US9453892B2 - Hall sensor system - Google Patents

Hall sensor system Download PDF

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US9453892B2
US9453892B2 US13/806,638 US201113806638A US9453892B2 US 9453892 B2 US9453892 B2 US 9453892B2 US 201113806638 A US201113806638 A US 201113806638A US 9453892 B2 US9453892 B2 US 9453892B2
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sensor system
integrated circuit
hall sensor
elementary
hall
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US20130099782A1 (en
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Pavel Kejik
Serge Reymond
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LEM International SA
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
    • G01R33/072—Constructional adaptation of the sensor to specific applications
    • G01R33/075—Hall devices configured for spinning current measurements
    • H01L43/065—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/101—Semiconductor Hall-effect devices

Definitions

  • the present invention relates to a Hall sensor system for magnetic field sensing applications or for current sensing applications.
  • Hall effect sensors integrated in silicon circuits are preferred over other magnetic field sensors because they can be entirely fabricated by a standard CMOS or other integrated circuit manufacturing processes that are economical for large series production.
  • a drawback of conventional integrated Hall effect devices is that they have a relatively large residual offset i.e. residual voltage at zero magnetic field. What limits the residual offset is the device non-linearity due to the dependence of local resistance in the Hall sensor on the current density.
  • the reverse field reciprocity principle [ 3 ] the spinning current method would cancel the offset in a linear system. As the system becomes non-linear, the efficiency of the spinning current method decreases, and therefore a residual offset remains.
  • a major cause of non-linearity is either the junction field effect [ 4 ] or the carrier velocity saturation, depending on the device geometry. In both cases the non-linearity increases with the device bias voltage. Techniques such as spinning current [ 1 ] or orthogonal coupling are known to reduce the offset down to the 100 ⁇ T range.
  • the offset of integrated Hall sensors should however be reduced further, for instance to the 10 ⁇ T range.
  • An object of this invention is to provide a magnetic field sensor system that is accurate, and in particular has a low offset. It would be advantageous to provide a magnetic field sensor system that is economical to manufacture in large series.
  • an integrated circuit Hall sensor system comprising a plurality of elementary blocks (EB), each elementary block including a Hall cell, an input stage of an amplifier, and terminals, wherein the terminals are placed laterally on opposing outer sides of each elementary block and the plurality of elementary blocks are arranged in a juxtaposed manner to form at least one row interconnected by the terminals.
  • Each elementary block may advantageously further include a current source, and a four phase switch box connected to the Hall cell.
  • the input stage may comprise or consist in a differential pair and the amplifier may comprise or consist in a Differential Difference Amplifier (DDA).
  • DDA Differential Difference Amplifier
  • the Hall cells in each row may be connected and configured to operate in parallel.
  • each row of elementary blocks may be terminated by a second stage of the amplifier to form a front-end channel.
  • Each channel may further comprise a demodulator and an output buffer.
  • FIG. 1 is a graph showing typical residual offset as a function of the bias voltage applied on an integrated Hall cell
  • FIG. 2 is a schematic diagram of a DDA topology with differential signal connections In, Ip according to a feature of an embodiment of the invention
  • FIGS. 3 a and 3 b illustrate an elementary block (EB) forming a building unit for distributed Hall cell array of a sensor system according to an embodiment of the invention, where FIG. 3 a is a block diagram and FIG. 3 b a schematic circuit diagram
  • FIG. 4 is a floorplan of a two channel integrated Hall sensor system according to an embodiment of the invention.
  • FIG. 5 is a photograph of an example of an experimental setup of a Hall sensor system mounted on a PCB according to the invention.
  • FIG. 6 is a graph of differential residual offset drift in temperature for the experimental setup of FIG. 5 , whereby the Hall cell bias current was swept from 100 uA to 600 uA, and a difference at the outputs of the front-end channel 1 and channel 2 was measured for each temperature step.
  • FIG. 1 Typical offset values, as function of the voltage applied on a cross-shaped CMOS integrated Hall cell are shown in FIG. 1 , where the residual voltage is divided by the sensitivity to be expressed in magnetic field units. The residual offset was obtained after applying four-phase spinning current method at zero magnetic field.
  • FIG. 1 illustrates that it is important to keep the bias voltage low, however reducing the bias voltage degrades the signal-to-noise ratio because thermal noise then dominates.
  • the signal-to-noise ratio is significantly improved by integrating an array of Hall cells, each one weakly biased.
  • the array is advantageously scalable and easy to integrate without layout limitations.
  • the array comprises a Differential Difference Amplifier (DDA) topology (see reference [5] for a description of DDA design), offering flexibility in choosing the number of differential pairs 8 connected to common signal connections In, Ip of the DDA as illustrated in FIG. 2 .
  • the number of differential pairs can be increased by connecting other differential pairs in parallel to the common signal connections In, Ip.
  • DDA Differential Difference Amplifier
  • the differential sensing of the Hall voltage based on the DDA is preferred.
  • the choice of the biasing method may affect the structure and performance of the first signal-amplifying stage.
  • the circuit for Hall bias current could for instance be rearranged according to [6] and corresponding input stage incorporated in the elementary block.
  • each Hall cell is associated with a bias circuit and a part of an amplification stage that allows a parallel connection. These elements are part of an elementary block (EB), as shown in FIGS. 3 a and 3 b.
  • EB elementary block
  • the elementary block EB comprises a Hall device 4 , a switch box (also called spin box) 7 , a current source 5 and an input stage 8 of an amplifier.
  • the input stage comprises a differential pair 8 of a Differential Difference amplifier (DDA).
  • DDA Differential Difference amplifier
  • the switchbox 7 is driven by logic signals from a logic circuit 9 a , 9 b input through connections A, B, C and D of the EB to perform four-phase spinning current.
  • the differential pair 8 advantageously converts the Hall sensing voltage to a current signal that is easy to read.
  • the EB terminals 12 are placed laterally and symmetrically along a Y axis, to easily build up a row 6 a , 6 b containing a number N of elementary blocks EB interconnected by the adjacent opposing terminals 12 a , 12 b of adjacent elementary blocks.
  • the Hall cells 4 in each row 6 a , 6 b operate in parallel. Since the Hall signals of each Hall cell are correlated, the sum of currents of each elementary block represents the useful measurement signal, whereas the intrinsic offsets of Hall cells 4 are uncorrelated and averaged over the number of elementary blocks N.
  • the current signal is reconverted into a voltage in the 2 nd stage 11 a , 11 b of the DDA, which terminates each row 6 a , 6 b.
  • Each complete row 6 a , 6 b with its DDA 2 nd stage block 11 a , 11 b forms one front-end channel.
  • the front-end channel can be replicated by mirroring along an X axis, orthogonal to the Y axis, in order to realize two rows 6 a , 6 b of elementary blocks EB in mirror symmetry, in order to obtain a differential output and suppress undesirable systematic offsets generated by the electronics.
  • the topology of the system is “distributed” and symmetrical with respect to one centre-line axis X.
  • This architecture allows finding a good trade-off between offset reduction, sensitivity and current consumption.
  • the system is completed by conditioning circuits 9 a , 9 b that provide inter alia the spin box logic signals A, B, C, D, demodulators 14 based on switched-capacitor circuit, and output buffers 16 , for each channel to obtain a stand-alone magnetic field micro-sensor.
  • the back-end circuit may be similar to a conventional circuit, for instance as described in [ 7 ].
  • CMOS standard technology An experimental system in 0.35 um CMOS standard technology was built of 16 EB's, equally distributed in the central part of the layout as shown by the photograph of the chip in FIG. 5 .
  • the Hall signal was processed in a differential way and monitored in modulated form at the output of each DDA, or demodulated using switched capacitor technique with variable clock frequency, depending on the required signal bandwidth.
  • the logic circuit was either driven by the internal clock: a 2.6 MHz RC relaxation oscillator with frequency dividers, or externally controlled. The circuit was tested from the kHz range up to 1.3 MHz of modulation frequency.
  • the bias current of Hall cells can be externally controlled by a current source for testing purposes.
  • the layout size was of 1.6 ⁇ 1.6 mm2.
  • the third EB of the upper row is zoomed out and the Hall device location is schematized by a cross shape.
  • the total current consumption depends on the value of the Hall cell bias current: when applying 500 uA on each Hall cell, the overall current consumption was of 25 mA at 3.3 V supply voltage.
  • the experimental setup was used where the temperature and the Hall cell bias current can be swept.
  • a 6-layer permalloy magnetic shielding was used to protect the system from environmental noise and suppress the external magnetic field.
  • the tests were performed on three randomly selected samples.
  • the differential offset between the channels was monitored (this is the final offset of the system), but also the individual offset of each channel.
  • the system sensitivity depends on Hall cell bias current, for instance with a 500 uA bias current per Hall cell, the measured overall sensitivity was 21 V/T.
  • the modulated signal at the output of the DDA was monitored and demodulated with an external lock-in amplifier, synchronized by a logic signal coming from the system.
  • a relatively low modulation frequency of 5 kHz was selected to neglect the settling time of the DDA and the spikes generated by switches.
  • the Hall bias current was swept from 100 uA to 600 uA for each temperature step. Since the Hall voltage is modulated at the input of the DDA, the residual Hall offset can be separated from the DDA offset by the demodulation and extracted from the measurement.
  • the offset drift was measured in a temperature range from ⁇ 20 to 100° C.
  • FIG. 6 shows the differential offset drift for various Hall bias current measured on the experimental setup. For bias currents less than 200 uA, the offset drift is hidden by the noise. For Hall bias currents higher than 300 uA, the offset drift shows an increase similar to the behavior shown in FIG. 1 , although at a much lower level.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
US13/806,638 2010-07-02 2011-07-01 Hall sensor system Active 2033-09-26 US9453892B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP10168375.3 2010-07-02
EP10168375 2010-07-02
EP10168375A EP2402779A1 (en) 2010-07-02 2010-07-02 Hall sensor system
PCT/IB2011/052911 WO2012001662A1 (en) 2010-07-02 2011-07-01 Hall sensor system

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US20130099782A1 US20130099782A1 (en) 2013-04-25
US9453892B2 true US9453892B2 (en) 2016-09-27

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EP (2) EP2402779A1 (zh)
JP (1) JP6071876B2 (zh)
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US11630167B2 (en) 2021-01-25 2023-04-18 Chengdu Monolithic Power Systems Co., Ltd. Position sensing system with improved accuracy and the method thereof

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DE102012011759A1 (de) * 2012-06-13 2013-12-19 Gerrit Ebbers Verfahren zur Frequenzmessung von magnetischen Wellen
CN104502868A (zh) * 2014-12-29 2015-04-08 南京大学 一种高精度的十字霍尔传感器的电路模型
US9746531B2 (en) * 2015-03-05 2017-08-29 Sii Semiconductor Corporation Magnetic sensor circuit
CN105180927B (zh) * 2015-09-29 2018-06-19 珠海创智科技有限公司 磁导航传感器
US9705436B2 (en) * 2015-12-04 2017-07-11 Texas Instruments Incorporated Linear hall device based field oriented control motor drive system
RU2624565C1 (ru) * 2016-02-11 2017-07-04 федеральное государственное бюджетное образовательное учреждение высшего образования "Донской государственный технический университет" (ДГТУ) Инструментальный усилитель для работы при низких температурах
CN107395194B (zh) * 2017-08-29 2023-04-25 桂林电子科技大学 一种基于频率转换的电容传感器接口电路
US11761983B2 (en) * 2021-09-13 2023-09-19 Globalfoundries Singapore Pte. Ltd. Probe card integrated with a hall sensor

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Publication number Priority date Publication date Assignee Title
US11630167B2 (en) 2021-01-25 2023-04-18 Chengdu Monolithic Power Systems Co., Ltd. Position sensing system with improved accuracy and the method thereof

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JP2013535661A (ja) 2013-09-12
JP6071876B2 (ja) 2017-02-01
CN102971639B (zh) 2016-08-31
US20130099782A1 (en) 2013-04-25
EP2402779A1 (en) 2012-01-04
EP2588876A1 (en) 2013-05-08
EP2588876B1 (en) 2015-02-11
CN102971639A (zh) 2013-03-13
WO2012001662A1 (en) 2012-01-05

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