US9394416B2 - Functional film and method of manufacturing functional film - Google Patents

Functional film and method of manufacturing functional film Download PDF

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US9394416B2
US9394416B2 US13/222,497 US201113222497A US9394416B2 US 9394416 B2 US9394416 B2 US 9394416B2 US 201113222497 A US201113222497 A US 201113222497A US 9394416 B2 US9394416 B2 US 9394416B2
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organic layer
layer
organic
inorganic
layers
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US20120052272A1 (en
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Eijirou IWASE
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Fujifilm Corp
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Fujifilm Corp
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    • C08J7/045—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/048—Forming gas barrier coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]

Definitions

  • This invention relates to a functional film obtained by laminating a plurality of layers and a method of manufacturing a functional film.
  • Gas barrier films obtained by forming a film with a gas barrier property on a base film such as a polyethylene terephthalate (PET) film are used as packaging materials for packaging portions or constituent parts, which require a moisture-proof property, in various kinds of devices such as optical devices, display devices including liquid crystal display devices or organic EL display devices, semiconductor devices, and thin-film solar cells, food, clothing, electronic components, and the like.
  • a base film such as a polyethylene terephthalate (PET) film
  • PET polyethylene terephthalate
  • Films formed of various kinds of inorganic materials such as silicon nitride, silicon oxide, and aluminium oxide, are known as films with a gas barrier property formed in such a gas barrier film.
  • gas barrier laminate formed by laminating a plurality of layers, such as an organic layer (organic compound layer) and an inorganic layer (inorganic compound layer), in order to obtain the better gas barrier property is also known.
  • JP 2009-269193 A discloses a method of manufacturing a laminate in which a coated layer is formed by applying application liquid containing a monomer or an oligomer on a base, a process of forming an organic layer by curing the coated layer is repeated, a lower layer including two or more organic layers is formed, and an inorganic layer is formed on the lower layer using a vacuum deposition method.
  • the lower layer including two or more organic layers is formed on the surface of the substrate. Accordingly, since irregularities caused by foreign matter adhering to the substrate surface can be covered, the surface of the lower layer can be made smooth. As a result, since the occurrence of a defect in the inorganic layer formed on the lower layer is suppressed, it is possible to realize a gas barrier film with an excellent gas barrier property.
  • the inorganic layer showing the gas barrier property is protected mainly by forming the organic layer on the inorganic layer.
  • a plurality of organic layers and a plurality of inorganic layers may be laminated in order to obtain the better gas barrier property. That is, another organic layer may be further formed on the inorganic layer formed on the organic layer and another inorganic layer may be formed on the organic layer in order to obtain the better gas barrier property.
  • organic layers other than the organic layer formed on the base are formed with an inorganic layer as a base. Since there is a difference between the refractive index of an inorganic layer formed to obtain a gas barrier property and the refractive index of an organic layer, the reflectance at the interface between the inorganic layer and the organic layer increases and the light transmittance decreases accordingly.
  • a functional film comprising: a substrate; at least two organic layers; and at least one inorganic layer, wherein the at least two organic layers include a first organic layer directly formed on the substrate and a second organic layer which is an uppermost layer farthest from the substrate, wherein each of the at least two organic layers and each of the at least one inorganic layers are alternatively laminated on the substrate in such a way that one of an inorganic layer and an inorganic layer is formed on the other of the inorganic layer and the inorganic layer, wherein the first organic layer is thickest in the at least two organic layers, and the second organic layer is thinnest in the at least two organic layers, and wherein the second organic layer is thicker than a thickest inorganic layer in the at least one inorganic layer.
  • a highest refractive index in each refractive index of the at least two organic layers be lower than a lowest refractive index in each refractive index of the at least one inorganic layer.
  • a thickness of the first organic layer range from 500 nm to 3000 nm, and a thickness of the second organic layer range from 80 nm to 1000 nm.
  • the at least one inorganic layer be formed of silicon nitride, silicon oxide, silicon oxy-nitride, or aluminium oxide.
  • a refractive index of the second organic layer be lowest in respective refractive indices of the at least two organic layers.
  • the first organic layer and the second organic layer be made of different materials, respectively.
  • a method of manufacturing a functional film in which at least two organic layers and at least one inorganic layer are laminated on a substrate in such a way that one of an inorganic layer and an inorganic layer is formed on the other of the inorganic layer and the inorganic layer comprising the steps of: forming a first organic layer in the at least two organic layers directly on the substrate so as to be thickest in the at least two organic layers; forming an inorganic layer in the at least one inorganic layer on the first organic layer; and forming another organic layer in the at least two organic layers on the inorganic layer, wherein the forming step of the inorganic layer and the forming step of the another organic layer are performed at least once, and in the final forming step of the another organic layer, the uppermost organic layer as a second organic layer is formed on an inorganic layer which is located farthest from the substrate in the at least one inorganic layer so as to be thinnest in the at least two organic layers and to be
  • a highest refractive index in each refractive index of the at least two organic layers be set to be lower than a lowest refractive index in each refractive index of the at least one inorganic layer.
  • the at least two organic layers be formed using an application method.
  • the second organic layer be formed by the application method using a die coater.
  • the viscosity of the forming material of the first organic layer be equal to or smaller than 10 cP.
  • the viscosity of the forming material of the second organic layer be equal to or smaller than 5 cP.
  • the at least one inorganic layer be formed using a vacuum deposition method.
  • the second organic layer be formed so as to have a lowest refractive index in the at least two organic layers.
  • At least two organic layers and at least one inorganic layer are alternately formed on the substrate, an uppermost layer farthest from the substrate is formed as an organic layer, the thickness of the first organic layer directly formed on the substrate is equal to or larger than those of other organic layers, the thickness of the uppermost organic layer is equal to or smaller than those of other organic layers, and all organic layers are formed so as to be thicker than all inorganic layers. Therefore, an excellent gas barrier property can be obtained since the inorganic layer is formed on the organic layer with a smooth surface, and the high light transmittance can be obtained since the uppermost organic layer is formed so as to be thinner than other organic layers. In addition, since the thicknesses of organic layers other than the first organic layer are set to be equal to or smaller than that of the first organic layer, cracking of the organic layer can be prevented.
  • FIG. 1 is a conceptual view showing an example of a functional film according to an embodiment of the present invention.
  • FIGS. 2A and 2B are conceptual views showing an example of a manufacturing apparatus for executing a method of manufacturing a functional film according to an embodiment of the present invention, where FIG. 2A is an organic film forming apparatus and FIG. 2B is an inorganic film forming apparatus.
  • FIGS. 3A and 3B are conceptual views showing other examples of the functional film according to the embodiment of the present invention.
  • FIG. 1 is a conceptual view showing an example of a functional film according to an embodiment of the present invention.
  • the functional film according to the embodiment of the present invention is a functional film 10 obtained by forming a first organic layer 12 having a polymer as its main component on the surface of a substrate B 0 , forming an inorganic layer 14 on the first organic layer 12 using a vacuum deposition method, and forming an uppermost organic layer 16 with a smaller thickness than the first organic layer 12 on the inorganic layer 14 .
  • the first organic layer 12 serves to make the inorganic layer 14 as a gas barrier smooth so that the inorganic layer 14 can show the sufficient gas barrier property.
  • the uppermost organic layer 16 is basically a protective layer for protecting the inorganic layer 14 .
  • FIGS. 2A and 2B are conceptual views showing an example of a manufacturing apparatus for executing a method of manufacturing a functional film according to an embodiment of the present invention.
  • the method of manufacturing a functional film according to the embodiment of the present invention is executed by an organic film forming apparatus 20 shown in FIG. 2A and an inorganic film forming apparatus 22 shown in FIG. 2B .
  • the organic film forming apparatus 20 forms the first organic layer 12 on the surface of the substrate B 0 while transporting the long substrate film B 0 (original film; hereinafter, referred to as a substrate B 0 ) in its longitudinal direction.
  • the inorganic film forming apparatus 22 forms the inorganic layer 14 on the first organic layer 12 while transporting the substrate B 0 , on which the first organic layer 12 is formed, in its longitudinal direction.
  • the organic film forming apparatus 20 forms the uppermost organic layer 16 on the inorganic layer 14 while transporting the substrate B 0 on which the first organic layer 12 and the inorganic layer 14 are formed, in its longitudinal direction.
  • the functional film 10 according to the embodiment of the present invention shown in FIG. 1 is manufactured by the apparatuses shown in FIGS. 2A and 2B .
  • the organic film forming apparatus 20 is an apparatus which forms the first organic layer 12 on the surface of the substrate B 0 by applying/drying a coating material containing a monomer (monomer mixture), which becomes the first organic layer 12 , on the substrate B 0 and polymerizing the monomer.
  • the organic film forming apparatus 20 forms the uppermost organic layer 16 on the surface of a substrate B m2 in which the first organic layer 12 and the inorganic layer 14 are formed (hereinafter, simply referred to as a “substrate B m2 ”) by applying/drying a coating material containing a monomer (monomer mixture), which becomes the uppermost organic layer 16 , on the substrate B m2 and polymerizing the monomer.
  • a coating material containing a monomer (monomer mixture) which becomes the uppermost organic layer 16
  • the organic film forming apparatus 20 includes application means 26 , drying means 28 , a UV irradiation device 30 , a rotary shaft 32 , a winding shaft 34 , and a pair of transport rollers 36 and 38 .
  • the substrates B 0 and B m2 are simply called a “substrate B” when it is not necessary to distinguish the substrate B 0 from the substrate B m2 .
  • the first organic layer 12 and the uppermost organic layer 16 are simply called an “organic layer” when it is not necessary to distinguish the first organic layer 12 from the uppermost organic layer 16 .
  • the organic film forming apparatus 20 is an apparatus which feeds the substrate B from a substrate roll 40 in which the long substrate B (original film) is wound in a roll form, forms an organic layer (the first organic layer 12 or the uppermost organic layer 16 ) while transporting the substrate B in its longitudinal direction, and winds the substrate B on which the organic layer is formed in a roll form. That is, the organic film forming apparatus 20 is an apparatus which forms a film by the so-called roll-to-roll process.
  • the long substrate B is mounted on the rotary shaft 32 as the substrate roll 40 as described above.
  • the substrate B is transported along a predetermined transport path. That is, the substrate B moves from the substrate roll 40 through the transport roller pair 36 , passes below the application means 26 , the drying means 28 , and the UV irradiation device 30 , and passes through the transport roller pair 38 to reach the winding shaft 34 .
  • feeding of the substrate B from the substrate roll 40 and winding of the substrate B on the winding shaft 34 are performed simultaneously, and an organic layer (the first organic layer 12 or the uppermost organic layer 16 ) is continuously formed on the substrate B while transporting the long substrate B in its longitudinal direction along the predetermined transport path.
  • the substrate B 0 (substrate of a functional film) on which the first organic layer 12 is formed is not particularly limited. All various kinds of substrates (base films) used for various kinds of functional films, such as a gas barrier film, an optical film, and a protection film, are available as long as the first organic layer 12 , the uppermost organic layer 16 , and the inorganic layer 14 based on the vacuum deposition to be described later can be formed. Examples of the substrate include various kinds of resin films such as a PET film and various kinds of metal sheets such as an aluminum sheet.
  • various kinds of films such as a protective film and a bonding film, may be formed on the surface of the substrate B 0 .
  • substrate B 0 web-like base (substrate, support body)
  • plastic films formed of plastic materials such as polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polyethylene, polypropylene, polystyrene, polyamide, polyvinyl chloride, polycarbonate, polyacrylonitrile, polyimide, polyacrylate, and polymethacrylate, may be mentioned as preferred examples of the substrate B 0 .
  • the substrate B 0 may also be formed by forming layers (films) for obtaining various kinds of functions, such as a protective layer, a bonding layer, a light reflection layer, an anti-reflection layer, a shielding layer, a planarizing layer, a buffer layer, and a stress reducing layer, on the surface (surface on which the first organic layer 12 is to be formed) of the above plastic film.
  • layers films for obtaining various kinds of functions, such as a protective layer, a bonding layer, a light reflection layer, an anti-reflection layer, a shielding layer, a planarizing layer, a buffer layer, and a stress reducing layer, on the surface (surface on which the first organic layer 12 is to be formed) of the above plastic film.
  • the organic film forming apparatus 20 forms an organic film (organic layer; the first organic layer 12 and the uppermost organic layer 16 ), which contains a polymer or an oligomer as its main component, on the surface of the substrate B 0 .
  • an organic film include films formed of thermoplastic resins, such as polyester, acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamide-imide, polyether imide, cellulose acylate, polyurethane, polyetheretherketone, polycarbonate, alicyclic polyolefine, polyarylate, polyether sulfone, polysulfone, polycarbonate modified with fluorene ring, polycarbonate modified with alicycle, polyester modified with fluorene ring, and acryloyl compound, polysiloxane, and other organosilicon compounds.
  • thermoplastic resins such as polyester, acrylic resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene, transparent fluororesin, polyimide, fluorinated polyimide, polyamide, polyamide-imide, polyether imide, cellulose
  • an organic layer formed of polymers of radically polymerizable compound and/or cationically polymerizable compound having an ether group as a functional group is preferable.
  • acrylic resin or methacrylic resin having polymers of acrylate and/or methacrylate monomers as its main component is preferably used.
  • the organic film forming apparatus 20 is for forming an organic film by an application method (solution application method), and includes the application means 26 , the drying means 28 , and the UV irradiation device 30 .
  • Such an organic film forming apparatus 20 forms an organic film by applying the coating material containing a monomer mixture prepared in advance on the substrate B using the application means 26 and drying and polymerizing it.
  • the substrate B fed from the substrate roll 40 is transported in a state interposed between the transport roller pair 36 .
  • the substrate B is transported to the application means 26 .
  • the application means 26 applies a coating material containing monomer, which is prepared in advance and serves as an organic film, on the surface of the substrate B.
  • the method of applying a coating material is not particularly limited, and all kinds of known methods, such as a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, and a slide coating method, may be used.
  • an application method using a die coater is appropriately used in a point that materials other than the coating material are not in contact with the inorganic layer.
  • the organic film forming apparatus 20 in the example shown in the drawing forms an organic film by polymerizing the monomer by irradiation with UV light, which will be described later.
  • the coating material applied by the application means 26 contain a photopolymerization initiator (it is preferable to use a photopolymerization initiator together).
  • the drying means 28 dries the coating material applied by the application means 26 .
  • the method of drying a coating material is not particularly limited, and it is possible to use all kinds of known drying methods, such as heat drying using a heater or heat drying using warm air, as long as a coating material can be dried before reaching the UV irradiation device 30 according to the transport speed of the substrate B and the like.
  • the UV irradiation device 30 emits ultraviolet rays (UV light) to the coating material, which is applied by the application means 26 and dried by the drying means 28 , to polymerize the monomer, thereby forming an organic film.
  • UV light ultraviolet rays
  • the method of polymerizing monomers is not limited to the UV irradiation in the example shown in the drawing, and heating polymerization, light (visible light) polymerization, electron beam polymerization, plasma polymerization, or combination thereof (including UV irradiation) may also be appropriately used.
  • the method of forming an organic film is not limited to the application method in the example shown in the drawing, and a vacuum deposition method may also be appropriately used.
  • the vacuum deposition method is not particularly limited, film forming methods using vapor deposition, plasma CVD, and the like are preferable. Among them, a flash evaporation method disclosed in U.S. Pat. No. 4,842,893 B, U.S. Pat. No. 4,954,371 B, and U.S. Pat. No. 5,032,461 B is especially preferable.
  • the flash evaporation method is especially useful since it has an effect of reducing dissolved oxygen in a monomer and accordingly, it is possible to increase a polymerization rate.
  • a polymer may be applied as a solution, or it is possible to use a hybrid coating method using an inorganic material which is disclosed in JP 2000-323273 A and JP 2004-25732 A.
  • a polymer layer may be formed by forming a precursor (for example, a monomer) of a polymer as a film and polymerizing it.
  • the first organic layer 12 may also be formed by applying and curing a polymerizable adhesive which is commercially available.
  • a method using application is preferable as a method of forming an organic film since irregularities or deposits of the surface of the substrate B are covered so that the smoothness of the surface of an organic film, which serves as a base when forming an inorganic film, can be improved.
  • the smoothness of the surface of the organic film By improving the smoothness of the surface of the organic film, the occurrence of a defect in the inorganic film formed on the organic film can be prevented. As a result, the gas barrier property of a functional film can be improved.
  • the first organic layer 12 is formed with a largest thickness among all organic layers, and the uppermost organic layer 16 is formed with a smallest thickness among all organic layers. That is, in the functional film 10 according to the present embodiment shown in FIG. 1 , the first organic layer 12 is formed so as to be thicker than the uppermost organic layer 16 .
  • the surface of the substrate B 0 of the functional film has irregularities of the substrate itself or irregularities caused by foreign matter adhering thereto, these irregularities are the cause of a defect of an inorganic film. As a result, the gas barrier property may become worse.
  • the surface smoothness can be improved by forming the first organic layer 12 formed on the substrate B 0 so as to have a largest thickness among all organic layers and also forming the first organic layer 12 , which has a sufficient thickness so that the irregularities of the substrate B 0 can be covered, on the substrate B 0 .
  • an excellent gas barrier property can be realized.
  • the inorganic layer 14 serves as a base of the uppermost organic layer 16 .
  • an inorganic layer has a higher refractive index than an organic layer. Accordingly, if an organic layer is formed on an inorganic layer, the reflectance is increased between the inorganic layer and the organic layer. As a result, the transmittance is reduced. Therefore, in the present invention, a reduction in the transmittance is prevented by forming the uppermost organic layer 16 with a smallest thickness among all organic layers.
  • the uppermost organic layer 16 serves as a protective layer for protecting the inorganic layer 14 . Accordingly, since the uppermost organic layer 16 does not serve as a base of an inorganic layer, the uppermost organic layer 16 does not need to be formed thick in order to improve the surface smoothness.
  • the organic layer may crack. Accordingly, the uppermost organic layer 16 which does not need to be formed thick is formed thin in order to prevent cracking.
  • all organic layers are formed so as to be thicker than all inorganic layers. That is, in the present embodiment, the first organic layer 12 and the uppermost organic layer 16 are formed so as to be thicker than the inorganic layer 14 .
  • an inorganic layer is formed on an organic layer which covers irregularities and has a smooth surface, it is not necessary to form the inorganic layer thick in order to prevent the occurrence of a defect. Therefore, even if the inorganic layer is formed thin, a sufficient gas barrier property can be realized since a defect does not occur.
  • the thickness of the first organic layer 12 it is preferable to set the thickness of the first organic layer 12 to 500 to 3000 nm.
  • the first organic layer 12 By forming the first organic layer 12 with a thickness of 500 nm or more, irregularities on the substrate B 0 can be sufficiently covered. As a result, it is possible to improve the smoothness of the surface as a base for forming an inorganic layer.
  • the first organic layer 12 if the first organic layer 12 is formed too thick, the first organic layer 12 may crack or the transmittance may be reduced. Therefore, it is preferable to form the first organic layer 12 with a thickness of 3000 nm or less. In addition, it is more preferable to set the thickness of the first organic layer 12 to 500 to 2500 nm.
  • the thickness of the uppermost organic layer 16 it is preferable to set the thickness of the uppermost organic layer 16 to 80 to 1000 nm. By setting the thickness of the uppermost organic layer 16 to 80 nm or more, the inorganic layer 14 can be sufficiently protected. In addition, it is preferable to form the uppermost organic layer 16 with a thickness of 1000 nm or less in a point that cracking can be prevented and a reduction in the transmittance can be prevented. In addition, it is more preferable to set the thickness of the uppermost organic layer 16 to 80 to 500 nm.
  • the refractive index of the uppermost organic layer 16 be lower than those of other organic layers. That is, in the present embodiment, it is preferable that the refractive index of the uppermost organic layer 16 be lower than that of the first organic layer 12 .
  • the uppermost organic layer 16 is an interface with the air in the functional film 10 . If a refractive index difference between the uppermost organic layer 16 and the air is large, the reflectance at the interface is increased and the transmittance is reduced. Therefore, by forming the uppermost organic layer 16 with a lower refractive index than other organic layers, it is possible to prevent an increase in the reflectance at the interface between the uppermost organic layer 16 and the air and eventually to prevent a reduction in the transmittance.
  • the refractive index of the uppermost organic layer 16 it is preferable to set the refractive index of the uppermost organic layer 16 to 1.35 to 1.55. By setting the refractive index of the uppermost organic layer 16 in this range, it is possible to prevent an increase in the reflectance at the interface with the air and eventually to prevent a reduction in the transmittance.
  • the refractive indices of organic layers other than the uppermost organic layer 16 be 1.45 to 1.72. That is, in the present embodiment, it is preferable that the refractive index of the first organic layer 12 be 1.45 to 1.72.
  • the uppermost organic layer 16 and other organic layers may be formed of different materials so as to have different refractive indices.
  • hollow silica particles and the like may be added to a material of the uppermost organic layer 16 so that the refractive index of the formed organic layer 16 becomes low.
  • zirconium oxide, titanium oxide, and the like may be added to other organic layers (first organic layer 12 ) so that the refractive indices of the other organic layers become high.
  • the viscosity of a coating material when applying the coating material of the first organic layer 12 be set to 10 cP or less.
  • the viscosity of a coating material of the first organic layer 12 it is easy to cover the irregularities of the surface of the substrate B 0 and to improve the smoothness of the surface formed.
  • the viscosity of a coating material of the first organic layer 12 be 0.8 cP or more. When the viscosity of a coating material is 0.8 cP or less, a liquid drop phenomenon occurs. This is not preferable.
  • the viscosity of a coating material when applying the coating material of the uppermost organic layer 16 be set to 5 cP or less. By setting the viscosity of a coating material of the uppermost organic layer 16 to 5 cP or less, it becomes easy to form the uppermost organic layer 16 thin.
  • the viscosity of a coating material of the uppermost organic layer 16 be 0.8 cP or more. When the viscosity of a coating material is 0.8 cP or less, a liquid drop phenomenon occurs. This is not preferable.
  • the substrate B on which an organic film is formed as described above is transported to the transport roller pair 38 and is interposed therebetween. Then, the substrate B reaches the winding shaft 34 and is rewound in a roll form by the winding shaft 34 .
  • a substrate B y1 in which the first organic layer 12 is formed on the substrate B 0 (hereinafter, simply referred to as a “substrate B y1 ”) is wound in a roll form to become a substrate roll 42 , and then the substrate roll 42 is supplied to the inorganic film forming apparatus 22 (feed chamber 50 ).
  • the substrate B m2 is wound in a roll form by the winding shaft 34 to become a functional film roll. Then, the functional film roll is supplied for the next process.
  • the inorganic film forming apparatus 22 forms the inorganic layer 14 on the surface of the substrate B y1 (that is, the surface of the first organic layer 12 ) using a vacuum deposition method, and includes the feed chamber 50 , a film forming chamber 52 , and a take-up chamber 54 .
  • the inorganic film forming apparatus 22 is also an apparatus which forms a film by the roll-to-roll process.
  • the inorganic film forming apparatus 22 feeds the substrate B y1 from the substrate roll 42 , forms the inorganic layer 14 while transporting it in its longitudinal direction, and winding the substrate B m2 , in which the first organic layer 12 and the inorganic layer 14 are formed, in a roll form using a winding shaft 58 .
  • the feed chamber 50 includes a rotary shaft 56 , a guide roller 60 , and vacuum exhaust means 61 .
  • the substrate roll 42 in which the substrate B y1 obtained by forming the first organic layer 12 on the substrate B 0 is wound is mounted on the rotary shaft 56 of the feed chamber 50 .
  • the substrate B y1 is transported along a predetermined transport path. That is, the substrate B y1 moves from the feed chamber 50 through the film forming chamber 52 and reaches the winding shaft 58 of the take-up chamber 54 . Also in the inorganic film forming apparatus 22 , feeding of the substrate B y1 from the substrate roll 42 and winding of the substrate B m2 on the winding shaft 58 are performed simultaneously, and the organic layer 14 is continuously formed on the substrate B y1 in the film forming chamber 52 while transporting the long substrate B y1 in its longitudinal direction along the predetermined transport path.
  • the rotary shaft 56 is made to rotate clockwise in the drawing by a driving source (not shown) so that the substrate B y1 is fed from the substrate roll 42 . Then, the substrate B y1 is guided along the predetermined path by the guide roller 60 , so that the substrate B y1 is fed to the film forming chamber 52 .
  • the vacuum exhaust means 61 is disposed at the feed chamber 50 , and decompresses the inside of the feed chamber 50 to a predetermined degree of vacuum (pressure) according to the film forming pressure in the film forming chamber 52 . In this way, pressure of the feed chamber 50 is prevented from having an adverse effect on the pressure (film formation) of the film forming chamber 52 .
  • various kinds of members (transport means) for transporting the substrate B y1 along the predetermined path such as a transport roller pair and a guide member for regulating the position of the substrate B y1 in the width direction, may be provided in the feed chamber 50 .
  • the substrate B y1 is transported into the film forming chamber 52 by guiding of the guide roller 60 .
  • the film forming chamber 52 is for forming the inorganic layer 14 on the surface of the substrate B y1 (that is, the surface of the first organic layer 12 ) using a vacuum deposition method.
  • the film forming chamber 52 includes a drum 62 , film forming means 64 , a guide roller 68 , a guide roller 72 , and the vacuum exhaust means 74 .
  • an RF power supply, gas introduction means, or the like is further provided in the film forming chamber 52 .
  • the substrate B y1 is transported into the film forming chamber 52 through a slit 76 a formed in a partition wall 76 for separating the feed chamber 50 from the film forming chamber 52 .
  • vacuum exhaust means is also provided in the feed chamber 50 and the take-up chamber 54 , and the feed chamber 50 and the take-up chamber 54 have a vacuum state according to the film forming pressure in the film forming chamber 52 .
  • the apparatus for execution of the present invention is not limited to this.
  • the film forming chamber 52 substantially airtight by making a slit, through which the substrate B y1 passes, so as to be not in contact with the substrate B y1 and have a minimum size allowing the substrate B y1 to pass without providing the vacuum exhaust means in the feed chamber 50 and the take-up chamber 54 .
  • a sub-chamber through which the substrate B y1 passes may be provided between the feed chamber 50 and the film forming chamber 52 and between the take-up chamber 54 and the film forming chamber 52 without providing the vacuum exhaust means in the feed chamber 50 and the take-up chamber 54 , and the inside of the sub-chamber may be made to have a vacuum state using a vacuum pump.
  • the substrate B y1 transported into the film forming chamber 52 is guided along the predetermined path by the guide roller 68 and is wound at a predetermined position of the drum 62 .
  • the substrate B y1 is transported in its longitudinal direction in a state located at the predetermined position by the drum 62 , and the inorganic layer 14 is formed by the film forming means 64 using an inorganic film forming method.
  • the drum 62 of the film forming chamber 52 is a cylindrical member which rotates counterclockwise around the centerline in the drawing.
  • the drum 62 may be grounded or may be connected to an RF power supply so as to also act as a counter electrode.
  • temperature control means such as cooling means, may be provided inside the drum 62 .
  • the film forming means 64 is for forming the inorganic layer 14 on the surface of substrate B y1 , in which the first organic layer 12 is formed, using a vacuum deposition method.
  • the method of forming the inorganic layer 14 there is no particular limitation on the method of forming the inorganic layer 14 , and all kinds of known vacuum deposition methods (vapor deposition methods), such as CVD, plasma CVD, sputtering, vacuum deposition, and ion plating, may be used.
  • vapor deposition methods such as CVD, plasma CVD, sputtering, vacuum deposition, and ion plating
  • the film forming means 64 is formed by various kinds of members according to a vacuum deposition method to be executed.
  • the film forming means 64 is configured to include an induction coil for forming an induced magnetic field, gas supply means for supplying reactive gas to a film forming region, and the like.
  • the film forming means 64 is configured to include a shower head electrode which is hollow and has a large number of small holes at the surface facing the drum 62 , which is connected to a reactive gas supply source, and which serves as an RF electrode and reactive gas supply means.
  • the film forming means 64 is configured to include gas supply means and the like.
  • the film forming means 64 is configured to include target holding means or an RF electrode, gas supply means, and the like.
  • the vacuum exhaust means 74 exhausts the air from the film forming chamber 52 to make a vacuum state inside the film forming chamber 52 , so that the degree of vacuum according to formation of the inorganic layer 14 using a vacuum deposition method is obtained.
  • vacuum exhaust means 74 There is no particular limitation on the vacuum exhaust means 74 , and it is possible to use all kinds of known (vacuum) exhaust means used in a vacuum deposition apparatus, which uses vacuum pumps such as a turbomolecular pump, a mechanical booster pump, and a rotary pump, auxiliary means such as a cryogenic coil, and means for adjusting an ultimate degree of vacuum or the amount of exhaust gas.
  • vacuum pumps such as a turbomolecular pump, a mechanical booster pump, and a rotary pump
  • auxiliary means such as a cryogenic coil
  • the substrate B y1 which is supported/transported by the drum 62 and has the inorganic layer 14 formed by the film forming means 64 , that is, the substrate B m2 is guided along the predetermined path by the guide roller 72 and is transported into the take-up chamber 54 . Then, the substrate B m2 is wound in a roll form by the winding shaft 58 to become the substrate roll 40 and is then supplied to the organic film forming apparatus 20 again.
  • the inorganic layer 14 there is no particular limitation on the inorganic layer 14 to be formed, and it is possible to use all kinds of known films with a gas barrier property (vapor barrier property).
  • the inorganic layer 14 include layers formed of: metal oxides such as aluminium oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, and indium tin oxide (ITO); metal nitrides such as aluminium nitride; metal carbide such as aluminium carbide; silicon oxides such as silicon oxide, silicon oxynitride, silicon oxycarbide, and silicon carbide oxynitride; silicon nitrides such as silicon nitride and silicon carbide nitride; silicon carbides such as silicon carbide; hydrides of the above materials; mixtures of two or more kinds of materials described above; and hydrogen-containing compounds of the above materials.
  • metal oxides such as aluminium oxide, magnesium oxide, tantalum oxide, zirconium oxide, titanium oxide, and indium tin oxide (ITO)
  • metal nitrides such as aluminium nitride
  • metal carbide such as aluminium carbide
  • silicon oxides such as silicon oxide, silicon oxynitrid
  • silicon nitride, silicon oxide, silicon oxynitride, and aluminium oxide are preferable as a material of an inorganic layer of a functional film from the point of view in which a more preferable gas barrier property can be obtained.
  • the inorganic film is not limited to a single-layered film formed of an inorganic compound with a gas barrier property like the inorganic layer 14 shown in FIG. 1 , and an inorganic film having various layers may be used.
  • all inorganic layers are formed so as to be thinner than all organic layers. That is, in the present embodiment, the inorganic layer 14 is formed so as to be thinner than the first organic layer 12 and the uppermost organic layer 16 .
  • an inorganic layer is formed on an organic layer which covers irregularities and has a smooth surface in the present invention, it is not necessary to form the inorganic layer thick in order to prevent the occurrence of a defect. Therefore, even if the inorganic layer is formed thin, a sufficient gas barrier property can be realized since a defect does not occur.
  • the thickness of the inorganic layer 14 is not particularly limited, it is preferable to set the thickness of the inorganic layer 14 to 15 to 100 nm. By setting the thickness of the inorganic layer 14 to 15 nm or more, a sufficient gas barrier property can be realized.
  • the inorganic layer 14 may crack if the inorganic layer 14 is formed too thick, such a crack can be prevented by setting the thickness of the inorganic layer 14 to 100 nm or less. In addition, it is more preferable to set the thickness of the inorganic layer 14 to 20 to 75 nm.
  • refractive indices of all inorganic layers be higher than those of all organic layers.
  • refractive indices of all inorganic layers be higher than those of all organic layers.
  • the refractive index of an inorganic layer it is preferable to set the refractive index of an inorganic layer to 1.82 or less.
  • the refractive index of the inorganic layer it is possible to prevent an increase in the reflectance at the interface with the organic layer and eventually to prevent a reduction in the transmittance.
  • one means for forming the inorganic layer 14 may be provided in the film forming chamber 52 , or two or more film forming means may be provided.
  • the inorganic layer 14 may be a single layer or may be formed to have a plurality of layers. When forming an inorganic film so as to have a plurality of layers, these layers may be the same or may be different.
  • the substrate B y1 which has the inorganic layer 14 formed in the film forming chamber 52 by the film forming means 64 , that is, the substrate B m2 is guided by the guide roller 72 and is transported into the take-up chamber 54 through a slit 78 a formed in a partition wall 78 for separating the film forming chamber 52 from the take-up chamber 54 .
  • the take-up chamber 54 includes a guide roller 80 , the winding shaft 58 , and vacuum exhaust means 82 .
  • the substrate B m2 transported into the take-up chamber 54 is transported to the winding shaft 58 by guiding of the guide roller 80 , is wound in a roll form by the winding shaft 58 , and is supplied as the substrate B m2 for the next process.
  • the vacuum exhaust means 82 is also disposed in the take-up chamber 54 so that the take-up chamber 54 is decompressed to the degree of vacuum according to the film forming pressure in the film forming chamber 52 during film formation.
  • it is preferable to use known devices as the vacuum exhaust means 82 similar to the vacuum exhaust means 74 of the film forming chamber 52 .
  • the first organic layer 12 and the uppermost organic layer 16 are formed by the same organic film forming apparatus 20 .
  • the present invention is not limited to this, and the first organic layer 12 and the uppermost organic layer 16 may be formed by different organic film forming apparatuses.
  • the first organic layer 12 and the uppermost organic layer 16 are formed by the same film forming method.
  • the present invention is not limited to this, and the first organic layer 12 and the uppermost organic layer 16 may be formed using different film forming methods.
  • the first organic layer may be formed using a flash evaporation method, and the uppermost organic layer may be formed by application.
  • the functional film obtained by forming an organic layer and an inorganic layer alternately on the substrate is not limited to having a 3-layer configuration of “first organic layer 12 /inorganic layer 14 /uppermost organic layer 16 ” as shown in FIG. 1 , and may be a functional film with a layer configuration of five or more layers, such as a functional film with a 5-layer configuration of “first organic layer 12 /inorganic layer 14 /middle organic layer 112 /inorganic layer 14 /uppermost organic layer 16 ” as shown in FIG.
  • FIGS. 3A and 3B are conceptual views showing other examples of the functional film according to the embodiment of the present invention.
  • functional films 110 and 120 shown in FIGS. 3A and 3B have the same configuration as the functional film 10 shown in FIG. 1 except that the second organic layer 112 and the inorganic layer 14 are further provided. Accordingly, the same parts are denoted by the same reference numerals, and the following explanation will be focused on different parts.
  • the functional film 110 shown in FIG. 3A is a functional film obtained by forming the first organic layer 12 having a polymer as its main component on the surface of the substrate B 0 , forming the inorganic layer 14 on the first organic layer 12 using a vacuum deposition method, forming the second organic layer 112 on the inorganic layer 14 , forming the inorganic layer 14 on the second organic layer 112 , and forming the uppermost organic layer 16 on the inorganic layer 14 .
  • the second organic layer 112 is formed on the substrate B m2 in which the first organic layer 12 and the inorganic layer 14 are formed on the substrate B 0 , that is, on the inorganic layer 14 using the organic film forming apparatus 20 .
  • the method of forming the second organic layer 112 using the organic film forming apparatus 20 is basically the same as a method of forming of the first organic layer 12 and the uppermost organic layer 16 .
  • the thickness of the second organic layer 112 is equal to or smaller than that of the first organic layer 12 and is equal to or larger than the uppermost organic layer 16 .
  • the thickness of the second organic layer 112 By setting the thickness of the second organic layer 112 to be equal to or larger than that of the uppermost organic layer 16 , it is possible to improve the smoothness since the irregularities of the substrate B m2 are covered. Accordingly, since the occurrence of a defect in the inorganic layer 14 formed on the second organic layer 112 can be prevented, the gas barrier property can be improved.
  • the irregularities of the substrate B m2 can be sufficiently covered even if the thickness of the second organic layer 112 is equal to or smaller than that of the first organic layer 12 formed on the substrate B 0 . As a result, the smoothness can be improved.
  • the thickness of the second organic layer 112 it is preferable to set the thickness of the second organic layer 112 to 500 to 3000 nm.
  • the second organic layer 112 By forming the second organic layer 112 with a thickness of 500 nm or more, irregularities on the substrate B 0 can be sufficiently covered. As a result, it is possible to improve the smoothness of the surface as a base for forming an inorganic layer. In addition, it is possible to prevent cracking or a reduction in the transmittance by setting the thickness of the second organic layer 112 to 3000 nm or less. In addition, it is more preferable to set the thickness of the second organic layer 112 to 500 to 2500 nm.
  • the refractive index of the second organic layer 112 it is preferable to set the refractive index of the second organic layer 112 to be higher than that of the uppermost organic layer 16 .
  • the refractive index of the second organic layer 112 it is possible to prevent an increase in the reflectance at the interface with an inorganic layer and eventually to prevent a reduction in the transmittance.
  • the functional film 120 shown in FIG. 3B is manufactured by forming the second organic layer 112 and the inorganic layer 14 further before forming the uppermost organic layer 16 in the functional film 110 shown in FIG. 3A . That is, the functional film 120 is a functional film with a 7-layer configuration.
  • the second organic layer 112 and the inorganic layer 14 may be made to overlap in order to form a functional film with a layer configuration of seven or more layers.
  • Example 1-1 a functional film with a 3-layer configuration shown in FIG. 1 was manufactured.
  • a long PET film polyethylene terephthalate with a width of 1000 mm and a thickness of 100 ⁇ m was used.
  • a coating material for forming the first organic layer 12 As a coating material for forming the first organic layer 12 , a mixed solution obtained by mixing 200 g of acrylate based monomer (manufactured by Nippon Kayaku Co., Ltd., TMPTA), 20 g of photopolymerization initiator (manufactured by Nagase & Co., Ltd., Irg907), and 1700 g of organic solvent (MEK). In addition, the refractive index was adjusted by mixing 5 g of dispersion of titanium oxide (manufactured by JSR; MEK 10% dispersion) into the mixed solution.
  • the first organic layer 12 was formed on the surface of the substrate B 0 by applying/drying a prepared coating material and polymerizing a monomer mixture by UV irradiation.
  • a die coater was used as the application means 26 , and the application was controlled such that the thickness of the coating material became 10 ⁇ m.
  • drying means 28 drying means which uses warm air at 100° C. was used to dry the coating material.
  • an ultraviolet irradiation device was used as the UV irradiation device 30 .
  • the UV irradiation device controlled the amount of light such that the total amount of UV radiation became about 500 mJ/cm 2 .
  • the film thickness of the obtained first organic layer 12 was 1000 nm.
  • the measured refractive index of the first organic layer 12 was 1.60.
  • the substrate roll 42 was mounted into the inorganic film forming apparatus 22 shown in FIG. 2B , and an aluminum oxide film (alumina film) with a thickness of 50 nm serving as the inorganic layer 14 was formed on the surface of the substrate B y1 in which the first organic layer 12 was formed.
  • an aluminum oxide film alumina film
  • a film forming apparatus using reactive sputtering was used for the film forming chamber 52 .
  • Metal aluminum was used as a target and oxygen gas and argon gas were used as process gas.
  • the substrate B y1 was transported to the take-up chamber 54 through the film forming chamber 52 along a predetermined transport path.
  • the vacuum exhaust means 74 was driven to start exhausting the air from the film forming chamber 52 , and introduction of the process gas into the film forming chamber 52 was started when the pressure became 5 ⁇ 10 ⁇ 4 Pa. Then, the exhaust using the exhaust means 74 was controlled to set the pressure in the film forming chamber 52 to 1 ⁇ 10 ⁇ 3 Pa. At the same time as the start of exhaust of the film forming chamber 52 , the vacuum exhaust means 61 and 82 were driven to exhaust the air from the feed chamber 50 and the take-up chamber 54 , and the inside pressure was controlled to 5 ⁇ 10 ⁇ 4 Pa.
  • the substrate roll 40 was mounted into the organic film forming apparatus 20 shown in FIG. 2A , and the uppermost organic layer 16 was formed on the surface of the substrate B m2 in which the inorganic layer 14 was formed.
  • a coating material for forming the uppermost organic layer 16 As a coating material for forming the uppermost organic layer 16 , a mixed solution obtained by mixing 50 g of acrylate based monomer (manufactured by Nippon Kayaku Co., Ltd., TMPTA), 20 g of photopolymerization initiator (manufactured by Nagase & Co., Ltd., Irg907), and 1700 g of organic solvent (MEK). The refractive index was adjusted by mixing 5 g of dispersion of titanium oxide (manufactured by JSR; MEK 10% dispersion) into the mixed solution.
  • the uppermost organic layer 16 was formed on the surface of the substrate B m2 by applying/drying a prepared coating material and polymerizing a monomer mixture by UV irradiation.
  • a die coater was used as the application means 26 , and the application was controlled such that the thickness of the coating material became 4 ⁇ m.
  • the UV irradiation device 30 controlled the amount of light such that the total amount of UV radiation became about 500 J/cm 2 .
  • the thickness of the obtained uppermost organic layer 16 was 100 nm.
  • the measured refractive index of the uppermost organic layer 16 was 1.45.
  • the water vapor transmission rate at the temperature of 40° C. and the relative humidity of 90% was measured using a Ca method, and the gas barrier property was evaluated.
  • the water vapor transmission rate was 1.5 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.”
  • the total light transmittance was measured using a spectrophotometer, and the transmittance was evaluated.
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the first organic layer 12 was changed to 150 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ day). Accordingly, the evaluation was “fair.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the first organic layer 12 was changed to 3100 nm and the thickness of the uppermost organic layer 16 was changed to 1000 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 2.4 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 89%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the first organic layer 12 was changed to 500 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.8 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the uppermost organic layer 16 was changed to 500 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.6 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 83%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the uppermost organic layer 16 was changed to 1000 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.7 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 78%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the first organic layer 12 was changed to 40 nm and the first organic layer 12 was formed so as to be thinner than the inorganic layer 14 .
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 3.5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ day). Accordingly, the evaluation was “poor.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the first organic layer 12 was changed to 75 nm and the first organic layer 12 was formed so as to be thinner than other organic layers, that is, the uppermost organic layer 16 .
  • the gas barrier property was evaluated in the same manner as in Example 1-1.
  • the water vapor transmission rate was 2.5 ⁇ 10 ⁇ 3 g/(m 2 ⁇ day). Accordingly, the evaluation was “poor.”
  • the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the thickness of the uppermost organic layer 16 was changed to 10 nm and the uppermost organic layer 16 was formed so as to be thinner than the inorganic layer 14 .
  • the gas barrier property was evaluated in the same manner as in Example 1-1.
  • the water vapor transmission rate was 2.1 ⁇ 10 ⁇ 3 g/(m 2 ⁇ day). Accordingly, the evaluation was “poor.”
  • the total light transmittance was 89%. Accordingly, the evaluation was “good.”
  • Example 2-1 a functional film with a 5-layer configuration shown in FIG. 3A was manufactured.
  • the functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , the second organic layer 112 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the second organic layer 112 and the inorganic layer 14 were formed below the uppermost organic layer 16 of the functional film in Example 1-1.
  • the second organic layer 112 was formed on the surface of the substrate B m2 , in which the first organic layer 12 and the inorganic layer 14 were formed on the substrate B 0 , by applying/drying a prepared coating material and polymerizing a monomer mixture by UV irradiation.
  • the coating material for forming the second organic layer 112 As the coating material for forming the second organic layer 112 , a mixed solution obtained by mixing 200 g of acrylate based monomer (manufactured by Nippon Kayaku Co., Ltd., TMPTA), 20 g of photopolymerization initiator (manufactured by Nagase & Co., Ltd., Irg907), and 1700 g of organic solvent (MEK). In addition, the refractive index was adjusted by mixing 5 g of dispersion of titanium oxide (manufactured by JSR; MEK 10% dispersion) into the mixed solution.
  • TMPTA acrylate based monomer
  • photopolymerization initiator manufactured by Nagase & Co., Ltd., Irg907
  • MEK organic solvent
  • the refractive index was adjusted by mixing 5 g of dispersion of titanium oxide (manufactured by JSR; MEK 10% dispersion) into the mixed solution.
  • a die coater was used as the application means 26 , and the application was controlled such that the thickness of the coating material became 5 ⁇ m.
  • the UV irradiation device 30 controlled the amount of light such that the total amount of UV radiation became about 500 mJ/cm 2 .
  • the film thickness of the obtained second organic layer 112 was 500 nm.
  • the measured refractive index of the second organic layer 112 was 1.60.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 8.4 ⁇ 10 ⁇ 5 g/(m 2 ⁇ day). Accordingly, the evaluation was “excellent.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , the second organic layer 112 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 2-1 except that the thickness of the second organic layer 112 was changed to 1000 nm and the thickness of the uppermost organic layer 16 was changed to 1000 nm.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 7.6 ⁇ 10 ⁇ 5 g/(m 2 ⁇ day). Accordingly, the evaluation was “excellent.” In addition, when the transmittance was evaluated, the total light transmittance was 76%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , the second organic layer 112 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 2-1 except that the thickness of the second organic layer 112 was changed to 40 nm and the second organic layer 112 was formed so as to be thinner than the inorganic layer 14 .
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 4.5 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “fair.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , the second organic layer 112 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 2-1 except that the thickness of the second organic layer 112 was changed to 75 nm and the second organic layer 112 was formed so as to be thinner than other organic layers, that is, the uppermost organic layer 16 .
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 3.8 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “fair.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , the second organic layer 112 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 2-1 except that the thickness of the second organic layer 112 was changed to 2000 nm and the second organic layer 112 was formed so as to be thicker than the first organic layer 12 .
  • Example 1-1 After the manufacturing, the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 2.1 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “fair.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.” The evaluation results are shown in the following Table 1.
  • Example 1-1 1000 50 — — 100 good good
  • Example 1-2 150 50 — — 100 fair good
  • Example 1-4 500 50 — — 100 good good
  • Example 1-5 1000 50 — — 500 good fair
  • Example 1-6 1000 50 — — 1000 good fair Comparative 40 50 — — 100 poor good
  • Example 1-1 Comparative 75 50 — — 100 poor good
  • Example 1-3 Example 2-1 1000 50 500 50 100 excellent good
  • Example 2-2 Comparative 1000 50 2000 50 100 fair good
  • Example 2-3 1000 50 500 50 — — 100 fair good
  • Example 2-2 1000 50 1000 50 1000 excellent fair Comparative 1000 50 40 50 100 fair good
  • Example 2-1 Comparative 1000 50 75 50 100 fair good
  • Example 2-2 Comparative 1000 50 2000 50 100 fair good
  • Example 2-3
  • Example 1-2 in which the thickness of the first organic layer was 500 nm or less, the gas barrier property became a little worse. Presumably, the gas barrier property of the inorganic layer became worse because the thickness of the layer was too small and the smoothness could not be obtained accordingly.
  • Example 1-3 in which the thickness of the first organic layer was set to 3000 nm or more, the gas barrier property became a little worse.
  • the thickness of the first organic layer is preferably 500 to 3000 nm.
  • Examples 1-5 and 1-6 show that the transmittance decreases as the thickness of the uppermost organic layer increases. Therefore, it can be seen that the uppermost organic layer is preferably thin.
  • the gas barrier property became worse in Comparative Example 1-2 in which the thickness of the first organic layer was smaller than those of other organic layers and Comparative Example 2-2 in which the thickness of the second organic layer was smaller than that of the uppermost organic layer.
  • the gas barrier property of the inorganic layer became worse because the thickness of the organic layer as a base of the inorganic layer was too small and the smoothness could not be obtained accordingly.
  • the gas barrier property became worse in Comparative Example 2-3 in which the thickness of the second organic layer was larger than that of the first organic layer. Presumably, this is because the second organic layer was so thick as to cause cracking.
  • Example 3-1 the refractive index of the functional film in Example 1-1 was changed for comparison.
  • the refractive indices of the first organic layer and the uppermost organic layer were adjusted by changing the ratio of dispersion of titanium oxide (manufactured by JSR) mixed in a coating material of the organic layer.
  • Example 3-1 a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as in Example 1-1 except that the refractive indices of the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 were changed to 1.64, 1.72, and 1.45, respectively.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.5 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 88%. Accordingly, the evaluation was “good.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as for the functional film in Example 3-1 except that the refractive index of the uppermost organic layer 16 was changed to 1.60.
  • Example 1-1 After the manufacturing, the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.4 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 79%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as for the functional film in Example 3-1 except that the refractive index of the uppermost organic layer 16 was changed to 1.64.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.6 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 74%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as for the functional film in Example 3-1 except that the refractive indices of the first organic layer 12 and the uppermost organic layer 16 were changed to 1.45 and 1.75, respectively.
  • the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.5 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 68%. Accordingly, the evaluation was “fair.”
  • a functional film was manufactured by forming the first organic layer 12 , the inorganic layer 14 , and the uppermost organic layer 16 in this order on the surface of the substrate B 0 in the same manner as for the functional film in Example 3-1 except that the refractive indices of the first organic layer 12 and the uppermost organic layer 16 were changed to 1.45 and 1.64, respectively.
  • Example 2 After the manufacturing, the gas barrier property was evaluated in the same manner as in Example 1-1. As a result, the water vapor transmission rate was 1.4 ⁇ 10 ⁇ 4 g/(m 2 ⁇ day). Accordingly, the evaluation was “good.” In addition, when the transmittance was evaluated, the total light transmittance was 74%. Accordingly, the evaluation was “fair.” The evaluation results are shown in the following Table 2.
  • Example 3-1 1.64 1.72 1.45 good 88
  • Example 3-2 1.64 1.72 1.60 good 79
  • Example 3-3 1.64 1.72 1.68 good 74
  • Example 3-4 1.45 1.72 1.75 good 68
  • Example 3-5 1.45 1.72 1.64 good 74
  • Example 3-4 in which the refractive index of the inorganic layer is lower than that of the organic layer, the transmittance is decreased. Therefore, it can be seen that it is preferable that the refractive index of the inorganic layer be higher than that of the organic layer.
  • Examples 3-3, 3-4 and 3-5 in which the refractive index of the uppermost organic layer is higher than those of the other organic layers, the transmittance is decreased. Therefore, it can be seen that it is preferable that the refractive index of the uppermost organic layer be lower than those of the other organic layers.
  • Examples 3-1, 3-2 and 3-3 show that the transmittance increases as the refractive index of the uppermost layer decreases and accordingly, it is preferable that the refractive index of the uppermost layer be low.

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