US9271086B2 - Flat type speaker having damper-lead plate of PCB voice coil plate - Google Patents

Flat type speaker having damper-lead plate of PCB voice coil plate Download PDF

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Publication number
US9271086B2
US9271086B2 US13/985,169 US201213985169A US9271086B2 US 9271086 B2 US9271086 B2 US 9271086B2 US 201213985169 A US201213985169 A US 201213985169A US 9271086 B2 US9271086 B2 US 9271086B2
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United States
Prior art keywords
damper
plate
voice coil
lead
coil plate
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Expired - Fee Related, expires
Application number
US13/985,169
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English (en)
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US20140044287A1 (en
Inventor
Dong-man Kim
Yong-Ji Kwon
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Daehong Technew Co Ltd
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EXELWAY Inc
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Assigned to EXELWAY INC. reassignment EXELWAY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, DONG-MAN, KWON, Yong-Ji
Publication of US20140044287A1 publication Critical patent/US20140044287A1/en
Assigned to Occhiuti & Rohlicek LLP reassignment Occhiuti & Rohlicek LLP LIEN (SEE DOCUMENT FOR DETAILS). Assignors: EXELWAY INC.
Application granted granted Critical
Publication of US9271086B2 publication Critical patent/US9271086B2/en
Assigned to DAEHONG TECHNEW CO., LTD. reassignment DAEHONG TECHNEW CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EXELWAY, INC.
Assigned to EXELWAY INC. reassignment EXELWAY INC. RELEASE OF ATTORNEY'S LIEN Assignors: Occhiuti & Rohlicek LLP
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/24—Tensioning by means acting directly on free portions of diaphragm or cone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/046—Construction
    • H04R9/047—Construction in which the windings of the moving coil lay in the same plane

Definitions

  • the present invention relates to a flat type speaker and, more particularly, to a flat type speaker having damper-lead plates for a PCB voice coil plate, which can improve vibration efficiency by mounting the damper-lead plates on the top of the voice coil plate, reduce a production process by eliminating lead wires connected to a voice coil, and improve the deterioration of quality due to the disconnection of a lead wire.
  • a speaker is equipped with a voice coil and a vibration plate interposed between magnets, and the speaker generates sound when the vibration plate is vibrated by a movement of the voice coil.
  • a flat type speaker includes a flat type voice coil and magnets disposed on both sides of the flat type voice coil and spaced apart from each other at a specific interval.
  • induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, a frequency according to a voice is formed, and the frequency vibrates the vibration plate, thereby being reproduced into sound.
  • the voice coil is wound in an oval form or patterned and printed on one or both sides of a plate type coil base, thus forming a voice coil plate.
  • a vibration plate is attached to the top of the voice coil plate in a length direction.
  • the vibration plate is vibrated in response to a movement of the voice coil plate, thereby generating sound.
  • the voice coil formed in the voice coil plate is bonded to both terminals of a base frame that forms the outside of + and ⁇ lead wires, thereby forming a circuit.
  • the lead wires of the voice coil plate are connected to the terminals of the base frame using a soldering method, but this method is problematic in that the quality of the speaker is deteriorated.
  • the present invention has been made to solve the conventional problems, and an object of the present invention is to transfer more sound energy by connecting damper-lead plates between a vibration plate and a PCB voice coil plate.
  • Another object of the present invention is to reduce a manufacturing process by eliminating a problem in which lead wires are connected by soldering for electrical connection from a voice coil to the terminals of a base frame and to solve a quality deterioration problem attributable to the connection of the lead wires.
  • a flat type speaker having damper-lead plates for a PCB voice coil plate includes a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yokes formed therein; a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein; damper-lead plates including first and second damper-lead plates physically separated and having + and ⁇ terminals formed at the respective front ends of the damper-lead plates, wherein each of the first and the second damper-lead plates includes a coil plate spline adhered to the top of the voice coil plate and one or more wing splines having one end connected to the coil plate spline and the other end connected to the + or ⁇ terminal; and a vibration plate vibrated in response to the vibration of the voice coil plate with the vibration plate coming in contact with a top of the damper-lead plates.
  • the wing splines preferably are implemented so that they are brought in contact with a bottom of the vibration plate.
  • first and the second damper-lead plates may be made of conductive and metallic materials, and the second damper-lead plate may be symmetrical to the first damper-lead plate and rotated by 180 degrees from the first damper-lead plate.
  • first and the second damper-lead plates may be made of insulating materials and formed of one body, and the first and the second damper-lead plates may be coated with conductive materials in such a way as to be electrically separated.
  • Each of the first and the second damper-lead plates preferably may include a lead block connected to the front end of the voice coil by soldering at a front end on one or the other side of the coil plate spline or at front ends on both sides of the coil plate spline.
  • the width of the coil plate spline preferably may be smaller than or equal to the thickness of the voice coil plate, and the width of the lead block preferably may be greater than the width of the coil plate spline.
  • FIG. 1 is a perspective view of a flat type speaker having damper-lead plates for a PCB voice coil plate according to the present invention.
  • FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates for a PCB voice coil plate according to the present invention.
  • FIG. 3 is a perspective view of a coupling structure between the PCB voice coil plate and the damper-lead plates according to the present invention.
  • FIG. 4 is a perspective view of the damper-lead plates according to the present invention.
  • voice coil plate 110a voice coil 111: magnetic body 112: damper-lead plate 112a: first damper-lead plate 112b: second damper-lead plate 113: vibration plate 201a, 201b: coil plate spline 202a, 202b: wing spline 203a, 203b: terminal 204a, 204b, 205a, 205b: lead block
  • FIG. 1 is a perspective view of a flat type speaker having damper-lead plates for a PCB voice coil plate according to the present invention
  • FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates for a PCB voice coil plate according to the present invention.
  • the flat type speaker having damper-lead plates for a PCB voice coil plate includes a voice coil plate 110 on which a voice coil 110 a patterned and printed in a track form and formed in a Printed Circuit Board (PCB) form is patterned and printed, a pair of magnetic bodies 111 spaced apart from each other at a specific interval on the left and right of the voice coil plate 110 , a pair of damper-lead plates 112 connected to the top of the voice coil plate 110 and configured to assist up and down movements of the voice coil plate 110 and to have leads electrically connected to the voice coil 110 a formed therein, and a vibration plate 113 connected to the top of the damper-lead plates 112 and configured to transfer vibration energy in a sound form.
  • the flat type speaker can further include a base frame (not shown) made of synthetic materials which forms the outside and with which various parts can be combined.
  • Each of the magnetic bodies 111 can include a magnet at the center thereof and yokes or magnet plates combined on and below the magnet.
  • the pair of magnetic bodies 111 are spaced apart from each other at a specific interval and formed side by side, and the voice coil plate 110 is inserted into the interval between the formed magnetic bodies 111 .
  • the flat type speaker of the present invention includes the voice coil plate 110 and the magnetic bodies 111 disposed on both sides of the voice coil plate 110 with a specific interval interposed therebetween.
  • induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, and the voice coil plate 110 is moved up and down in response to the induced electromotive force.
  • the damper-lead plates 112 formed at the top of the voice coil plate 110 are vibrated while operating in conjunction with the up and down movements of the voice coil plate 110 . Accordingly, the vibration of the damper-lead plates 112 together with the vibration of the voice coil plate 110 is transferred to the vibration plate 113 , with the result that more vibration can be transferred to the vibration plate 113 as compared with the case where vibration is transferred by only the voice coil plate 110 .
  • + and ⁇ terminals are formed at both ends of the damper-lead plates 112 , and thus the power wire of the voice coil 110 a is connected to one side of the damper-lead plates 112 by soldering. Accordingly, the damper-lead plates 112 function as lead wires for connecting the voice coil and the + and ⁇ terminals mounted on the base frame.
  • damper-lead plates and the coupling structure between the voice coil plate and the damper-lead plates to be implemented by the present invention are described in detail below with reference to FIGS. 3 and 4 .
  • FIG. 3 is a perspective view of the coupling structure between the PCB voice coil plate and the damper-lead plates according to the present invention
  • FIG. 4 is a perspective view of the damper-lead plates according to the present invention.
  • the damper-lead plates 112 are connected to the top of the voice coil plate, and the damper-lead plates 112 function as sheet springs or dampers, that is, auxiliary means for transferring more vibration energy to the vibration plate. Furthermore, the terminals are formed at both ends of the damper-lead plates 112 , and the damper-lead plates 112 are formed of metal plates (or formed by coating conductive materials on an insulating plate). Accordingly, soldering connection with lead wires that was used for circuit connection with an existing voice coil can be eliminated, a failure due to the disconnection of a lead wire can be prevented by replacing the role of the lead wires with the metal plates, and difficulties in the process can be solved.
  • damper-lead plates 112 mean slim, long, and thin plates, such as metal, in a dictionary definition.
  • the damper-lead plates 112 include a pair of a first damper-lead plate 112 a and a second damper-lead plate 112 b on the left and right.
  • the first and the second damper-lead plates 112 a and 112 b are physically separated from each other and formed of metallic thin films having conductivity.
  • One of the first and the second damper-lead plates 112 a and 112 b forms a circuit using the + terminal, and the other thereof forms a circuit using the ⁇ terminal.
  • first and the second damper-lead plates 112 a and 112 b can be integrally formed physically and made of insulating materials.
  • first and the second damper-lead plates 112 a and 112 b can be coated with conductive materials so that they are electrically separated.
  • one of the first and the second damper-lead plates 112 a and 112 b can form the circuit using the + terminal, and the other thereof can form the circuit using the ⁇ terminal.
  • the second damper-lead plate 112 b is rotated by 180 degrees from a reference line in the length direction of the speaker in the state in which the second damper-lead plate 112 b is symmetrical to the first damper-lead plate 112 a on the basis of a line vertical to the reference line.
  • first and the second damper-lead plates 112 a and 112 b are symmetrical to each other left and right and up and down is to take advantages of a production process by making the first and the second damper-lead plates 112 a and 112 b substantially have the same structure. This reason is for equally maintaining the transfer of vibration energy to the vibration plate 113 , but there is no problem although the first and the second damper-lead plates 112 a and 112 b have different structures.
  • the first damper-lead plate 112 a includes a coil plate spline 201 a , a wing spline 202 a , a terminal 203 a , and one or more lead blocks 204 a and 205 a , which are integrally coupled seamlessly.
  • the second damper-lead plate 112 b includes a coil plate spline 201 b , a wing spline 202 b , a terminal 203 b , and one or more lead blocks 204 b and 205 b , which are integrally coupled seamlessly.
  • the coil plate splines 201 a and 201 b are parts adhered to the top of the voice coil plate 110 .
  • the wing splines 202 a and 202 b are protruded from middle points of the coil plate splines 201 a and 201 b .
  • the wing splines 202 a and 202 b come in contact with the bottom of the vibration plate 113 like dampers in a non-contact state, thus functioning to assist vibration.
  • the coil plate splines 201 a and 201 b are parts adhered to the top of the voice coil plate 110 in the state in which the voice coil plate 110 is upright.
  • the coil plate splines 201 a and 201 b are lengthily formed in width that corresponds to the thickness of the voice coil plate 110 .
  • Each of the wing splines 202 a and 202 b has a thin width, and the length of each of the wing splines 202 a and 202 b is about 1 ⁇ 2 of the flat type speaker.
  • the front ends of the wing splines 202 a and 202 b on one side are connected to the respective coil plate splines 201 a and 201 b , and the front ends of the wing splines 202 a and 202 b on the other side are connected to the respective terminals 203 a and 203 b .
  • the wing splines 202 a and 202 b function as media for electrically connecting the coil plate splines 201 a and 201 b and the terminals 203 a and 203 b and also function as vibration media for assisting the vibration of the voice coil plate 110 so that the vibration is transferred to the vibration plate 113 .
  • the terminals 203 a and 203 b are parts formed at the respective front ends of the first damper-lead plate 112 a and the second damper-lead plate 112 b and coupled with a power terminal pole formed in the base frame (not shown).
  • One of the terminals 203 a and 203 b is used as a + terminal, and the other thereof is used as a ⁇ terminal.
  • the lead blocks 204 a , 205 a and 204 b , 205 b are parts connected to the + and ⁇ wire parts of the voice coil 110 a of the voice coil plate 110 , and they function to electrically connect the voice coil 110 a and the terminals 203 a and 203 b.
  • a single-sided voice coil plate having the voice coil 110 a printed on one side thereof or a double-sided voice coil plate having the voice coils 110 a printed on both sides thereof can be used as the voice coil plate 110 .
  • the lead blocks 204 a , 205 a and 204 b , 205 b are protruded toward both sides of the coil plate splines 201 a and 201 b , so that the lead blocks 204 a , 205 a and 204 b , 205 b are connected to the voice coil in either side by soldering.
  • the + and ⁇ lead wires of the voice coil 110 a can be placed at front ends on both sides of the voice coil plate 110
  • the + and ⁇ lead wires of the voice coil 110 a can be placed at the center of the voice coil plate 110 .
  • the lead blocks are formed at respective front ends on both sides of the coil plate splines 201 a and 201 b.
  • the lead block 204 a and the lead block 204 b can be used as parts soldered to the + and ⁇ lead wires of the voice coil 110 a . If the + and ⁇ lead wires of the voice coil 110 a are placed at the center of the voice coil plate 110 , the lead block 205 a and the lead block 205 b can be used as parts soldered to the + and ⁇ lead wires of the voice coil 110 a . Accordingly, a soldering process between the voice coil 110 a and the damper-lead plates 112 can be efficiently performed.
  • the damper-lead plates 112 are configured to be connected to the voice coil plate 110 in the form of a sheet spring in such a way as to transfer more sound energy to the vibration plate 113 , thereby being capable of improving the quality of the speaker. Furthermore, the damper-lead plates 112 are formed of metallic thin films, the terminals 203 a and 203 b are formed on both sides of the damper-lead plates 112 , and the lead blocks 204 a , 204 b and 205 a , 205 b are formed at locations corresponding to the voice coil. Accordingly, the efficiency of a production process can be improved and quality can be maintained because a process of connecting the voice coil and the lead wires of the base frame is eliminated.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
US13/985,169 2011-02-16 2012-02-13 Flat type speaker having damper-lead plate of PCB voice coil plate Expired - Fee Related US9271086B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020110013776A KR101185377B1 (ko) 2011-02-16 2011-02-16 Ｐｃｂ 보이스 코일판의 진동-리드 플레이트를 갖는 평판형 스피커
KR10-2011-0013776 2011-02-16
PCT/KR2012/001037 WO2012111943A2 (ko) 2011-02-16 2012-02-13 Pcb 보이스 코일판의 진동-리드 플레이트를 갖는 평판형 스피커

Publications (2)

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US20140044287A1 US20140044287A1 (en) 2014-02-13
US9271086B2 true US9271086B2 (en) 2016-02-23

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US13/985,169 Expired - Fee Related US9271086B2 (en) 2011-02-16 2012-02-13 Flat type speaker having damper-lead plate of PCB voice coil plate

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US (1) US9271086B2 (ko)
EP (1) EP2677769A4 (ko)
JP (1) JP5572769B2 (ko)
KR (1) KR101185377B1 (ko)
CN (1) CN103444204B (ko)
WO (1) WO2012111943A2 (ko)

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EP3092820B1 (en) * 2014-01-06 2020-05-06 Wall Audio Inc. Linear moving coil magnetic drive system
USD733679S1 (en) 2014-01-06 2015-07-07 Wall Audio Inc. Planar loudspeaker
USD737245S1 (en) 2014-07-03 2015-08-25 Wall Audio, Inc. Planar loudspeaker
KR200489678Y1 (ko) * 2014-11-25 2019-07-23 (주)에스피에스 박막형 마그네틱 커넥터 모듈
CN107484091A (zh) * 2017-09-22 2017-12-15 四川长虹电器股份有限公司 扬声器及其电视机和音箱
KR102114439B1 (ko) * 2018-02-06 2020-05-22 김동만 다층 및 듀얼 트랙의 가동 코일을 구비한 평판형 스피커
WO2020030239A1 (en) * 2018-08-06 2020-02-13 Huawei Technologies Co., Ltd. Printed wiring board for an electronic device and electronic device comprising said printed wiring board
KR102061173B1 (ko) * 2018-08-07 2020-02-11 임성진 슬림 자기 코어를 구비한 장방형의 평판형 슬림 스피커
TWI686092B (zh) * 2018-10-12 2020-02-21 喬暘電子股份有限公司 音圈具有彈波功能的薄型揚聲器
CN111200778B (zh) * 2018-11-20 2021-08-31 乔旸电子股份有限公司 音圈具有弹波功能的薄型扬声器
KR102133523B1 (ko) * 2019-04-10 2020-07-13 주식회사 성주음향 서스펜션이 일체화된 평판형 스피커
CN111031451B (zh) * 2019-12-07 2022-04-05 歌尔股份有限公司 一种激励器及电子产品
TWI824451B (zh) * 2022-03-23 2023-12-01 志豐電子股份有限公司 具垂直平面音圈及導電振膜之平面喇叭結構

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US20030103642A1 (en) * 2001-11-30 2003-06-05 Tai-Yan Kam Rectangular transducer for panel-form loudspeaker
KR20040078627A (ko) 2004-08-23 2004-09-10 주식회사 이엠텍 편평형 보이스코일을 이용한 초슬림 사각형 마이크로 스피커
US20080205686A1 (en) * 2007-01-29 2008-08-28 Sony Corporation Speaker unit and speaker apparatus
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Publication number Priority date Publication date Assignee Title
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Also Published As

Publication number Publication date
WO2012111943A3 (ko) 2012-11-22
KR20120094336A (ko) 2012-08-24
JP2014506096A (ja) 2014-03-06
JP5572769B2 (ja) 2014-08-13
US20140044287A1 (en) 2014-02-13
CN103444204B (zh) 2016-05-18
CN103444204A (zh) 2013-12-11
EP2677769A2 (en) 2013-12-25
WO2012111943A2 (ko) 2012-08-23
EP2677769A4 (en) 2014-08-06
KR101185377B1 (ko) 2012-09-26

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