.
  • a matrix array ultrasound probe which uses passive heat dissipation to dissipate heat generated by a matrix array transducer and ASIC.
  • the heat generated by these elements is conducted to a heat spreader which distributes the heat through a surface area beneath the probe housing.
  • the distribution of heat by the heat spreader prevents the buildup of hotspots at a particular point or points of the handle portion of the probe housing.
  • the distributed heat is then dissipated through the probe housing and probe cable.
  • FIG. 1 illustrates a first cross-sectional view of matrix array ultrasound probe constructed in accordance with the principles of the present invention.
  • FIG. 2 illustrates a second cross-sectional view, orthogonal to FIG. 1 , of a matrix array probe constructed in accordance with the principles of the present invention.
  • FIG. 3 is a quarter-section cross sectional view of the matrix array probe of FIGS. 1 and 2 .
  • FIG. 4 illustrates a matrix array transducer stack, ASIC, and backing block mounted on a thermally conductive probe frame.
  • FIG. 5 is a perspective view of one-half of a heat spreader for a matrix array probe.
  • FIG. 6 illustrates the matrix array probe of the previous drawings assembled with one-half of the probe housing removed.
  • FIG. 7 illustrates a probe housing which is molded around one-half of a heat spreader.
  • FIG. 8 is an exploded assembly drawing of the major component parts of the matrix array probe of FIGS. 1-6 .
  • a matrix array ultrasound probe 10 constructed in accordance with the principles of the present invention is shown in cross-section.
  • the probe 10 has an outer case 22 which forms the handle portion of the probe which is held by a sonographer when using the probe.
  • the distal end of the probe is enclosed by a nosepiece housing 24 .
  • Behind a lens 36 covering the distal end is a matrix array transducer backed by an ASIC, both of which are indicated at 12 .
  • the integrated circuitry of the ASIC controls transmission by the transducer elements and performs both transmit and receive beamforming of signals transmitted and received by the array.
  • An interposer can be employed if desired to couple the elements of the transducer array to the circuitry of the ASIC.
  • One such interposer is described in international patent pub.
  • WO 2009/083896 (Weekamp et al.), for instance. Behind the matrix array transducer and ASIC is a graphite backing block 14 which attenuates acoustic reverberations from the back of the matrix array and conducts heat developed in the matrix array and ASIC away from the distal end of the probe. Further details of the graphite backing block may be found in co-pending U.S. patent application No. 61/453,690, filed Mar. 17, 2011.
  • An aluminum or magnesium probe frame 16 is in thermally conductive contact with the back of the graphite backing block to conduct heat further away from the distal end of the probe.
  • the frame 16 also mounts electrical components of the probe which themselves are mounted on two printed circuit boards and occupy the space inside the probe indicated by 18.
  • a probe cable 28 At the back of the probe and extending from the proximal end of the probe is a probe cable 28 .
  • the cable 28 is clamped to the rear of the frame by a clamp 26 .
  • FIG. 3 is a one-quarter cross-sectional view of the probe of FIGS. 1 and 2 showing a printed circuit board 34 on top of the frame 16 and the heatspreader 20 surrounding the frame 16 and printed circuit boards in the handle portion of the probe.
  • FIG. 4 is a perspective view of one embodiment of the frame 16 with the graphite backing block 14 and matrix array transducer and ASIC 12 mounted on top of the frame and in thermally conductive contact with the frame.
  • this embodiment there are flanges 38 on the sides of the frame 16 to which the heatspreader is attached for efficient heat conduction from the frame to the heatspreader.
  • FIG. 5 illustrates one implementation of a heatspreader 20 .
  • the heatspreader is formed as two clamshell halves which fit together at diagonally located edges.
  • the half illustrated in the view of FIG. 5 surrounds the inside of the handle portion of the housing 22 on the back and top, and its mating half surrounds the front and bottom of the handle interior. Visible in this view are two holes through which screws are inserted to fasten the heatspreader to one side of the frame 16 .
  • FIG. 7 illustrates another implementation of the heatspreader in which the housing 22 is molded around the metal heatspreader.
  • the handle portion 22 and the nosepiece 24 are molded as a single housing 22 ′ which is formed around the heatspreader 20 ′ so that the heatspreader 20 ′ surrounds not only the volume inside the handle, but also extends forward to surround the transducer stack in the distal end of the housing.
  • the heatspreader 20 ′ will thus be in direct thermally conductive contact with the graphite backing block which carries heat away from the matrix array and ASIC 12 . Heat in the distal end of the probe will therefore be carried to the rear of the probe and dissipated by both the probe frame 16 and the heatspreader 20 ′.
  • FIG. 6 is a plan view of an assembled probe 10 of the present invention with the nosepiece and half of the housing 22 removed.
  • This view shows the heatspreader 20 completely enclosing the frame 16 and printed circuit boards inside the handle portion of the housing 22 .
  • the heatspreader 20 conducts heat over its entire area, avoiding the buildup of hotspots at particular points inside the housing. The development of such hotspots can be felt by the hand of the sonographer using the probe and, while they may not be sufficient to pose a danger, they can make use of the probe uncomfortable.
  • a benefit of the present invention is that heat is distributed throughout the heatspreader inside the housing and individual hotspots will not develop.
  • the heat conducted by the heatspreader is conducted from the outer surface of the heatspreader 20 to the inner surface of the housing 22 from which it dissipates through the housing and into the air.
  • a layer of thermal putty may be spread between the heatspreader and the housing, carrying heat into the housing over its entire inner surface area and further preventing the buildup of hotspots in the housing.
  • FIG. 8 is an exploded view showing the assembly of a probe 10 of the present invention including many of the components described above.
  • the transducer stack including the matrix array transducer and beamformer ASIC 12 and the graphite backing block 14 (not shown in this drawing) are fastened to the top of the probe frame 16 as shown in previous drawings.
  • Printed circuit boards 18 a and 18 b are fastened to opposite sides of the frame 16 . Wires from the cable 28 are connected to connectors on the printed circuit boards and a clamp 26 a and 26 b is clamped around the strain relief and braid of the cable 28 and the clamp is also clamed to two rails 17 a and 17 b extending from the proximal end of the frame 16 .
  • This coupling of the proximal end of the frame 16 to the cable braid promotes the transfer of heat from the frame into the cable braid and away from the probe.
  • a thermal gasket or thermal putty covers the surfaces of the flanges 38 of the frame 16 and the two halves 20 a and 20 b of the heatspreader are fastened to the flange sides of the frame 16 with screws.
  • the nosepiece 24 and lens 36 are placed on the distal end of the assembly over the transducer stack.
  • the outer surface of the assembled heatspreader (or the inner surfaces of the housing halves) are coated with thermal putty and the housing is put in place around and in contact with the heatspreader and thermal putty with the seams of the housing and nosepiece sealed to prevent fluid ingress.
  • the assembled probe is now ready for final testing and delivery to a user.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Public Health (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Acoustics & Sound (AREA)
  • Gynecology & Obstetrics (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
US14/113,384 2011-05-17 2012-05-11 Matrix ultrasound probe with passive heat dissipation Active 2032-12-15 US9730677B2 (en)

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US201161486796P 2011-05-17 2011-05-17
PCT/IB2012/052364 WO2012156886A1 (en) 2011-05-17 2012-05-11 Matrix ultrasound probe with passive heat dissipation
US14/113,384 US9730677B2 (en) 2011-05-17 2012-05-11 Matrix ultrasound probe with passive heat dissipation

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US9730677B2 true US9730677B2 (en) 2017-08-15

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US (1) US9730677B2 (enExample)
EP (1) EP2709530B1 (enExample)
JP (1) JP2014516686A (enExample)
CN (1) CN103533896B (enExample)
RU (1) RU2604705C2 (enExample)
WO (1) WO2012156886A1 (enExample)

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CN103533896B (zh) 2016-01-06
RU2013155904A (ru) 2015-06-27
RU2604705C2 (ru) 2016-12-10
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JP2014516686A (ja) 2014-07-17
US20140058270A1 (en) 2014-02-27

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