US9661766B2 - Electronic device package box - Google Patents

Electronic device package box Download PDF

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Publication number
US9661766B2
US9661766B2 US15/213,490 US201615213490A US9661766B2 US 9661766 B2 US9661766 B2 US 9661766B2 US 201615213490 A US201615213490 A US 201615213490A US 9661766 B2 US9661766 B2 US 9661766B2
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US
United States
Prior art keywords
circuit board
connecting pins
surrounding
surrounding wall
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US15/213,490
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English (en)
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US20170034933A1 (en
Inventor
Yung-Ming PAN
Chung-Cheng FAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Botthand Enterprise Inc
Bothhand Enterprise Inc
Original Assignee
Botthand Enterprise Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Botthand Enterprise Inc filed Critical Botthand Enterprise Inc
Assigned to BOTHHAND ENTERPRISE INC. reassignment BOTHHAND ENTERPRISE INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FAN, CHUNG-CHENG, PAN, YUNG-MING
Publication of US20170034933A1 publication Critical patent/US20170034933A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/02—Casings
    • H01F27/022—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0086—Printed inductances on semiconductor substrate

Definitions

  • the disclosure relates to an electronic device package box, and more particular to an electronic device package box that is adapted to be mounted with a plurality of coil components and that is adapted to be mounted on a circuit board.
  • a conventional electronic device package box is used for receiving electronic components, such as coils, and can be mounted to a circuit board.
  • the conventional electronic device package box is often named as a dual-in-line package (DIP) device, which includes a plurality of connecting pins that extend through the circuit board.
  • DIP dual-in-line package
  • SMD surface-mount device
  • FIG. 1 shows a conventional through-hole package box 1 , which is mounted with and electrically connected to a plurality of coils 10 , and is mounted to a horizontal circuit board 11 that is formed with a plurality of through holes 111 .
  • the conventional through-hole package box 1 includes a base 12 , and a plurality of vertical connecting pins 13 that are mounted to the base 12 .
  • Each of the connecting pins 13 has an inserting section 131 that extends through a corresponding one of the through holes 111 of the circuit board 11 , and a connecting section 132 that is mounted to the base 12 and that is electrically connected to a corresponding one of the coils 10 .
  • the connecting pins 13 are directly mounted to the base 12 , the number of the connecting pins 13 mounted can be relatively large. However, the through holes 111 formed in the circuit board 11 must be spaced apart from each other. As a result, the total area of the circuit board 11 is increased, which is undesirable under the current trend of miniaturization design.
  • a conventional surface-mount package box 2 is mounted with and electrically connected to a plurality of coils 20 , and is mounted to a circuit board 21 .
  • the conventional surface-mount package box 2 includes a base 22 , and a plurality of connecting pins 23 that are mounted to the base 22 .
  • Each of the connecting pins 23 is electrically connected to a corresponding one of the coils 20 .
  • the base 22 has a rectangular base wall 221 , and a surrounding wall 222 that extends from the base wall 221 and toward the circuit board 21 .
  • the connecting pins 23 are mounted to the surrounding wall 222 and are spaced apart from each other.
  • Each of the connecting pins 23 has a protruding portion 231 that can be horizontally mounted to the circuit board 21 .
  • an object of the present disclosure is to provide an electronic device package box that can alleviate at least one of the drawbacks associated with the prior art.
  • the electronic device package box is adapted to be mounted with a plurality of coil components and is adapted to be mounted on a circuit board.
  • the electronic device package box includes a box unit, a plurality of outer connecting pins and a plurality of inner connecting pins.
  • the box unit includes at least one inner surrounding wall, an outer surrounding wall that surrounds the inner surrounding wall, a surrounding base wall that is connected between the outer surrounding wall and the inner surrounding wall, and a surrounding space that is defined by the outer surrounding wall, the inner surrounding wall and the surrounding base wall, and that is adapted to receive the coil components therein.
  • the outer connecting pins are mounted to the outer surrounding wall and are spaced apart from each other.
  • Each of the outer connecting pins is adapted to be electrically connected to a corresponding one of the coil components and is electrically connected to the circuit board.
  • the inner connecting pins are mounted to the inner surrounding wall and are spaced apart from each other.
  • Each of the inner connecting pins is adapted to be electrically connected to a corresponding one of the coil components and is electrically connected to the circuit board.
  • FIG. 1 is a partly sectional view of a conventional through-hole package box that is to be mounted to a circuit board;
  • FIG. 2 is a perspective view of a conventional surface-mount package box
  • FIG. 3 is a partly sectional view of the conventional surface-mount package box that is mounted to another circuit board;
  • FIG. 4 is a perspective view of a first embodiment of an electronic device package box according to the present disclosure.
  • FIG. 5 is a top view of the first embodiment
  • FIG. 6 is a partly sectional view of the first embodiment
  • FIG. 7 is a partly sectional view of a second embodiment of the electronic device package box according to the present disclosure.
  • FIG. 8 is a top view of a third embodiment of the electronic device package box according to the present disclosure.
  • a first embodiment of an electronic device package box is adapted to be mounted with a plurality of coil components 30 and is adapted to be mounted on a circuit board 31 .
  • the electronic device package box includes a box unit 4 , a plurality of outer connecting pins 5 and a plurality of inner connecting pins 6 .
  • the box unit 4 includes at least one inner surrounding wall 42 that defines a through hole 43 , an outer surrounding wall 41 surrounding the inner surrounding wall 42 , a surrounding base wall 44 that is connected between the outer surrounding wall 41 and the inner surrounding wall 42 , and a surrounding space 45 that is defined by the outer surrounding wall 41 , the inner surrounding wall 42 and the surrounding base wall 44 , and that is adapted to receive the coil components 30 therein.
  • the outer surrounding wall 41 and the inner surrounding wall 42 are perpendicular to the circuit board 31 .
  • the surrounding base wall 44 is located proximate to the circuit board 31 .
  • the surrounding space 45 is formed with an opening 451 that faces away from the circuit board 31 .
  • the base 4 is rectangular in shape. However, in practical use, the base 4 may be in other shapes, such as circle, rhombus, etc.
  • each of the outer connecting pins 5 is mounted to the outer surrounding wall 41 and are spaced apart from each other. Each of the outer connecting pins 5 is adapted to be electrically connected to a corresponding one of the coil components 30 and is electrically connected to the circuit board 31 .
  • each of the outer connecting pins 5 has an outer embedded portion 51 that is embedded in the outer surrounding wall 41 , an outer mounting portion 53 that is integrally connected to the outer embedded portion 51 , that extends parallel to the circuit board 31 , and that is adapted to be electrically connected to the circuit board 31 (e.g., by a welding technique), and an outer wire-connecting portion 52 that is integrally connected to the outer embedded portion 51 , that extends from a top end of the outer surrounding wall 41 , and that is adapted to be electrically connected to a corresponding one of the coil components 30 .
  • the outer wire-connecting portion 52 and the outer mounting portion 53 of each of the outer connecting pins 5 are respectively connected to opposite ends of the outer embedded portion 51 , and respectively extend from opposite
  • each of the inner connecting pins 6 is mounted to the inner surrounding wall 42 and are spaced apart from each other. Each of the inner connecting pins 6 is adapted to be electrically connected to a corresponding one of the coil components 30 and is electrically connected to the circuit board 31 .
  • each of the inner connecting pins 6 has an inner mounting portion 63 that extends inwardly in a direction parallel to the circuit board 31 , and that is adapted to be electrically connected to the circuit board 31 (e.g., by a welding technique), an inner embedded portion 61 that is integrally connected to the inner mounting portion 63 and that is mounted in the inner surrounding wall 42 , and an inner wire-connecting portion 62 that extends from a top end of the inner surrounding wall 42 , that is integrally connected to the inner embedded portion 61 and that is adapted to be electrically connected to a corresponding one of the coil components 30 .
  • the inner wire-connecting portion 62 and the inner mounting portion 63 of each of the inner connecting pins 6 are respectively connected to opposite ends of the
  • each of the outer connecting pins 5 extends outwardly from the outer surrounding wall 41
  • the inner mounting portion 63 of each of the inner connecting pins 6 extends inwardly from the inner surrounding wall 42 .
  • each of the outer connecting pins 5 extends outwardly from the outer surrounding wall 41 , and the inner mounting portion 63 of each of the inner connecting pins 6 is exposed from the through hole 43 , a user can examine the condition of wire connection to the outer mounting portion 53 of each of the outer connecting pins 5 and the inner mounting portion 63 of each of the inner connecting pins 6 by simply viewing from top of the electronic device package box without being blocked by the surrounding base wall 44 .
  • a second embodiment of the electronic device package box according to the present disclosure has a structure similar to that of the first embodiment, with the differences described below.
  • the opening 451 of the surrounding space 45 is located proximate to the circuit board 31 .
  • the surrounding base wall 44 of the box unit 4 is located away from the circuit board 31 .
  • the outer embedded portion 51 of each of the outer connecting pins 5 is L-shaped.
  • the inner embedded portion 61 of each of the inner connecting pins 6 is also L-shaped.
  • the outer wire-connecting port ion 52 of each of the outer connecting pins 5 is located proximate to the circuit board 31 .
  • the inner wire-connecting portion 62 of each of the inner connecting pins 6 is also located proximate to the circuit board 31 .
  • the configurations of the base 4 , the outer connecting pins 5 and the inner connecting pins 6 may be changed according to practical requirements, while still achieving the purpose of increased connecting pin number and facilitated inspection.
  • a third embodiment of the electronic device package box according to the present disclosure has a structure similar to that of the first embodiment, with the differences described below.
  • the box unit 4 includes two inner surrounding walls 42 that are surrounded by the outer surrounding wall 41 .
  • Each of the inner surrounding walls 42 defines a through hole 43 .
  • Each of the inner connecting pins 6 is mounted to a corresponding one of the inner surrounding walls 42 .
  • the inner mounting portion 63 extends inwardly in a direction parallel to the circuit board 31 and is adapted to be electrically connected to the circuit board 31
  • the inner embedded portion 61 is integrally connected to the inner mounting portion 63 and is mounted in the corresponding one of the inner surrounding walls 42
  • the inner wire-connecting portion 62 is integrally connected to the inner embedded portion 61 and is adapted to be electrically connected to a corresponding one of the coil components 30 .
  • the number of the inner surrounding walls 42 is not limited to two, and may be changed according to practical requirements.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Casings For Electric Apparatus (AREA)
US15/213,490 2015-07-30 2016-07-19 Electronic device package box Active US9661766B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW104124648A TWI569697B (zh) 2015-07-30 2015-07-30 The electronic components of the ring structure
TW104124648 2015-07-30
TW104124648A 2015-07-30

Publications (2)

Publication Number Publication Date
US20170034933A1 US20170034933A1 (en) 2017-02-02
US9661766B2 true US9661766B2 (en) 2017-05-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
US15/213,490 Active US9661766B2 (en) 2015-07-30 2016-07-19 Electronic device package box

Country Status (4)

Country Link
US (1) US9661766B2 (ko)
JP (1) JP3206832U (ko)
KR (1) KR200483817Y1 (ko)
TW (1) TWI569697B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10051757B1 (en) * 2017-05-09 2018-08-14 Bothhand Enterprise Inc. Electronic package module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587325B (zh) * 2016-08-15 2017-06-11 Bothhand Entpr Inc Electronic device package box

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656985A (en) * 1995-08-10 1997-08-12 Halo Electronics, Inc. Electronic surface mount package
US6297721B1 (en) * 1995-08-10 2001-10-02 Halo Electronics, Inc. Electronic surface mount package
US20020093412A1 (en) * 2000-01-31 2002-07-18 Morrison Timothy J. Electronic packaging device with insertable leads and method of manufacturing
US20060291145A1 (en) * 2005-06-23 2006-12-28 Tdk Corporation Package for parts for lan and pulse transformer module for lan
US20080232078A1 (en) * 2007-03-21 2008-09-25 Hon Hai Precision Ind. Co., Ltd. Electrical component and method for making the same
US20100142173A1 (en) * 2008-12-08 2010-06-10 U.D.Electronic Corp. Signal filter module
US20110095847A1 (en) * 2009-08-26 2011-04-28 U.D. Electronic Corp. Chip filter and the related supplementary tool
US20150181728A1 (en) * 2012-06-26 2015-06-25 Kyocera Corporation Package for housing semiconductor element and semiconductor device
US20150195935A1 (en) * 2012-10-30 2015-07-09 Kyocera Corporation Container for housing electronic component and electronic device
US20150327385A1 (en) * 2014-05-07 2015-11-12 Bothhand Enterprise Inc. Electronic device mounting apparatus
US20160183400A1 (en) * 2014-12-19 2016-06-23 Bothhand Enterprise Inc. Electronic device package box

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US7182644B2 (en) * 2003-04-30 2007-02-27 Hewlett-Packard Development Company, L.P. Filtering electromagnetic interference from low frequency transmission lines at a device enclosure
TW200905836A (en) * 2007-07-31 2009-02-01 Kunshan Heisei Electronics Co Ltd Package structure of a memory module and the method forming the same
TWM429683U (en) * 2012-01-06 2012-05-21 Bothhand Entpr Inc Packaging case of electronic device
ITMI20120710A1 (it) * 2012-04-27 2013-10-28 St Microelectronics Srl Metodo per fabbricare dispositivi elettronici
TWI446844B (zh) * 2012-07-25 2014-07-21 Wistron Corp 印刷電路板及印刷電路板之製造方法
TWM497651U (zh) * 2014-12-02 2015-03-21 Bothhand Entpr Inc 電子裝置之封裝盒
TWM513493U (zh) * 2015-07-30 2015-12-01 Bothhand Entpr Inc 環形結構的電子元件座

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656985A (en) * 1995-08-10 1997-08-12 Halo Electronics, Inc. Electronic surface mount package
US6297721B1 (en) * 1995-08-10 2001-10-02 Halo Electronics, Inc. Electronic surface mount package
US20020093412A1 (en) * 2000-01-31 2002-07-18 Morrison Timothy J. Electronic packaging device with insertable leads and method of manufacturing
US20060291145A1 (en) * 2005-06-23 2006-12-28 Tdk Corporation Package for parts for lan and pulse transformer module for lan
US20080232078A1 (en) * 2007-03-21 2008-09-25 Hon Hai Precision Ind. Co., Ltd. Electrical component and method for making the same
US20100142173A1 (en) * 2008-12-08 2010-06-10 U.D.Electronic Corp. Signal filter module
US20110095847A1 (en) * 2009-08-26 2011-04-28 U.D. Electronic Corp. Chip filter and the related supplementary tool
US20150181728A1 (en) * 2012-06-26 2015-06-25 Kyocera Corporation Package for housing semiconductor element and semiconductor device
US20150195935A1 (en) * 2012-10-30 2015-07-09 Kyocera Corporation Container for housing electronic component and electronic device
US20150327385A1 (en) * 2014-05-07 2015-11-12 Bothhand Enterprise Inc. Electronic device mounting apparatus
US20160183400A1 (en) * 2014-12-19 2016-06-23 Bothhand Enterprise Inc. Electronic device package box

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10051757B1 (en) * 2017-05-09 2018-08-14 Bothhand Enterprise Inc. Electronic package module

Also Published As

Publication number Publication date
TW201705829A (zh) 2017-02-01
KR20170000547U (ko) 2017-02-08
US20170034933A1 (en) 2017-02-02
TWI569697B (zh) 2017-02-01
JP3206832U (ja) 2016-10-06
KR200483817Y1 (ko) 2017-06-28

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