US9271060B2 - Flat type speaker having vibration-lead plate attached on top of vibration plate - Google Patents

Flat type speaker having vibration-lead plate attached on top of vibration plate Download PDF

Info

Publication number
US9271060B2
US9271060B2 US13/985,145 US201213985145A US9271060B2 US 9271060 B2 US9271060 B2 US 9271060B2 US 201213985145 A US201213985145 A US 201213985145A US 9271060 B2 US9271060 B2 US 9271060B2
Authority
US
United States
Prior art keywords
plate
damper
lead
voice coil
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US13/985,145
Other versions
US20140037114A1 (en
Inventor
Dong-man Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daehong Technew Co Ltd
Original Assignee
EXELWAY Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXELWAY Inc filed Critical EXELWAY Inc
Assigned to EXELWAY INC. reassignment EXELWAY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, DONG-MAN
Publication of US20140037114A1 publication Critical patent/US20140037114A1/en
Assigned to Occhiuti & Rohlicek LLP reassignment Occhiuti & Rohlicek LLP LIEN (SEE DOCUMENT FOR DETAILS). Assignors: EXELWAY INC.
Application granted granted Critical
Publication of US9271060B2 publication Critical patent/US9271060B2/en
Assigned to DAEHONG TECHNEW CO., LTD. reassignment DAEHONG TECHNEW CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: EXELWAY, INC.
Assigned to EXELWAY INC. reassignment EXELWAY INC. RELEASE OF ATTORNEY'S LIEN Assignors: Occhiuti & Rohlicek LLP
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/06Arranging circuit leads; Relieving strain on circuit leads
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/16Mounting or tensioning of diaphragms or cones
    • H04R7/24Tensioning by means acting directly on free portions of diaphragm or cone
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/04Construction, mounting, or centering of coil
    • H04R9/046Construction
    • H04R9/047Construction in which the windings of the moving coil lay in the same plane
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers

Definitions

  • the present invention relates to a flat type speaker and, more particularly, to a flat type speaker having damper-lead plates mounted on the top of a vibration plate, which can improve vibration efficiency by mounting the damper-lead plates on the top of the vibration plate, reduce a production process by eliminating lead wires through the direct soldering of the damper-lead plates to a voice coil, and improve the deterioration of quality due to the disconnection of a lead wire.
  • a speaker is equipped with a voice coil and a vibration plate interposed between magnets, and the speaker generates sound when the vibration plate is vibrated by a movement of the voice coil.
  • a flat type speaker includes a flat type voice coil and magnets disposed on both sides of the flat type voice coil and spaced apart from each other at a specific interval.
  • induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, a frequency according to a voice is formed, and the frequency vibrates the vibration plate, thereby being reproduced into sound.
  • the voice coil is wound in an oval form or patterned and printed on one or both sides of a plate type coil base, thus forming a voice coil plate.
  • a vibration plate is attached to the top of the voice coil plate in a length direction.
  • the vibration plate is vibrated in response to a movement of the voice coil plate, thereby generating sound.
  • the voice coil formed in the voice coil plate is bonded to both terminals of a base frame that forms the outside of + and ⁇ lead wires, thereby forming a circuit.
  • the lead wires of the voice coil plate are connected to the terminals of the base frame using a soldering method, but this method is problematic in that the quality of the speaker is deteriorated.
  • the present invention has been made to solve the conventional problems, and an object of the present invention is to transfer more sound energy by mounting damper-lead plates on the top of a vibration plate, in particular, in the edge space of the vibration plate.
  • Another object of the present invention is to eliminate a problem in which lead wires are connected by soldering for electrical connection from a voice coil to the terminals of a base frame, reduce a manufacturing process by implementing electrical connection through direct soldering to the voice coil, and solve a quality deterioration problem attributable to the connection of the lead wires.
  • a flat type speaker having damper-lead plates mounted on a vibration plate includes a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yokes formed therein; a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein; damper-lead plates including first and second damper-lead plates physically separated and having + and ⁇ terminals formed at the respective front ends of the damper-lead plates, wherein each of the first and the second damper-lead plates includes a coil plate spline adhered to the top of the voice coil plate and one or more wing splines having one end connected to the coil plate spline and the other end connected to the + or ⁇ terminal; and a vibration plate vibrated in response to the vibration of the voice coil plate with the vibration plate coming in contact with a top of the damper-lead plates.
  • the wing splines preferably are implemented so that they are brought in contact with a bottom of the vibration plate.
  • first and the second damper-lead plates may be made of conductive and metallic materials, and the second damper-lead plate may be symmetrical to the first damper-lead plate and rotated by 180 degrees from the first damper-lead plate.
  • first and the second damper-lead plates may be made of insulating materials and formed of one body, and the first and the second damper-lead plates may be coated with conductive materials in such a way as to be electrically separated.
  • Each of the first and the second damper-lead plates preferably may include a lead block connected to the front end of the voice coil by soldering at a front end on one or the other side of the coil plate spline or at front ends on both sides of the coil plate spline.
  • the width of the coil plate spline preferably may be smaller than or equal to the thickness of the voice coil plate, and the width of the lead block preferably may be greater than the width of the coil plate spline.
  • more sound energy can be transferred by mounting the damper-lead plates on the top of the vibration plate, in particular, in the edge space of the vibration plate. Furthermore, a problem in which lead wires are connected by soldering for electrical connection from the voice coil to the terminals of the base frame can be eliminated, a manufacturing process can be reduced by implementing electrical connection through direct soldering to the voice coil, and a quality deterioration problem attributable to the connection of the lead wires can be solved.
  • FIG. 1 is a perspective view of a flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
  • FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
  • FIG. 3 is a perspective view of the damper-lead plates according to the present invention.
  • FIG. 4 is a perspective view of the connection structure of the voice coil plate and the damper-lead plates according to the present invention.
  • FIG. 1 is a perspective view of a flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention
  • FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
  • the flat type speaker having damper-lead plates mounted on the top of a vibration plate includes a voice coil plate 110 on which a voice coil wound or patterned and printed in a track form is patterned and printed, a pair of magnetic bodies 111 spaced apart from each other at a specific interval on the left and right of the voice coil plate 110 , a vibration plate 112 connected to the top of the voice coil plate 110 and transferring vibration energy in a sound form, a pair of damper-lead plates 113 mounted on the top of the vibration plate 112 and configured to assist up and down movements of the voice coil plate 110 and to have leads electrically connected to the voice coil formed therein, and a base frame 114 made of synthetic materials, which forms the outside and with which various parts can be combined.
  • Each of the magnetic bodies 111 can include a magnet at the center thereof and yokes or magnet plates combined on and below the magnet.
  • the pair of magnetic bodies 111 are spaced apart from each other at a specific interval and formed side by side, and the voice coil plate 110 is inserted into the interval between the formed magnetic bodies 111 .
  • the flat type speaker of the present invention includes the voice coil plate 110 and the magnetic bodies 111 disposed on both sides of the voice coil plate 110 with a specific interval interposed therebetween.
  • induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, and the voice coil plate 110 is moved up and down in response to the induced electromotive force.
  • the vibration plate 112 formed on the voice coil plate 110 is vibrated while operating in conjunction with the up and down movements of the voice coil plate 110 .
  • the damper-lead plates 113 are configured to be mounted on the top of the vibration plate 112 , and the mounting structure is described in more detail below with reference to FIGS. 3 and 4 .
  • the damper-lead plates 113 include two plates having a symmetrical structure in such a manner that the two plates are physically separated from each other and configured to face each other in the state in which one of the two plates is rotated by 180 degrees.
  • Each of the damper-lead plates 113 is configured to have + and ⁇ terminals for power connection formed at both ends thereof, and the + and ⁇ terminals are mounted on both ends of a previously fabricated base frame 114 .
  • the vibration of the damper-lead plates 113 having a damper function is added to the vibration of the vibration plate 112 vibrated in response to the vibration of the voice coil plate 110 , so that more sound energy is transferred.
  • the + and ⁇ terminals are formed at both ends of the damper-lead plates 113 , and the power wire of the voice coil 110 a is connected to one side of the damper-lead plates 113 by soldering. Accordingly, the damper-lead plates 113 function as lead wires for connecting the voice coil 110 a and + and ⁇ terminals mounted on the base frame 114 .
  • damper-lead plates The structure of the damper-lead plates and the mounting structure of the damper-lead plates, the vibration plate, and the voice coil plate to be implemented by the present invention are described in detail below with reference to FIGS. 3 and 4 .
  • FIG. 3 is a perspective view of the damper-lead plates according to the present invention
  • FIG. 4 is a perspective view of the connection structure of the voice coil plate and the damper-lead plates according to the present invention.
  • the damper-lead plates 113 are mounted on the top of the vibration plate 112 , and the damper-lead plates 113 function to maximize sound energy output by vibrating more vibration energy along with the vibration plate 112 . Furthermore, the + and ⁇ terminals are formed at both ends of the damper-lead plates 113 , and the damper-lead plates 113 are formed of metal plates (or formed by coating insulating material plates with conductive material). Accordingly, soldering connection with lead wires that was used for circuit connection with an existing voice coil can be eliminated, a failure due to the disconnection of a lead wire can be prevented by replacing the role of the lead wires with the metal plates, and difficulties in the process can be solved.
  • damper-lead plates 113 mean slim, long, and thin plates, such as metal, in a dictionary definition.
  • the damper-lead plates 113 of the flat type speaker according to the present invention include a pair of a first damper-lead plate 113 a and a second damper-lead plate 113 b on the left and right.
  • the first and the second damper-lead plates 113 a and 113 b are physically separated from each other (A, B) and are formed of metallic thin films having conductivity.
  • One of the first and the second damper-lead plates 113 a and 113 b forms a circuit using the + terminal, and the other thereof forms a circuit using the ⁇ terminal.
  • the first and the second damper-lead plates 113 a and 113 b can be integrally formed physically and made of insulating materials.
  • the first and the second damper-lead plates 113 a and 113 b can be coated with conductive materials so that they are electrically separated.
  • one of the first and the second damper-lead plates 113 a and 113 b can form the circuit using the + terminal and the other thereof can form the circuit using the ⁇ terminal.
  • the second damper-lead plate 113 b is rotated by 180 degrees from a line vertical to a reference line, that is, a specific parallel slant line in the length direction of the first damper-lead plate 113 a , in the state in which the second damper-lead plate 113 b is symmetrical to the first damper-lead plate 113 a on the basis of the reference line.
  • first and the second damper-lead plates 113 a and 113 b are symmetrical to each other left and right and up and down is to take advantages of a production process by making the first and the second damper-lead plates 113 a and 113 b substantially have the same structure. This reason is for equally maintaining the transfer of vibration energy on the left and right sides along with the vibration plate 112 , but there is no problem although the first and the second damper-lead plates 113 a and 113 b have different structures.
  • the first damper-lead plate 113 a includes a vibration plate spline 301 a , first and second wing splines 302 a and 303 a , a pair of terminals 304 a , and a lead block 305 a , which are integrally coupled seamlessly.
  • the second damper-lead plate 113 b includes a vibration plate spline 301 b , first and second wing splines 302 b and 303 b , a pair of terminals 304 b , and a lead block 305 b , which are integrally coupled seamlessly.
  • the vibration plate splines 301 a and 301 b are parts adhered to the outer line of the main body 401 of the vibration plate 112 .
  • the wing splines 302 a , 303 a and 302 b , 303 b are protruded from one points of the vibration plate splines 301 a and 301 b , bent in opposite directions, and then placed on the edge ( 402 ) parts of the vibration plate 112 in a non-contact state, thus perform a damper function.
  • the vibration plate splines 301 a and 301 b and the wing splines 302 a , 303 a and 302 b , 303 b are lengthily formed in a length direction with a slim width.
  • each of the vibration plate splines 301 a and 301 b is configured to be protruded in such a way to be oriented downward in a ‘ ’ form.
  • Blocks each having the ‘ ’ form are called the lead blocks 305 a and 305 b.
  • the lead blocks 305 a and 305 b are integrally formed with the vibration plate splines 301 a and 301 b and configured to penetrate vibration plate holes 403 a and 403 b formed in the main body 401 of the vibration plate 112 .
  • the lead blocks 305 a and 305 b that penetrate the vibration plate holes 403 a and 403 b function as the central guide of the voice coil plate 110 and also function as a + and ⁇ connection function through soldering with the voice coil 110 a of the voice coil plate 110 placed under the vibration plate 112 .
  • the terminals 304 a and 304 b are formed at the front ends of the wing splines 302 a , 303 a and 302 b , 303 b.
  • the terminals 304 a and 304 b are mounted on a power terminal pole formed in the base frame 114 .
  • One of the terminals 304 a and 304 b is used as a + terminal, and the other thereof is used as a ⁇ terminal.
  • the lead blocks 305 a and 305 b are connected to the + and ⁇ wire parts of the voice coil 110 a of the voice coil plate 110 by soldering.
  • the lead blocks 305 a and 305 b are integrally connected to the first and the second damper-lead plates 113 a and 113 b and connected to the terminals 304 a and 304 b formed at the front ends of the first and the second damper-lead plates 113 a and 113 b , thereby completing electrical connection up to the voice coil 110 a and the terminals 304 a and 304 b.
  • the damper-lead plates 113 are configured to be connected to the vibration plate 112 in the form of a sheet spring in such a way as to transfer more sound energy to the vibration plates 112 , thereby being capable of improving the quality of the speaker. Furthermore, the damper-lead plates 113 are formed of metallic thin films, the terminals 304 a and 304 b are formed on both sides of the damper-lead plates 113 , and the lead blocks 305 a and 305 b are formed at locations corresponding to the voice coil. Accordingly, the efficiency of a production process can be improved and quality can be maintained because a process of connecting the voice coil and the lead wires of the base frame is eliminated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

A flat-type speaker includes a voice coil plate, a pair of magnetic bodies having a magnet and a yoke formed side by side, separated at a predetermined interval; the voice coil plate being in a space between the magnetic bodies, and having printed thereon a voice coil with a spiral pattern; a vibration-lead plate having physically separated first and second vibration-lead plates, each having +, − terminals formed on the front ends thereof, the first and the second vibration-lead plates each equipped with a coil plate spline, which adheres to the upper end of the voice coil plate, and at least one wing spline having one end thereof connected to the coil plate spline and the other end connected to the terminals; and a vibration plate, which vibrates from the vibration received from the voice coil plate, while being contacted to the upper end portion of the vibration-lead plate.

Description

CROSS REFERENCE TO RELATED APPLICATION
This application is the national phase under 35 USC 371 of international application no. PCT/KR2012/001038, filed Feb. 13, 2012, which claims the benefit of the priority date of Korean application no. 10-2011-0013784, filed Feb. 16, 2011. The contents of the aforementioned applications are incorporated herein in their entirety.
TECHNICAL FIELD
The present invention relates to a flat type speaker and, more particularly, to a flat type speaker having damper-lead plates mounted on the top of a vibration plate, which can improve vibration efficiency by mounting the damper-lead plates on the top of the vibration plate, reduce a production process by eliminating lead wires through the direct soldering of the damper-lead plates to a voice coil, and improve the deterioration of quality due to the disconnection of a lead wire.
BACKGROUND ART
A speaker is equipped with a voice coil and a vibration plate interposed between magnets, and the speaker generates sound when the vibration plate is vibrated by a movement of the voice coil.
A flat type speaker includes a flat type voice coil and magnets disposed on both sides of the flat type voice coil and spaced apart from each other at a specific interval. In this flat type speaker, induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, a frequency according to a voice is formed, and the frequency vibrates the vibration plate, thereby being reproduced into sound.
The voice coil is wound in an oval form or patterned and printed on one or both sides of a plate type coil base, thus forming a voice coil plate.
A vibration plate is attached to the top of the voice coil plate in a length direction. The vibration plate is vibrated in response to a movement of the voice coil plate, thereby generating sound.
Furthermore, the voice coil formed in the voice coil plate is bonded to both terminals of a base frame that forms the outside of + and − lead wires, thereby forming a circuit.
In a conventional voice coil plate, however, a contact area with the vibration plate is small because the voice coil plate is adhered to the vibration plate in an upright state. As a result, the transfer of vibration energy is limited.
Furthermore, since the lead wires formed in the voice coil plate are bonded to the base frame, a problem in which the bonding is broken because the voice coil plate is moved up and down, but the base frame is fixed is frequently generated.
Furthermore, in general, the lead wires of the voice coil plate are connected to the terminals of the base frame using a soldering method, but this method is problematic in that the quality of the speaker is deteriorated.
DISCLOSURE Technical Problem
Accordingly, the present invention has been made to solve the conventional problems, and an object of the present invention is to transfer more sound energy by mounting damper-lead plates on the top of a vibration plate, in particular, in the edge space of the vibration plate.
Another object of the present invention is to eliminate a problem in which lead wires are connected by soldering for electrical connection from a voice coil to the terminals of a base frame, reduce a manufacturing process by implementing electrical connection through direct soldering to the voice coil, and solve a quality deterioration problem attributable to the connection of the lead wires.
Technical Solution
To achieve the above objects, a flat type speaker having damper-lead plates mounted on a vibration plate according to the present invention includes a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yokes formed therein; a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein; damper-lead plates including first and second damper-lead plates physically separated and having + and − terminals formed at the respective front ends of the damper-lead plates, wherein each of the first and the second damper-lead plates includes a coil plate spline adhered to the top of the voice coil plate and one or more wing splines having one end connected to the coil plate spline and the other end connected to the + or − terminal; and a vibration plate vibrated in response to the vibration of the voice coil plate with the vibration plate coming in contact with a top of the damper-lead plates.
Here, the wing splines preferably are implemented so that they are brought in contact with a bottom of the vibration plate.
Here, the first and the second damper-lead plates may be made of conductive and metallic materials, and the second damper-lead plate may be symmetrical to the first damper-lead plate and rotated by 180 degrees from the first damper-lead plate.
Here, the first and the second damper-lead plates may be made of insulating materials and formed of one body, and the first and the second damper-lead plates may be coated with conductive materials in such a way as to be electrically separated.
Each of the first and the second damper-lead plates preferably may include a lead block connected to the front end of the voice coil by soldering at a front end on one or the other side of the coil plate spline or at front ends on both sides of the coil plate spline.
The width of the coil plate spline preferably may be smaller than or equal to the thickness of the voice coil plate, and the width of the lead block preferably may be greater than the width of the coil plate spline.
Advantageous Effects
In accordance with the construction of the present invention, more sound energy can be transferred by mounting the damper-lead plates on the top of the vibration plate, in particular, in the edge space of the vibration plate. Furthermore, a problem in which lead wires are connected by soldering for electrical connection from the voice coil to the terminals of the base frame can be eliminated, a manufacturing process can be reduced by implementing electrical connection through direct soldering to the voice coil, and a quality deterioration problem attributable to the connection of the lead wires can be solved.
DESCRIPTION OF DRAWINGS
FIG. 1 is a perspective view of a flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
FIG. 3 is a perspective view of the damper-lead plates according to the present invention.
FIG. 4 is a perspective view of the connection structure of the voice coil plate and the damper-lead plates according to the present invention.
MODE FOR INVENTION
Hereinafter, the construction and effects of a flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention are described with reference to the accompanying drawings.
FIG. 1 is a perspective view of a flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention, and FIG. 2 is an exploded perspective view of the flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention.
As shown in FIG. 1 and FIG. 2, the flat type speaker having damper-lead plates mounted on the top of a vibration plate according to the present invention includes a voice coil plate 110 on which a voice coil wound or patterned and printed in a track form is patterned and printed, a pair of magnetic bodies 111 spaced apart from each other at a specific interval on the left and right of the voice coil plate 110, a vibration plate 112 connected to the top of the voice coil plate 110 and transferring vibration energy in a sound form, a pair of damper-lead plates 113 mounted on the top of the vibration plate 112 and configured to assist up and down movements of the voice coil plate 110 and to have leads electrically connected to the voice coil formed therein, and a base frame 114 made of synthetic materials, which forms the outside and with which various parts can be combined.
Each of the magnetic bodies 111 can include a magnet at the center thereof and yokes or magnet plates combined on and below the magnet. The pair of magnetic bodies 111 are spaced apart from each other at a specific interval and formed side by side, and the voice coil plate 110 is inserted into the interval between the formed magnetic bodies 111.
The flat type speaker of the present invention includes the voice coil plate 110 and the magnetic bodies 111 disposed on both sides of the voice coil plate 110 with a specific interval interposed therebetween. When a current flows in the voice coil, induced electromotive force is generated according to Fleming's left-hand law and Lorentz's force, and the voice coil plate 110 is moved up and down in response to the induced electromotive force.
Here, the vibration plate 112 formed on the voice coil plate 110 is vibrated while operating in conjunction with the up and down movements of the voice coil plate 110.
The damper-lead plates 113 are configured to be mounted on the top of the vibration plate 112, and the mounting structure is described in more detail below with reference to FIGS. 3 and 4.
The damper-lead plates 113 include two plates having a symmetrical structure in such a manner that the two plates are physically separated from each other and configured to face each other in the state in which one of the two plates is rotated by 180 degrees. Each of the damper-lead plates 113 is configured to have + and − terminals for power connection formed at both ends thereof, and the + and − terminals are mounted on both ends of a previously fabricated base frame 114.
Thus, the vibration of the damper-lead plates 113 having a damper function is added to the vibration of the vibration plate 112 vibrated in response to the vibration of the voice coil plate 110, so that more sound energy is transferred. Furthermore, the + and − terminals are formed at both ends of the damper-lead plates 113, and the power wire of the voice coil 110 a is connected to one side of the damper-lead plates 113 by soldering. Accordingly, the damper-lead plates 113 function as lead wires for connecting the voice coil 110 a and + and − terminals mounted on the base frame 114.
The structure of the damper-lead plates and the mounting structure of the damper-lead plates, the vibration plate, and the voice coil plate to be implemented by the present invention are described in detail below with reference to FIGS. 3 and 4.
FIG. 3 is a perspective view of the damper-lead plates according to the present invention, and FIG. 4 is a perspective view of the connection structure of the voice coil plate and the damper-lead plates according to the present invention.
The damper-lead plates 113 are mounted on the top of the vibration plate 112, and the damper-lead plates 113 function to maximize sound energy output by vibrating more vibration energy along with the vibration plate 112. Furthermore, the + and − terminals are formed at both ends of the damper-lead plates 113, and the damper-lead plates 113 are formed of metal plates (or formed by coating insulating material plates with conductive material). Accordingly, soldering connection with lead wires that was used for circuit connection with an existing voice coil can be eliminated, a failure due to the disconnection of a lead wire can be prevented by replacing the role of the lead wires with the metal plates, and difficulties in the process can be solved.
Various splines that form the damper-lead plates 113 mean slim, long, and thin plates, such as metal, in a dictionary definition.
Referring to FIGS. 3 and 4, the damper-lead plates 113 of the flat type speaker according to the present invention include a pair of a first damper-lead plate 113 a and a second damper-lead plate 113 b on the left and right.
The first and the second damper- lead plates 113 a and 113 b are physically separated from each other (A, B) and are formed of metallic thin films having conductivity. One of the first and the second damper- lead plates 113 a and 113 b forms a circuit using the + terminal, and the other thereof forms a circuit using the − terminal.
Alternatively, although not shown, the first and the second damper- lead plates 113 a and 113 b can be integrally formed physically and made of insulating materials. Here, the first and the second damper- lead plates 113 a and 113 b can be coated with conductive materials so that they are electrically separated. As a result, one of the first and the second damper- lead plates 113 a and 113 b can form the circuit using the + terminal and the other thereof can form the circuit using the − terminal.
The second damper-lead plate 113 b is rotated by 180 degrees from a line vertical to a reference line, that is, a specific parallel slant line in the length direction of the first damper-lead plate 113 a, in the state in which the second damper-lead plate 113 b is symmetrical to the first damper-lead plate 113 a on the basis of the reference line.
The reason why the first and the second damper- lead plates 113 a and 113 b are symmetrical to each other left and right and up and down is to take advantages of a production process by making the first and the second damper- lead plates 113 a and 113 b substantially have the same structure. This reason is for equally maintaining the transfer of vibration energy on the left and right sides along with the vibration plate 112, but there is no problem although the first and the second damper- lead plates 113 a and 113 b have different structures.
The first damper-lead plate 113 a includes a vibration plate spline 301 a, first and second wing splines 302 a and 303 a, a pair of terminals 304 a, and a lead block 305 a, which are integrally coupled seamlessly. Likewise, the second damper-lead plate 113 b includes a vibration plate spline 301 b, first and second wing splines 302 b and 303 b, a pair of terminals 304 b, and a lead block 305 b, which are integrally coupled seamlessly.
The vibration plate splines 301 a and 301 b are parts adhered to the outer line of the main body 401 of the vibration plate 112. The wing splines 302 a, 303 a and 302 b, 303 b are protruded from one points of the vibration plate splines 301 a and 301 b, bent in opposite directions, and then placed on the edge (402) parts of the vibration plate 112 in a non-contact state, thus perform a damper function.
The vibration plate splines 301 a and 301 b and the wing splines 302 a, 303 a and 302 b, 303 b are lengthily formed in a length direction with a slim width.
One end of each of the vibration plate splines 301 a and 301 b is configured to be protruded in such a way to be oriented downward in a ‘
Figure US09271060-20160223-P00001
’ form. Blocks each having the ‘
Figure US09271060-20160223-P00001
’ form are called the lead blocks 305 a and 305 b.
The lead blocks 305 a and 305 b are integrally formed with the vibration plate splines 301 a and 301 b and configured to penetrate vibration plate holes 403 a and 403 b formed in the main body 401 of the vibration plate 112.
The lead blocks 305 a and 305 b that penetrate the vibration plate holes 403 a and 403 b function as the central guide of the voice coil plate 110 and also function as a + and − connection function through soldering with the voice coil 110 a of the voice coil plate 110 placed under the vibration plate 112.
The terminals 304 a and 304 b are formed at the front ends of the wing splines 302 a, 303 a and 302 b, 303 b.
The terminals 304 a and 304 b are mounted on a power terminal pole formed in the base frame 114. One of the terminals 304 a and 304 b is used as a + terminal, and the other thereof is used as a − terminal.
The lead blocks 305 a and 305 b are connected to the + and − wire parts of the voice coil 110 a of the voice coil plate 110 by soldering. The lead blocks 305 a and 305 b are integrally connected to the first and the second damper- lead plates 113 a and 113 b and connected to the terminals 304 a and 304 b formed at the front ends of the first and the second damper- lead plates 113 a and 113 b, thereby completing electrical connection up to the voice coil 110 a and the terminals 304 a and 304 b.
Existing connection between a voice coil and the terminal pole of a base frame was implemented by a process of soldering lead wires. In this case, a work process is problematic, and a phenomenon in which a lead wire is broken because the terminal pole of the base frame is fixed and a voice coil plate is moved up and down can be generated. The damper-lead plates 113 of the present invention can supplement the conventional problem.
As described above, the damper-lead plates 113 are configured to be connected to the vibration plate 112 in the form of a sheet spring in such a way as to transfer more sound energy to the vibration plates 112, thereby being capable of improving the quality of the speaker. Furthermore, the damper-lead plates 113 are formed of metallic thin films, the terminals 304 a and 304 b are formed on both sides of the damper-lead plates 113, and the lead blocks 305 a and 305 b are formed at locations corresponding to the voice coil. Accordingly, the efficiency of a production process can be improved and quality can be maintained because a process of connecting the voice coil and the lead wires of the base frame is eliminated.
While preferred embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains will understand that the present invention may be implemented in other detailed forms without departing from the technical spirit or essential characteristics of the present invention. Accordingly, the aforementioned embodiments should not be construed as being limitative, but should be construed as being only illustrative from all aspects. Furthermore, the scope of the present invention is defined by the appended claims rather than the detailed description, and it should be understood that all modifications or variations derived from the meanings and scope of the present invention and equivalents thereof are included in the scope of the appended claims.

Claims (6)

The invention claimed is:
1. A flat type speaker having damper-lead plates mounted on a vibration plate, comprising:
a pair of magnetic bodies spaced apart from each other at a specific interval, formed side by side, and each having a magnet and yoke formed therein;
a voice coil plate inserted into an interval between the magnetic bodies and having a voice coil spirally patterned and printed formed therein;
a vibration plate brought in contact with a top of the voice coil plate and vibrated in response to a vibration of the voice coil plate; and
first and second damper-lead plates adhered to a top of a main body of the vibration plate and arranged in parallel, each of the first and second damper-lead plates comprising a vibration plate spline having a slim and long plate form, and one or more wing splines having one end connected to the vibration plate spline and having a slim and long plate form.
2. The flat type speaker of claim 1, wherein:
a lead block having a ‘
Figure US09271060-20160223-P00001
’ form is formed at one end of the vibration plate spline,
the lead blocks are configured to penetrate vibration plate holes formed in the vibration plate and connected to the voice coil by soldering, and
a + or − terminal is formed at one end of the wing spline.
3. The flat type speaker of claim 1, wherein:
a pair of the wing splines are extended from the vibration plate spline and bent in opposite directions, and
a + or − terminal is formed at a front end of each of the pair of the wing splines.
4. The flat type speaker of claim 1, wherein the wing spline is placed on an edge of the vibration plate.
5. The flat type speaker of claim 1, wherein:
the first and the second damper-lead plates are made of conductive and metallic materials, and
the second damper-lead plate has a symmetrical structure rotated by 180 degrees from the first damper-lead plate.
6. The flat type speaker of claim 1, wherein:
the first and the second damper-lead plates are made of insulating materials and formed of one body, and
the first and the second damper-lead plates are coated with conductive materials in such a way as to be electrically separated.
US13/985,145 2011-02-16 2012-02-13 Flat type speaker having vibration-lead plate attached on top of vibration plate Expired - Fee Related US9271060B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020110013784A KR101119499B1 (en) 2011-02-16 2011-02-16 Flat type speaker having damper-lead plate mounted on diaphragm
KR10-2011-0013784 2011-02-16
PCT/KR2012/001038 WO2012111944A2 (en) 2011-02-16 2012-02-13 Flat type speaker having vibration-lead plate attached on top of vibration plate

Publications (2)

Publication Number Publication Date
US20140037114A1 US20140037114A1 (en) 2014-02-06
US9271060B2 true US9271060B2 (en) 2016-02-23

Family

ID=45840597

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/985,145 Expired - Fee Related US9271060B2 (en) 2011-02-16 2012-02-13 Flat type speaker having vibration-lead plate attached on top of vibration plate

Country Status (5)

Country Link
US (1) US9271060B2 (en)
EP (1) EP2677768A4 (en)
KR (1) KR101119499B1 (en)
CN (1) CN103404171B (en)
WO (1) WO2012111944A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD829903S1 (en) * 2015-02-26 2018-10-02 Covidien Lp Shipping wedge

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139386B1 (en) * 2010-08-17 2012-04-30 주식회사 엑셀웨이 Vibration-lead plate mounted between voice coil plate and diaphragm for flat type speaker
KR101259398B1 (en) 2012-10-15 2013-04-30 범진아이엔디(주) A speaker
US9794666B1 (en) * 2016-06-14 2017-10-17 Bose Corporation Miniature voice coil having helical lead-out for electro-acoustic transducer
KR102061173B1 (en) * 2018-08-07 2020-02-11 임성진 Flat type and rectangle slim speaker having slim magnetic circuit core
RU2746441C1 (en) * 2020-06-02 2021-04-14 Сотис АГ Loudspeaker

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10191494A (en) 1996-10-30 1998-07-21 Matsushita Electric Ind Co Ltd Speaker
US20030103642A1 (en) * 2001-11-30 2003-06-05 Tai-Yan Kam Rectangular transducer for panel-form loudspeaker
KR20040078627A (en) 2004-08-23 2004-09-10 주식회사 이엠텍 Ultra slim square micro speaker using voice coil of flat type
US20080205686A1 (en) * 2007-01-29 2008-08-28 Sony Corporation Speaker unit and speaker apparatus
JP2010272988A (en) 2009-05-19 2010-12-02 Onkyo Corp Magnetic circuit for speaker and electrodynamic speaker using the circuit
US20120008816A1 (en) * 2010-07-09 2012-01-12 Lin Liu Electroacoustic vibrating transducer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090040952A (en) * 2007-10-23 2009-04-28 (주)에스더블유피신우전자 Electronic sounder
KR101017070B1 (en) * 2009-05-06 2011-02-25 에스텍 주식회사 Speaker
KR100963559B1 (en) * 2009-07-20 2010-06-15 범진아이엔디(주) Slim type speaker
CN201623849U (en) * 2010-01-06 2010-11-03 张志明 Platform loudspeaker

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10191494A (en) 1996-10-30 1998-07-21 Matsushita Electric Ind Co Ltd Speaker
US20030103642A1 (en) * 2001-11-30 2003-06-05 Tai-Yan Kam Rectangular transducer for panel-form loudspeaker
KR20040078627A (en) 2004-08-23 2004-09-10 주식회사 이엠텍 Ultra slim square micro speaker using voice coil of flat type
US20080205686A1 (en) * 2007-01-29 2008-08-28 Sony Corporation Speaker unit and speaker apparatus
JP2010272988A (en) 2009-05-19 2010-12-02 Onkyo Corp Magnetic circuit for speaker and electrodynamic speaker using the circuit
US20120008816A1 (en) * 2010-07-09 2012-01-12 Lin Liu Electroacoustic vibrating transducer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD829903S1 (en) * 2015-02-26 2018-10-02 Covidien Lp Shipping wedge
USD829902S1 (en) * 2015-02-26 2018-10-02 Covidien Lp Shipping wedge

Also Published As

Publication number Publication date
WO2012111944A2 (en) 2012-08-23
EP2677768A2 (en) 2013-12-25
WO2012111944A3 (en) 2012-11-22
EP2677768A4 (en) 2017-08-23
CN103404171A (en) 2013-11-20
KR101119499B1 (en) 2012-02-28
US20140037114A1 (en) 2014-02-06
CN103404171B (en) 2016-03-09

Similar Documents

Publication Publication Date Title
US9271086B2 (en) Flat type speaker having damper-lead plate of PCB voice coil plate
US9117434B2 (en) Vibration-lead plate for flat type speaker, mounted between voice coil plate and vibration plate
US9271060B2 (en) Flat type speaker having vibration-lead plate attached on top of vibration plate
US9210512B2 (en) Flat-type speaker having plurality of magnetic circuits which are horizontally connected
KR101201828B1 (en) FLAT TYPE SPEAKER COMBINING n MAGNET AND n+1 VOICE COIL PLATE
KR101297658B1 (en) Lead plate unified fpcb for flat speaker
US20210136499A1 (en) Screen sounding exciter and electronic device
US20210029466A1 (en) Hybrid movable coil plate and flat plate-type speaker using same
US20130051604A1 (en) Speaker
US20210136500A1 (en) Screen sounding exciter and electronic device
US20140233766A1 (en) Flat-type speaker having a plurality of consecutively connected magnetic circuits
US20200314576A1 (en) Speaker
KR101154253B1 (en) Flat type speaker having voice coil plate of three dimensional track type
KR101139388B1 (en) Damper-lead plate having danper and lead wire function of voice coil plate for flat type speaker
CN109413553A (en) A kind of such as magnetic type loudspeaker
CN205385601U (en) Loudspeaker
US20130177183A1 (en) Vibration speaker
CN214481240U (en) Loudspeaker
CN208971802U (en) A kind of double diaphragm such as magnetic type loudspeaker
CN209002211U (en) A kind of double diaphragm such as magnetic type loudspeaker
CN208971794U (en) Bone conduction vibrator and earphone
CN202135035U (en) Horizontally vibration motor
CN209002212U (en) A kind of double diaphragm such as magnetic type loudspeaker
KR20140115915A (en) Piezoelectric vibration device
TWM650907U (en) Ribbon-type speaker

Legal Events

Date Code Title Description
AS Assignment

Owner name: EXELWAY INC., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KIM, DONG-MAN;REEL/FRAME:031442/0151

Effective date: 20131016

ZAAA Notice of allowance and fees due

Free format text: ORIGINAL CODE: NOA

ZAAB Notice of allowance mailed

Free format text: ORIGINAL CODE: MN/=.

AS Assignment

Owner name: OCCHIUTI & ROHLICEK LLP, MASSACHUSETTS

Free format text: LIEN;ASSIGNOR:EXELWAY INC.;REEL/FRAME:037633/0366

Effective date: 20160113

STCF Information on status: patent grant

Free format text: PATENTED CASE

AS Assignment

Owner name: DAEHONG TECHNEW CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:EXELWAY, INC.;REEL/FRAME:045715/0149

Effective date: 20180404

AS Assignment

Owner name: EXELWAY INC., KOREA, REPUBLIC OF

Free format text: RELEASE OF ATTORNEY'S LIEN;ASSIGNOR:OCCHIUTI & ROHLICEK LLP;REEL/FRAME:047308/0425

Effective date: 20180625

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20240223