US8835811B2 - Thermal processing apparatus and method of controlling the same - Google Patents

Thermal processing apparatus and method of controlling the same Download PDF

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Publication number
US8835811B2
US8835811B2 US13/408,223 US201213408223A US8835811B2 US 8835811 B2 US8835811 B2 US 8835811B2 US 201213408223 A US201213408223 A US 201213408223A US 8835811 B2 US8835811 B2 US 8835811B2
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control
unit
zones
unit areas
furnace body
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US20120223066A1 (en
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Koji Yoshii
Tatsuya Yamaguchi
Wenling Wang
Takanori Saito
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, TAKANORI, YAMAGUCHI, TATSUYA, WANG, WENLING, YOSHII, KOJI
Publication of US20120223066A1 publication Critical patent/US20120223066A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D21/00—Arrangements of monitoring devices; Arrangements of safety devices
    • F27D21/0014—Devices for monitoring temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Definitions

  • the present invention relates to a thermal processing apparatus and a method of controlling the same.
  • thermal processing apparatuses In the manufacture of semiconductor devices, various thermal processing apparatuses are used for subjecting objects to be processed, such as semiconductor wafers, to thermal processes such as an oxidation process, a diffusion process, a CVD process and an annealing process.
  • a vertical-type thermal processing apparatus capable of thermally processing a number of objects to be processed at once.
  • the vertical-type thermal processing apparatus includes: a quartz processing vessel having a lower opening; a lid member configured to open and close the opening of the processing vessel; a holder disposed on the lid member, the holder being configured to hold a plurality of objects to be processed with equal intervals therebetween in an up and down direction; and a furnace body disposed around the processing vessel, and provided with a heater for heating the objects to be processed loaded into the processing vessel.
  • a space in the furnace body is divided into a plurality of control zones, and in-furnace temperature sensors are placed in the respective control zones.
  • a heater is divided for the respective control zones, whereby temperatures of the respective control zones are finely controlled.
  • the present invention has been made in view of the above circumstances.
  • the object of the present invention is to provide a thermal processing apparatus and a method of controlling the same, which are capable of improving a temperature uniformity in a furnace body when a temperature is stabilized, and of easily controlling the temperature in the furnace body when a temperature is increased or decreased.
  • a thermal processing apparatus in one embodiment is a thermal processing apparatus comprising: a furnace body; a processing vessel disposed in the furnace body, the processing vessel defining, between the furnace body and the processing vessel, a space including therein a plurality of unit areas, and the processing vessel being configured to accommodate a plurality of objects to be processed; a heating unit disposed on an inner surface of the furnace body, correspondingly to each of the unit areas of the space; an in-furnace temperature sensor disposed correspondingly to each of the unit areas of the space; and a control unit configured to control, based on a signal from the in-furnace temperature sensor of each of the unit areas, the heating unit of the unit area; wherein: the control unit includes a large-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is large, and a small-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is small; and the control unit is configured to select the small-number
  • each of the control zones is formed of the one unit area, and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of the one unit area, the heating unit of the unit area; and in the small-number control zone mode, at least the one control zone is formed of the plurality of adjacent unit areas, and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of the desired unit area out of the plurality of the unit areas, the heating units of the plurality of unit areas.
  • control unit is configured to control, in the large-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for large-number control zones, and is configured to control, in the small-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for small-number control zones.
  • a blower is connected to the furnace body through a cooling-medium supply line, the blower being configured to supply a cooling medium to the space between the furnace body and the processing vessel, and the furnace body is provided with an exhaust pipe; and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of each of the unit areas, the heating unit of the unit area and the blower.
  • control unit is configured to select the small-number control zone mode so as to control the heating unit of each of the control zones and the blower, when a temperature is increased or decreased.
  • a thermal processing apparatus in another embodiment is a thermal processing apparatus comprising: a furnace body: a processing vessel disposed in the furnace body, the processing vessel defining, between the furnace body and the processing vessel, a space including therein a plurality of unit areas, and the processing vessel being configured to accommodate a plurality of objects to be processed; a heating unit disposed on an inner surface of the furnace body, correspondingly to each of the unit areas of the space; an in-processing-vessel temperature sensor disposed correspondingly to each of the unit areas in the processing vessel; and a control unit configured to control, based on a signal from the in-processing-vessel temperature sensor of each of the unit areas, the heating unit of the unit area; wherein: the control unit includes a large-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is large, and a small-number control zone mode in which the number of control zones, is small; and the control unit is configured to select the small-number control zone mode in which the number
  • each of the control zones is formed of the one unit area, and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of the one unit area, the heating unit of the unit area; and in the small-number control zone mode, at least the one control zone is formed of the plurality of the adjacent unit areas, and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of the desired unit area out of the plurality of the unit areas, the heating units of the plurality of unit areas.
  • control unit is configured to control, in the large-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for large-number control zones, and is configured to control, in the small-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for small-number control zones.
  • a blower is connected to the furnace body through a cooling-medium supply line, the blower being configured to supply a cooling medium to the space between the furnace body and the processing vessel, and the furnace body is provided with an exhaust pipe; and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of each of the unit areas, the heating unit of the unit area and the blower.
  • control unit is configured to select the small-number control zone mode so as to control the heating unit of each of the control zones and the blower, when a temperature is increased or decreased.
  • a method of controlling a thermal processing apparatus in one embodiment is a method of controlling a thermal processing apparatus comprising: a furnace body; a processing vessel disposed in the furnace body, the processing vessel defining, between the furnace body and the processing vessel, a space including therein a plurality of unit areas, and the processing vessel being configured to accommodate a plurality of objects to be processed; a heating unit disposed on an inner surface of the furnace body, correspondingly to each of the unit areas of the space; an in-furnace temperature sensors disposed correspondingly to each of the unit areas of the space; and a control unit configured to control, based on a signal from the in-furnace temperature sensor of each of the unit areas, the heating unit of the unit area; wherein the control unit includes a large-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is large, and a small-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is small; the method of controlling
  • each of the control zones is formed of the one unit area, and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of the one unit area, the heating unit of the unit area; and in the small-number control zone mode, at least the one control zone is formed of the plurality of adjacent unit areas, and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of the desired unit area out of the plurality of the unit areas, the heating units of the plurality of unit areas.
  • control unit In the method of controlling a thermal processing apparatus, the control unit is configured to control, in the large-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for large-number control zones, and is configured to control, in the small-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for small-number control zones.
  • a blower is connected to the furnace body through a cooling-medium supply line, the blower being configured to supply a cooling medium to the space between the furnace body and the processing vessel, and the furnace body is provided with an exhaust pipe; and the control unit is configured to control, based on a signal from the in-furnace temperature sensor of each of the unit areas, the heating unit of the unit area and the blower.
  • control unit is configured to select the small-number control zone mode so as to control the heating unit of each of the control zones and the blower, when a temperature is increased or decreased.
  • a method of controlling a thermal processing apparatus in another embodiment is a method of controlling a thermal processing apparatus comprising: a furnace body; a processing vessel disposed in the furnace body, the processing vessel defining, between the furnace body and the processing vessel, a space including therein a plurality of unit areas, and the processing vessel being configured to accommodate a plurality of objects to be processed; a heating unit disposed on an inner surface of the furnace body, correspondingly to each of the unit areas of the space; an in-processing-vessel temperature sensor disposed correspondingly to each of the unit areas in the processing vessel; and a control unit configured to control, based on a signal from the in-processing-vessel temperature sensor of each of the unit areas, the heating unit of the unit area; wherein the control unit includes a large-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is large, and a small-number control zone mode in which the number of control zones, which are formed of the unit areas and are independently controlled, is small
  • each of the control zones is formed of the one unit area, and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of the one unit area, the heating unit of the unit area; and in the small-number control zone mode, at least the one control zone is formed of the plurality of adjacent unit areas, and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of the desired unit area out of the plurality of the unit areas, the heating units of the plurality of unit areas.
  • control unit In the method of controlling a thermal processing apparatus, the control unit is configured to control, in the large-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for large-number control zones, and is configured to control, in the small-number control zone mode, the heating unit in each of the control zones based on a previously incorporated numerical model for small-number control zones.
  • a blower is connected to the furnace body through a cooling-medium supply line, the blower being configured to supply a cooling medium to the space between the furnace body and the processing vessel, and the furnace body is provided with an exhaust pipe; and the control unit is configured to control, based on a signal from the in-processing-vessel temperature sensor of each of the unit areas, the heating unit of the unit area and the blower.
  • control unit is configured to select the small-number control zone mode so as to control the heating unit of each of the control zones and the blower, when a temperature is increased or decreased.
  • the small-number control zone mode in which the number of the control zones is small is selected so as to control the heaters of the respective control zones, when the temperature is increased or decreased, the control of a temperature in the furnace body can be facilitated.
  • the large-number control zone mode in which the number of the control zones is large is selected so as to control the heaters of the respective control zones, a uniformity in temperature in the furnace body can be improved.
  • FIG. 1 is a longitudinal sectional view schematically showing an embodiment of a thermal processing apparatus and a method of controlling the same of the present invention.
  • FIG. 2 is a schematic view showing a control unit of the thermal processing apparatus.
  • FIG. 3( a ) is a view showing a small-number control zone model control
  • FIG. 3( b ) is a view showing a large-number control zone model control.
  • FIG. 4 is a view showing a temperature change in a furnace body over time.
  • FIG. 5 is a schematic view showing temperatures in respective unit areas of the furnace body.
  • FIG. 6 is a view schematically showing an alternative example of the thermal processing apparatus of the present invention.
  • a vertical-type thermal processing apparatus 1 includes a vertical-type thermal processing furnace 2 capable of simultaneously accommodating a number of objects to be processed, e.g., semiconductor wafers w, and of subjecting the semiconductor wafers w to various thermal processes such as an oxidation process, a diffusion process, a low-pressure CVD process and so on.
  • the thermal processing furnace 2 includes a furnace body 5 and a processing vessel 3 disposed in the furnace body 5 so as to define a space 33 between the processing vessel 3 and the furnace body 5 .
  • a plurality of heating resistors (heaters) 18 A serving as a heating unit are disposed on an inner circumferential surface of the thermal processing furnace 2 .
  • the processing vessel 3 is configured to accommodate and thermally process wafers w.
  • the space 33 between the furnace body 5 and the processing vessel 3 is divided into a plurality of unit areas (also referred to simply as “area”), e.g., ten unit areas A 1 , A 2 , A 3 , A 4 , A 5 , A 6 , A 7 , A 8 , A 9 and A 10 , along a longitudinal direction.
  • Each heater 18 A is disposed correspondingly to one of the ten unit areas A 1 . . . A 10 .
  • a plurality of in-furnace temperature sensors 50 for measuring temperatures of the respective unit areas A 1 . . . A 10 are disposed in the unit areas A 1 . . . A 10 , respectively.
  • the respective in-furnace temperature sensors 50 are connected to a control unit 51 , which is described below, through a signal line 50 a.
  • an inside of the processing vessel 3 is divided into a plurality of unit areas (also referred to simply as “area”), e.g., ten unit areas A 1 , A 2 , A 3 , A 4 , A 5 , A 6 , A 7 , A 8 , A 9 and A 10 in accordance with the unit areas of the space 33 along the longitudinal direction.
  • In-processing-vessel temperature sensors 55 for measuring temperatures of the respective unit areas A 1 . . . A 10 are disposed correspondingly to the respective unit areas A 1 . . . A 10 .
  • the respective in-processing-vessel temperature sensors 55 are supported by in-processing-vessel temperature sensor supporters 56 , and are connected to the control unit 51 through a signal line 55 a.
  • the furnace body 5 is supported by a base plate 6 .
  • the base plate 6 has an opening 7 through which the processing vessel 3 is inserted upward from below.
  • a not-shown heat insulation member is disposed on the opening 7 of the base plate 6 , such that a gap between the base plate 6 and the processing vessel 3 is covered.
  • the processing vessel 3 is made of quartz, and has an elongated cylindrical shape with a closed upper end and an opened lower end serving as a furnace opening 3 a .
  • An outward flange 3 b is formed on the lower end of the processing vessel 3 .
  • the flange 3 b is supported by the base plate 6 through a not-shown flange presser.
  • the processing vessel 3 is provided with, on a lower side thereof, an inlet port (inlet opening) 8 through which a process gas and an inert gas are introduced into the processing vessel 3 , and a not-shown exhaust port (exhaust opening) through which a gas in the processing vessel 3 is discharged.
  • a gas supply source (not shown) is connected to the inlet port 8 .
  • an exhaust system (not shown) including a vacuum pump that can control and decompress a pressure to about 133 ⁇ 600 Pa to 133 ⁇ 10 ⁇ 2 Pa, for example.
  • a gas supply pipe 8 a extending into the processing vessel 3 is connected to the inlet port 8 .
  • Gas supply holes 8 b are formed in the gas supply pipe 8 a.
  • a lid member 10 for closing the furnace opening 3 a of the processing vessel 3 is disposed below the processing vessel 3 , such that the lid member 10 can be elevated and lowered by a not-shown elevating mechanism.
  • a heat retention tube 11 which is a heat retention means of the furnace opening, is placed on an upper part of the lid member 10 .
  • a quartz boat 12 which is a holder for holding a number of 300-mm diameter wafers w, e.g., about one hundred to one hundred and fifty wafers w, with predetermined intervals therebetween in the up and down direction.
  • the lid member 10 is equipped with a rotation mechanism 13 configured to rotate the boat 12 about its center axis.
  • the boat 12 is unloaded from the inside of the processing vessel 3 into a below loading area (not shown) by a downward movement of the lid member 10 . After wafers w have been replaced, the boat 12 is loaded into the processing vessel 3 by an upward movement of the lid member 10 .
  • the furnace body 5 includes a cylindrical heat insulation member 16 , and a plurality of groove-shaped shelf parts 17 which are formed in an inner circumferential surface of the heat insulation member 16 in an axial direction thereof (in the up and down direction in the illustrated example) at multiple stages.
  • Heater elements (heating wires, heating resistors) 18 which constitute the heaters 18 A disposed on the respective unit areas A 1 . . . A 10 , are positioned along the respective shelf parts 17 .
  • the heat insulation member 16 is formed of inorganic fibers including silica, alumina or alumina silicate, for example.
  • a plurality of annular groove parts 21 which are coaxial with the heat insulation member 16 , are formed in the inner circumferential surface of the cylindrical heat insulation member 16 in the axial direction with predetermined pitches at multiple stages.
  • the circumferentially continuous annular shelf parts 17 are formed between each upper groove part 21 and each lower groove part 21 adjacent thereto. Gaps, which are sufficient for allowing a thermal expansion and contract of each heater element 18 and a radial movement thereof, are defined in an upper part and a lower part of the heater element 18 in the groove part 21 , and in a space between a rear wall of the groove part 21 and the heater element 18 .
  • a cooling medium flowing from a cooling-medium introduction unit 40 of the furnace body 5 into the space 33 can go around a rear side of each heater element 18 , so that the heater element 18 can be effectively cooled upon a forcible cooling operation.
  • Air and nitrogen gas may be supposed as such a cooling medium.
  • the cooling medium is sent to the cooling-medium introduction unit 40 by a cooling-medium supply blower (not shown) driven by an inverter output unit 53 a which is described below.
  • terminal plates 22 a and 22 b are joined to the heater elements 18 constituting the heater 18 A.
  • Each of the heaters 18 A is connected to an outside heater output unit 18 B through the terminal plates 22 a and 22 b which are disposed to radially pass through the heat insulation member 16 .
  • an outer circumferential surface of the heat insulation member 16 is covered with an outer shell 30 made of metal, e.g., stainless.
  • An upper heat insulation member 31 is disposed on a top part of the heat insulation member 16 so as to cover the same.
  • a stainless top plate 32 covering a top part (upper end part) of the outer shell 30 is disposed on an upper part of the upper heat insulation member 31 .
  • a strip-like heating resistor is used as the heater element 18 and the heater element 18 is accommodated in the shelf part 17 .
  • a heater element of another structure may be used as the heater element 18 .
  • the space 33 defined between the furnace body 5 and the processing vessel 3 is divided into the ten unit areas A 1 . . . A 10 .
  • the temperature sensors (in-furnace temperature sensors) 50 for detecting temperatures of the respective unit areas A 1 . . . A 10 are located on the unit areas A 1 . . . A 10 , respectively. Detection signals from the respective temperature sensors 50 are transmitted to the below-described control unit 51 through the signal line 50 a.
  • the temperature sensors 50 located on the respective unit areas A 1 . . . A 10 are connected to the control unit 51 .
  • the control unit 51 is described in detail below.
  • the temperature sensors 50 are located on the respective unit areas A 1 . . . A 10 of the space 33 so as to detect temperatures of the respective unit areas A 1 . . . A 10 .
  • Detection signals detected by the temperature sensors 50 of the respective unit areas A 1 . . . A 10 are transmitted to the control unit 51 through the signal line 50 a .
  • the control unit 51 is configured to reduce a time period required for an actual temperature to be converged to a predetermined target temperature, and to precisely make the temperature close to the target temperature, in a temperature increase process and a temperature decrease process of a lower temperature range such as 100° C. to 500° C., and in a temperature stabilized period ( FIG. 2 ).
  • the control unit 51 has a large-number control zone mode 72 a in which the number of the control zones C 1 , C 2 , C 3 , C 4 , C 5 , C 6 , C 7 , C 8 , C 9 and C 10 , which are independently controlled, is large, and a small-number control zone mode 72 b in which the number of control zones C 1 , C 2 , C 3 , C 4 and C 5 , which are independently controlled, is small.
  • the control unit 51 can select any one of the large-number control zone mode 72 a and the small-number control zone mode 72 b.
  • control zones C 1 . . . C 10 to be independently controlled respectively correspond to the ten unit areas A 1 . . . A 10 constituting the space 33 between the furnace body 5 and the processing vessel 3 .
  • the control unit 51 independently controls the control zones C 1 . . . C 10 corresponding to the unit areas A 1 . . . A 10 , respectively.
  • the control zone C 1 to be independently controlled corresponds to the adjacent unit areas A 1 and A 2
  • the control zone C 2 corresponds to the adjacent unit areas A 3 and A 4
  • the control zone C 3 corresponds to the adjacent unit areas A 5 and A 6
  • the control zone C 4 corresponds to the adjacent unit areas A 7 and A 8
  • the control zone C 5 corresponds to the adjacent unit areas A 9 and A 10 .
  • the control unit 51 controls the control zones C 1 to C 5 independently.
  • a least one control zone may be composed of a plurality of unit areas adjacent to each other, and other control zones may be composed of the respective unit areas.
  • control unit 51 selects the large-number control zone mode 72 a , based on signals from all the temperature sensors 50 of the respective unit areas A 1 . . . A 10 , the control unit 51 controls the heaters 18 A of the corresponding unit areas A 1 . . . A 10 , independently. In this case, the control unit 51 may control the heaters 18 A of the respective unit areas A 1 . . . A 10 , in consideration of a signal from an exhaust-air temperature sensor 80 disposed on an outlet side of the space 33 .
  • the control unit 51 controls the heaters 18 A, based on signals from the temperature sensors of every other unit area A 1 , A 3 , A 5 , A 7 and A 9 , for example. Specifically, the control unit 51 collectively controls the heaters 18 A of the unit areas A 1 and A 2 , based on a signal from the temperature sensor 50 of the unit area A 1 . The control unit 51 collectively controls the heaters 18 A of the unit areas A 3 and A 4 , based on a signal from the temperature sensor 50 of the unit area A 3 .
  • the control unit 51 collectively controls the heaters 18 A of the unit areas A 5 and A 6 , based on a signal from the temperature sensor 50 of the unit area A 5 .
  • the control unit 51 collectively controls the heaters 18 A of the unit areas A 7 and A 8 , based on a signal from the temperature sensor 50 of the unit area A 7 .
  • the control unit 51 collectively controls the heaters 18 A of the unit areas A 9 and A 10 , based on a signal from the temperature sensor 50 of the unit area A 9 .
  • the control unit 51 may control the heaters 18 A of the respective unit areas A 1 . . . A 10 , in consideration of a signal from the temperature sensor 80 .
  • control unit 51 includes: a predetermined numerical model 71 which relates to a heater output and a blower output; a heater-output calculation unit 51 a which calculates a heater output based on the numerical model 71 and an in-furnace temperature from the temperature sensor 50 ; and a blower-output calculation unit 51 b which calculates a blower output based on the numerical model 71 and an in-furnace temperature from the temperature sensor 50 .
  • the numerical model 71 includes: a numerical model 71 a for large-number control zones, which is used when the large-number control zone mode 72 a is selected; a numerical model 71 b for small-number control zones, which is used when the small-number control zone mode 72 b is selected; and a numerical model 73 for blower output.
  • the heater-output calculation unit 51 a calculates outputs of the heaters 18 A of the respective unit areas A 1 . . . A 10 , based on either one of the numerical model 71 a for large-number control zones and the numerical model 71 b for small-number control zones, and signals from the temperature sensors 50 of the respective unit areas A 1 . . . A 10 . Then, the heaters 18 A of the unit areas A 1 . . . A 10 are controlled by the heater output unit 18 B, based on the outputs of the heaters 18 A calculated by the heater-output calculation unit 51 a .
  • control unit 51 selects the large-number control zone mode 72 a
  • outputs of the heaters 18 A of all the unit areas A 1 . . . A 10 are calculated by the heater-output calculation unit 51 a , based on the numerical model 71 a for large-number control zones and signals from the temperature sensors 50 of all the unit areas A 1 . . . A 10 .
  • the heater output unit 18 B drives and controls the heaters 18 A of all the unit areas A 1 . . . A 10 , independently.
  • the blower-output calculation unit 51 b calculates a blower output, based on the numerical model 73 for blower output and a signal from the temperature sensor 50 of one of the unit areas A 1 . . . A 10 . Based on the blower output, an inverter output unit 53 a is controlled.
  • the numerical model 71 a for large-number control zones for controlling the heaters is described.
  • the numerical model 71 a for large-number control zones is a mathematical model which can previously estimate temperatures of semiconductor wafers w from the temperature sensors 50 and the heater output unit 18 B, and then specify a power to be supplied to the heater 18 in order that the estimated temperatures are made close to a target temperature as a whole.
  • a given model multi-variables, multi-dimensions, multi-output functions
  • a model disclosed in U.S. Pat. No. 5,517,594B can be used, for example.
  • the numerical model 71 a for large-number control zones that can estimate a temperature of a wafer, and define an output for allowing the wafer temperature to be a target temperature, depending on the number of wafers to be processed and an arrangement thereof.
  • the numerical model 71 b for small-number control zones can be obtained in the same manner as the numerical model 71 a for large-number control zones.
  • the numerical model 71 a for large-number control zones has a relationship between a time and a temperature respectively set for each control zone, when the large-number control zone mode 72 a is selected.
  • the numerical model 71 b for small-number control zones has a relationship between a time and a temperature respectively set for each control zone, when the small-number control zone mode 72 b is selected.
  • the numerical model 73 for blower output can be obtained, by actually measuring a temperature of a semiconductor wafer w, while actually operating a cooling-medium supply blower and operating the heater 18 A.
  • the numerical model 71 includes in a separate manner the numerical model 71 a for large-number control zones, the numerical model 71 b for small-number control zones and the numerical model 73 for blower output
  • the single numerical model 71 may include in a combined manner a numerical model for large-number control zones, a numerical model for small-number control zones and a numerical model for blower output.
  • the heater outputs calculated by the heater-output calculation unit 51 a are transmitted to the heater output unit 18 B.
  • the heater elements 18 of the heaters 18 A in the respective unit areas A 1 . . . A 10 are driven and controlled by the heater output unit 18 B, based on the heater outputs calculated by the heater-output calculation unit 51 a.
  • blower output calculated by the blower-output calculation unit 51 b is transmitted to the inverter output unit 53 a , and the cooling-medium supply blower is driven and controlled by the inverter output unit 53 a.
  • a cooling medium is supplied by the cooling-medium supply blower into the space 33 between the furnace body 5 and the processing vessel 3 .
  • wafers w are placed in the boat 12 , and the boat 12 with the wafers w is put on the heat insulation tube 11 of the lid member 10 . Then, the boat 12 is loaded into the processing vessel 3 by the upward movement of the lid member 10 .
  • control unit 51 controls the heater output unit 18 B so as to control outputs of the heaters 18 A in the respective unit areas A 1 . . . A 10 .
  • the space 33 between the furnace body 5 and the processing vessel 3 is heated, whereby the wafers w on the boat 12 in the processing vessel 3 are subjected to a required thermal process.
  • the control unit 51 selects the small-number control zone mode 72 b in which the number of the control zones is small.
  • the inside of the space 33 between the furnace body 5 and the processing vessel 3 is divided into the five control zones, C 1 . . . C 5 , for example.
  • the control zone C 1 corresponds to the unit areas A 1 and A 2
  • the control zone C 2 corresponds to the unit areas A 3 and A 4
  • the control zone C 3 corresponds to the unit areas A 5 and A 6
  • the control zone C 4 corresponds to the unit areas A 7 and A 8
  • the control zone C 5 corresponds to the unit areas A 9 and A 10 ( FIG. 3( a )).
  • the control unit 51 uses the numerical model 71 b for small-number control zones. Based on the numerical model for small-number control zones and signals from the temperature sensors 50 of every other unit areas A 1 , A 3 , A 5 , A 7 and A 9 , the heater-output calculation unit 51 a calculates outputs of the heaters 18 A of the corresponding unit areas A 1 and A 2 (control zone C 1 ), outputs of the heaters 18 A of the corresponding unit areas A 3 and A 4 (control zone C 2 ), outputs of the heaters 18 A of the corresponding unit areas A 5 and A 6 (control zone C 3 ), outputs of the heaters 18 A of the corresponding unit areas A 7 and A 8 (control zone C 4 ), and outputs of the heaters 18 A of the corresponding unit areas A 9 and A 10 (control zone C 5 ).
  • the heater output unit 18 B collectively controls the heaters 18 A of the unit areas A 1 and A 2 (control zone C 1 ), collectively controls the heaters 18 A of the unit areas A 3 and A 4 (control zone C 2 ), collectively controls the heaters 18 A of the unit areas A 5 and A 6 (control zone C 3 ), collectively controls the heaters 18 A of the unit areas A 7 and A 8 (control zone C 4 ), and collectively controls the heaters 18 A of the unit areas A 9 and A 10 (control zone C 5 ).
  • control unit 51 selects the large-number control zone mode 72 a in which the number of the control zones is large.
  • the control zones C 1 , C 2 , C 3 , C 4 . . . C 10 respectively correspond to the unit areas A 1 , A 2 , A 3 , A 4 . . . A 10 ( FIG. 3( b )).
  • the control unit 51 uses the numerical model 71 a for large-number control zones. Based on the numerical model 71 a for large-number control zones and signals from the temperature sensors 50 of the respective unit areas A 1 . . . A 10 , the heater-output calculation unit 51 a calculates outputs of the heaters 18 A of the respective unit areas A 1 . . . A 10 .
  • the heater output unit 18 B drives and controls the heaters 18 A of the respective unit areas A 1 . . . A 10 , independently, based on the heater outputs calculated by the heater output calculation unit 51 a.
  • the control unit 51 selects, in a temperature increase/decrease time T 1 , the small-number control zone mode 71 b , and selects in a temperature stabilized time T 2 , the large-number control zone mode 71 a , so as to control the heaters 18 A of the unit areas A 1 . . . A 10 , the number of the control zones is made smaller in the temperature increase/decrease time T 1 whereby the control parameters can be easily tuned.
  • the unit areas A 1 . . . A 10 can be finely, uniformly controlled.
  • detection temperatures from the temperature sensors 50 which are to be controlled, sufficiently follow the set temperature, but temperatures of the temperature sensors (illustrated as temperatures which are not to be controlled), which are not to be controlled, somewhat deviate from the set temperature.
  • detection temperatures from all the temperature sensors 50 can be controlled within a range of ⁇ 1° C. relative to the set temperature.
  • the inside of the space 33 between the furnace body 5 and the processing vessel 3 is forcibly cooled, in order to make effective a thermal processing operation according to need.
  • the cooling-medium supply blower is activated by the control unit 51 .
  • a cooling medium (20 to 30° C.) is blown out from the cooling-medium introduction unit 40 into the space 33 between the furnace body 5 and the processing vessel 3 , so that the inside of the space 33 is forcibly cooled.
  • the blower-output calculation unit 51 b determines a blower output, based on the numerical model 73 for blower output and an in-furnace temperature from the temperature sensor 50 located on any of the unit areas A 1 . . . A 10 . Based on the blower output, the inverter output unit 53 a drives and controls the cooling-medium supply blower.
  • the thermal processing apparatus is controlled by the control unit 51 , based on signals from the in-furnace temperature sensors 50 located in the respective unit areas A 1 . . . A 10 of the space 33 defined between the furnace body 5 and the processing vessel 3 .
  • the thermal processing apparatus may be controlled by a control unit 51 , based on signals from the in-processing-vessel temperature sensors 55 located in the respective unit areas A 1 . . . A 10 in the processing vessel 3 .
  • the inside of the processing vessel 3 is divided into the ten unit areas A 1 . . . A 10 in accordance with the ten unit areas A 1 . . . A 10 .
  • the in-processing-vessel temperature sensors 55 for detecting temperatures of the unit areas A 1 . . . A 10 are located in the respective unit areas A 1 . . . A 10 . Detection signals from the in-processing-vessel temperature sensors 55 are transmitted to the control unit (control device) through the signal line 55 a .
  • the in-processing-vessel temperature sensors 55 located in the respective unit areas A 1 . . . A 10 are supported by the in-processing-vessel temperature sensor supporters 56 .
  • FIG. 6 is a view schematically showing an alternative example of the thermal processing apparatus of the present invention.
  • Structures of the thermal processing apparatus shown in FIG. 6 are substantially the same with the structures of the thermal processing apparatus shown in FIGS. 1 to 5 , only excluding the structure of the processing vessel 3 .
  • the processing vessel 3 is formed of a single tube.
  • the processing vessel 3 may have a dual tube structure including an outer tube 3 A and an inner tube 3 B positioned in the outer tube 3 A.
  • thermal processing apparatus shown in FIG. 6 the same parts as the parts of the thermal processing apparatus shown in FIGS. 1 to 5 are shown by the same reference numbers, and detailed description thereof is omitted.
  • the space 33 between the furnace body 5 and the processing vessel 3 and the inside of the processing vessel 3 are divided into the ten unit areas A 1 . . . A 10 .
  • the number of the divided unit areas may be three or more. In this case, when the number of the unit areas is larger, the effect of the present invention can be more improved.
  • the space 33 and the inside of the processing vessel 3 are uniformly divided.
  • a width, a position and a shape of the unit area may be varied, which makes no difference in effect of the present invention.

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JP6752851B2 (ja) * 2017-09-12 2020-09-09 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ クーリングユニット、基板処理装置、および半導体装置の製造方法
US11043402B2 (en) 2017-09-12 2021-06-22 Kokusai Electric Corporation Cooling unit, heat insulating structure, and substrate processing apparatus
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JP7362940B2 (ja) * 2020-09-30 2023-10-17 株式会社Kokusai Electric 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法
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CN102655104A (zh) 2012-09-05
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US20140238972A1 (en) 2014-08-28
TW201245649A (en) 2012-11-16
TWI548850B (zh) 2016-09-11
KR20120099592A (ko) 2012-09-11
JP5662845B2 (ja) 2015-02-04
US9748122B2 (en) 2017-08-29

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