US8044480B2 - Production of a radiation detector - Google Patents
Production of a radiation detector Download PDFInfo
- Publication number
- US8044480B2 US8044480B2 US12/065,758 US6575806A US8044480B2 US 8044480 B2 US8044480 B2 US 8044480B2 US 6575806 A US6575806 A US 6575806A US 8044480 B2 US8044480 B2 US 8044480B2
- Authority
- US
- United States
- Prior art keywords
- scintillator
- adhesive
- film
- radiation
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 44
- 230000001070 adhesive effect Effects 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 239000002313 adhesive film Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 description 13
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 10
- 230000008901 benefit Effects 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- -1 rare-earth oxysulfides Chemical class 0.000 description 6
- 229910001508 alkali metal halide Inorganic materials 0.000 description 4
- 150000008045 alkali metal halides Chemical class 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000012080 ambient air Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- UPIZSELIQBYSMU-UHFFFAOYSA-N lanthanum;sulfur monoxide Chemical compound [La].S=O UPIZSELIQBYSMU-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- MCVAAHQLXUXWLC-UHFFFAOYSA-N [O-2].[O-2].[S-2].[Gd+3].[Gd+3] Chemical compound [O-2].[O-2].[S-2].[Gd+3].[Gd+3] MCVAAHQLXUXWLC-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000013626 chemical specie Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- DQZARQCHJNPXQP-UHFFFAOYSA-N gadolinium;sulfur monoxide Chemical class [Gd].S=O DQZARQCHJNPXQP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000009607 mammography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002601 radiography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
Definitions
- the invention relates to a method of producing a radiation detector comprising a photosensitive receiver associated with a radiation converter.
- the invention also relates to a tool for the production of a radiation detector and to a method of employing this tool.
- the fields of application of this type of detector are for example the detection of X-rays used for radiology: radiography, fluoroscopy and mammography, and also for non-destructive testing and for security.
- the invention will be described in relation to an X-ray detector.
- the invention may be implemented in any type of detector for which the photosensitive receiver is not directly sensitive to the radiation to be detected and for which it is therefore necessary to interpose a radiation converter between an entry window of the detector and the photosensitive receiver.
- Such radiation detectors are known, for example from French Patent FR 2 605 166 in which a sensor formed from amorphous silicon photodiodes, forming the photosensitive receiver, is associated with a radiation converter.
- the photosensitive sensor is generally produced from solid-state photosensitive elements arranged in a matrix or in a row.
- the photosensitive elements are produced from semiconductor materials, usually single-crystal silicon for sensors of the CCD or CMOS type, polycrystalline silicon or amorphous silicon.
- a photosensitive element comprises at least one photodiode, a phototransistor or a photoresistor. These elements are deposited on a substrate, generally a glass plate.
- the photosensitive sensor is associated with a radiation converter that has a layer of a scintillating substance.
- This substance has the property, when it is excited by such radiation, of emitting radiation of longer wavelength, for example visible light or radiation close to the visible, to which the sensor is sensitive.
- the light emitted by the radiation converter illuminates the photosensitive elements of the sensor, these effecting a photoelectric conversion and delivering electrical signals that can be exploited by appropriate circuits.
- the radiation converter will be called a scintillator.
- cesium iodide doped with sodium or with thallium depending on whether emission at around 400 nanometers or around 550 nanometers is desired respectively, is known for its strong X-ray absorption and for its excellent fluorescence yield. It takes the form of fine needles which are grown on a support. These needles are approximately perpendicular to this support and partly confine the light emitted toward the sensor. Their fineness determines the resolution of the detector. Lanthanum and gadolinium oxysulfides are also widely employed for the same reasons.
- cesium iodide its decomposition gives cesium hydroxide Cs + OH ⁇ and free iodine I 2 , which can then combine with iodide ions to give the complex I 3 ⁇ .
- the ambient air and the adhesive used for assembling the detector always contain moisture.
- the presence of moisture in the adhesive is due either to the ambient air or as by-product of the polymerization if this results from the condensation of two chemical species, which is frequently the case.
- One of the important aspects during production of these detectors will be to minimize the amount of moisture initially present inside the detector, and in contact with the scintillator, and to prevent this moisture from diffusing into the sensor during its operation.
- the scintillating substance is deposited on a support through which the radiation to be detected has to pass before reaching the sensor.
- the assembly is then bonded to the sensor.
- the senor serves as support for the scintillating substance, which is then in direct and intimate contact with the sensor.
- the scintillating substance is then covered with a protective sheet.
- the two configurations each have advantages and drawbacks.
- One advantage of the first configuration, the attached-scintillator configuration, is that the sensor and the scintillator are assembled only if they have been tested successfully, thereby making it possible to improve the overall manufacturing yield.
- the invention aims to improve the manufacture of a radiation detector produced in the first configuration and, more precisely, the invention seeks to improve the bonding used in assembling the scintillator with the sensor.
- This bonding is currently carried out using an adhesive especially designed for its optical properties and in particular for its optical transparency at the wavelengths emitted by the scintillator.
- an adhesive especially designed for its optical properties and in particular for its optical transparency at the wavelengths emitted by the scintillator.
- a silicone-based gel is used.
- the quality of the image delivered by the sensor depends on the thickness of the layer of adhesive used. This is because the light radiation generated by the scintillator must pass through the layer of adhesive before being absorbed by the sensor. The dispersion of the radiation will be lower the thinner the layer of adhesive.
- the dispersion of the radiation actually influences the resolution of the image, which must remain uniform over the entire area of the image.
- This requires depositing the adhesive with a thickness as constant as possible.
- the adhesive is currently deposited by screen printing on one or both elements to be assembled.
- the layer of adhesive In the case of scintillators based on cesium iodide, the layer of adhesive must have a minimum thickness so as to allow good mechanical keying and sufficient coating of the cesium iodide needles with the adhesive. Coating the cesium iodide needles is important for ensuring the quality of the optical interface between the scintillator and the adhesive.
- the object of the invention is to simplify the production of detectors obtained by bonding a scintillator to a sensor.
- one subject of the invention is a method producing a radiation detector comprising two elements: a photosensitive receiver and a scintillator that converts the radiation into radiation to which the photosensitive receiver is sensitive, the scintillator being fixed by bonding to the photosensitive receiver, characterized in that it consists in using a film of adhesive protected on each of its faces by a protective film and in that it consists in carrying out the following operations in succession:
- Another subject of the invention is a tool for producing a radiation detector as described above, characterized in that the tool comprises an enclosure inside which a vacuum may be created and in that placed inside the enclosure are a support plate, on which the first element is laid, and jacks for keeping the second element a certain distance away from the first element. More precisely, this tool is used for bringing the second element into contact with the film of adhesive.
- a further subject of the invention is a method of employing the tool described above, characterized in that it consists in:
- Another advantage of the invention is the improvement in modulation transfer frequency thanks to a reduction in the thickness of adhesive joining the photosensitive receiver to the scintillator. This is because, when depositing adhesive by screen printing, the minimum possible thickness is around 40 ⁇ m. There are protected films of adhesive with a thickness of 12 ⁇ m, thereby enabling the scintillator to be brought closer to the detector and therefore improving the modulation transfer frequency. In addition, the tolerance on the protected film of adhesive is much tighter than the tolerance on the thickness of a layer of adhesive deposited by screen printing, thereby improving the uniformity of the modulation transfer frequency.
- Yet another advantage of the invention stems from the fact that the method is employed at room temperature. This obviates deleterious effects due to possible differences between the thermal expansion coefficients of the elements to be assembled by means of the film of adhesive.
- FIG. 1 shows a radiation detector used in radiology, the scintillator of which comprises cesium iodide
- FIG. 2 shows another radiation detector used in radiology, the scintillator of which comprises gadolinium oxysulfide;
- FIG. 3 shows a radiation detector that includes an intermediate element between the scintillator and the sensor
- FIG. 4 shows a radiation detector in which the scintillator is optically coupled to the sensor via a lens
- FIG. 5 shows a tool for the production of a radiation detector.
- FIGS. 6 and 7 shows the film of adhesive laminated between rollers.
- FIG. 1 shows a radiation detector comprising a photosensitive sensor 1 having a substrate 2 , for example formed from a glass plate, supporting photosensitive elements 3 .
- Each photosensitive element 3 is mounted between a row conductor and a column conductor so that it can be addressed.
- the conductors are not visible in FIG. 1 for the sake of simplification.
- the photosensitive elements 3 and the conductors are generally covered with a passivation layer 4 intended to protect them from moisture.
- the radiation detector also includes a scintillator 5 optically coupled to the sensor 1 .
- the optical coupling is achieved by means of a layer of adhesive 6 .
- the scintillator 5 comprises a layer of scintillating substance 7 , represented with a needle structure, deposited on a support 8 .
- the support 8 thus supports the scintillating substance 7 .
- the scintillating substance 7 belongs to the family of alkali metal halides such as cesium iodide which is particularly sensitive to wet
- an entry window 10 is placed on the scintillator 5 without being fixed thereto.
- the radiation passes through the entry window 10 upstream of the scintillator 5 .
- a moisture-impermeable seal 11 fixes the entry window 10 to the sensor 1 , or more precisely to its substrate 2 .
- the main advantage of placing an entry window 10 separate from the support 8 of the scintillator 5 is to improve the sealing of the radiation detector from the ambient air, to which cesium iodide is particularly sensitive.
- the material of the entry window 10 is chosen in such a way that its thermal expansion coefficient is close to that of the substrate 2 . This makes it possible to use a rigid seal 11 exhibiting good moisture impermeability.
- FIG. 2 shows another radiation detector used in radiology, the scintillating substance 7 of which comprises a rare-earth oxysulfide, such as for example gadolinium oxysulfide or lanthanum oxysulfide.
- This radiation detector comprises the same elements as the radiation detector shown in FIG. 1 , with the exception of the entry window 10 .
- the scintillator 5 produced with a rare-earth oxysulfide uses a plastic binder, giving it good intrinsic sealing properties. It is therefore unnecessary to enhance the sealing of the entire radiation detector.
- the entry window function is provided directly by means of the support 8 of the scintillator 5 .
- This support is for example made of an aluminum alloy.
- This alloy has a thermal expansion coefficient greater than that of a substrate 2 made of glass.
- the seal 11 joins the support 8 to the substrate 2 . Owing to the thermal expansion difference between the support 8 and the substrate 2 , a flexible seal 11 will be used, for example one based on silicone which by nature is less moisture impermeable than a rigid seal 11 as described using FIG. 1 .
- One method for implementing the invention consists in using a film of adhesive protected on each of its faces by a protective film and in carrying out the following operations in succession:
- the film of adhesive is laminated to the first of the elements between two rollers 12 ( FIGS. 6 and 7 ), so as to eliminate any air bubble between the element and the adhesive film.
- the film of adhesive is cut according to the dimensions of the first element.
- This cutting may for example be carried out using a guillotine, which allows the film of adhesive to be cut to the precise dimensions of the first element.
- the second element is brought into contact with the film of adhesive under vacuum.
- This vacuum method is well suited for rare-earth oxysulfides which have a smooth appearance.
- scintillators belonging to the family of alkali metal halides, such as cesium iodide carrying out the bonding under vacuum is less necessary since this family of scintillating substances has a microporous appearance, making it possible for any air bubbles retained between the film and the scintillator 5 to be eliminated naturally.
- the film of adhesive is acrylic based.
- FIG. 3 shows a radiation detector similar to that of FIG. 1 , in which a fibre-optic faceplate 30 is inserted between the photosensitive sensor 1 and the scintillator 5 .
- the optical coupling between the photosensitive sensor 1 and the fibre-optic faceplate 30 is achieved by means of a layer of adhesive 61 .
- the optical coupling between the scintillator 5 and the fibre-optic faceplate 30 is achieved by means of a layer of adhesive 62 , it being possible for both adhesive films 61 and 62 to be put in place using a method according to the invention. It is also possible to employ such a fibre-optic faceplate 30 in a radiation detector as described in FIG. 2 in which the scintillating substance 7 is directly placed on the entry window 8 .
- the fibre-optic faceplate 30 is used to guide the radiation from the scintillator 5 to the photosensitive sensor 1 .
- the fibre-optic faceplate 30 may be replaced with an electrooptic material based on amorphous selenium, allowing the radiation from the scintillator 5 to be amplified.
- FIG. 4 shows a radiation detector that includes an optical device 40 for focussing the radiation from the scintillator 5 onto the photosensitive sensor 1 .
- This radiation detector furthermore includes a plate 41 transparent to the radiation from the scintillator 5 and forming the photosensitive receiver.
- the optical coupling between the plate 41 and the scintillator 5 is achieved by means of a layer of adhesive 6 that may be put in place using a method according to the invention.
- FIG. 5 shows a tool 29 for the production of a radiation detector.
- the tool 29 comprises a body 30 with a screen 31 which together form an enclosure inside which a vacuum may be created, for example by means of a channel 32 intended to be connected to a vacuum pump (not shown in the figure).
- a support plate 33 Placed inside the enclosure are a support plate 33 , on which the first element is laid, for example the scintillator 5 , and jacks 34 for keeping the photosensitive receiver 1 a certain distance away from the scintillator 5 .
- the jacks 34 are shown in the high position. They thus keep the photosensitive receiver 1 a certain distance away from the scintillator 5 . When the jacks 34 come into the low position, contact between the photosensitive receiver 1 and the scintillator 5 is possible.
- the photosensitive receiver 1 is positioned in a recess made in a support 35 placed on the jacks 34 .
- the photosensitive receiver 1 is held in place on the support 35 by fingers 36 integral with the support 35 .
- the support is centered with respect to the body 30 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0509777 | 2005-09-23 | ||
FR0509777A FR2891401B1 (fr) | 2005-09-23 | 2005-09-23 | Realisation d'un detecteur de rayonnement. |
PCT/EP2006/066116 WO2007036417A1 (fr) | 2005-09-23 | 2006-09-07 | Realisation d'un detecteur de rayonnement |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080206917A1 US20080206917A1 (en) | 2008-08-28 |
US8044480B2 true US8044480B2 (en) | 2011-10-25 |
Family
ID=36046930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/065,758 Expired - Fee Related US8044480B2 (en) | 2005-09-23 | 2006-09-07 | Production of a radiation detector |
Country Status (6)
Country | Link |
---|---|
US (1) | US8044480B2 (fr) |
EP (1) | EP1927140A1 (fr) |
JP (1) | JP2009509151A (fr) |
FR (1) | FR2891401B1 (fr) |
IL (1) | IL189468A0 (fr) |
WO (1) | WO2007036417A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10126433B2 (en) | 2014-11-10 | 2018-11-13 | Halliburton Energy Services, Inc. | Energy detection apparatus, methods, and systems |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7964855B2 (en) * | 2007-04-05 | 2011-06-21 | Konica Minolta Medical & Graphic, Inc. | Scintillator panel |
EP2142942A2 (fr) * | 2007-04-25 | 2010-01-13 | Koninklijke Philips Electronics N.V. | Détecteur de rayonnement ayant un couplage optique laminé séparé |
JP5369979B2 (ja) * | 2009-08-05 | 2013-12-18 | コニカミノルタ株式会社 | 放射線画像検出装置 |
US8399842B2 (en) * | 2009-12-07 | 2013-03-19 | Carestream Health, Inc. | Digital radiographic detector with bonded phosphor layer |
US8399841B2 (en) * | 2009-12-07 | 2013-03-19 | Carestream Health, Inc. | Digital radiographic detector with bonded phosphor layer |
JP5686993B2 (ja) * | 2010-06-04 | 2015-03-18 | 浜松ホトニクス株式会社 | シンチレータパネル及び放射線イメージセンサ |
DE102010062040A1 (de) | 2010-11-26 | 2012-05-31 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Szintillator-Fotosensor-Sandwich, Szintillator-Fotosensor-Sandwich und Strahlungsdetektor |
DE102010062035B4 (de) | 2010-11-26 | 2013-08-22 | Siemens Aktiengesellschaft | Verfahren zur Herstellung eines Szintillator-Fotosensor-Sandwich, Szintillator-Fotosensor-Sandwich und Strahlungsdetektor |
DE102010062033A1 (de) | 2010-11-26 | 2012-05-31 | Siemens Aktiengesellschaft | Szintillatorschicht, Röntgendetektor und Verfahren zur Vorbereitung einer Szintillatorschicht zur Aufbringung auf eine Fotosensorschicht und Herstellung eines Röntgendetektors oder Röntgendetektorelementes |
JP5604323B2 (ja) * | 2011-01-31 | 2014-10-08 | 富士フイルム株式会社 | 放射線画像検出装置 |
JP5809473B2 (ja) * | 2011-07-27 | 2015-11-11 | キヤノン株式会社 | 放射線検出素子 |
JP2013050364A (ja) * | 2011-08-30 | 2013-03-14 | Fujifilm Corp | 放射線画像検出装置 |
CN103588713B (zh) | 2013-06-07 | 2014-09-17 | 潍坊博创国际生物医药研究院 | 多靶点型乌苯美司前药衍生物及其制备方法和用途 |
US9905607B2 (en) * | 2015-07-28 | 2018-02-27 | General Electric Company | Radiation detector fabrication |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2605166A1 (fr) | 1986-10-09 | 1988-04-15 | Thomson Csf | Dispositif photosensible a l'etat solide, procede de lecture et procede de fabrication |
JPS63205381A (ja) | 1987-02-20 | 1988-08-24 | Ibiden Co Ltd | 接着剤の均一塗布方法 |
JPH05148046A (ja) | 1991-11-29 | 1993-06-15 | Kikusui Kagaku Kogyo Kk | シート状接着材および接合方法 |
JP2000241553A (ja) | 1999-02-23 | 2000-09-08 | Hitachi Metals Ltd | 放射線検出器 |
US20020121606A1 (en) | 2001-02-09 | 2002-09-05 | Satoshi Okada | Scintillator panel, radiation detector and manufacture methods thereof |
FR2821671A1 (fr) | 2001-03-02 | 2002-09-06 | Gtm Construction | Procede d'evaluation de la couleur d'une surface et de l'homogeneite de cette couleur |
FR2831671A1 (fr) | 2001-10-26 | 2003-05-02 | Trixell Sas | Detecteur de rayonnement x a l'etat solide |
US6583419B1 (en) * | 1998-08-11 | 2003-06-24 | Trixell S.A.S. | Solid state radiation detector with enhanced life duration |
US7064335B2 (en) * | 2000-01-13 | 2006-06-20 | Hamamatsu Photonics K.K. | Radiation image sensor and scintillator panel |
US7105830B2 (en) * | 2003-03-12 | 2006-09-12 | Canon Kabushiki Kaisha | Radiation detecting device and method of manufacturing the same |
US7705317B2 (en) * | 2004-08-20 | 2010-04-27 | Hamamatsu Photonics K.K. | Radiation imaging device and radiation imaging method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11295828A (ja) * | 1998-02-10 | 1999-10-29 | Konica Corp | 蛍光体プレートの貼り付け方法、貼り付け装置及び輝尽性蛍光体プレート |
JP3595759B2 (ja) * | 1999-07-02 | 2004-12-02 | キヤノン株式会社 | 撮像装置および撮像システム |
JP2003262672A (ja) * | 2002-03-11 | 2003-09-19 | Canon Inc | 放射線検出装置及びその製造方法 |
JP2003279654A (ja) * | 2002-03-26 | 2003-10-02 | Canon Inc | 蛍光板 |
JP2003303945A (ja) * | 2002-04-09 | 2003-10-24 | Canon Inc | 光電変換装置及びそれを用いた放射線検出システム |
JP4018472B2 (ja) * | 2002-07-25 | 2007-12-05 | キヤノン株式会社 | デジタルx線撮影用放射線変換シート、及びデジタルx線撮影用放射線変換シートとデジタルx線撮影装置の製造方法 |
JP4307127B2 (ja) * | 2003-04-02 | 2009-08-05 | キヤノン株式会社 | 放射線撮影装置 |
JP2007071836A (ja) * | 2005-09-09 | 2007-03-22 | Canon Inc | 放射線検出装置及び放射線撮像システム |
-
2005
- 2005-09-23 FR FR0509777A patent/FR2891401B1/fr not_active Expired - Fee Related
-
2006
- 2006-09-07 WO PCT/EP2006/066116 patent/WO2007036417A1/fr active Application Filing
- 2006-09-07 EP EP06793314A patent/EP1927140A1/fr not_active Withdrawn
- 2006-09-07 JP JP2008531666A patent/JP2009509151A/ja active Pending
- 2006-09-07 US US12/065,758 patent/US8044480B2/en not_active Expired - Fee Related
-
2008
- 2008-02-12 IL IL189468A patent/IL189468A0/en unknown
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2605166A1 (fr) | 1986-10-09 | 1988-04-15 | Thomson Csf | Dispositif photosensible a l'etat solide, procede de lecture et procede de fabrication |
JPS63205381A (ja) | 1987-02-20 | 1988-08-24 | Ibiden Co Ltd | 接着剤の均一塗布方法 |
JPH05148046A (ja) | 1991-11-29 | 1993-06-15 | Kikusui Kagaku Kogyo Kk | シート状接着材および接合方法 |
US6583419B1 (en) * | 1998-08-11 | 2003-06-24 | Trixell S.A.S. | Solid state radiation detector with enhanced life duration |
JP2000241553A (ja) | 1999-02-23 | 2000-09-08 | Hitachi Metals Ltd | 放射線検出器 |
US7064335B2 (en) * | 2000-01-13 | 2006-06-20 | Hamamatsu Photonics K.K. | Radiation image sensor and scintillator panel |
US20020121606A1 (en) | 2001-02-09 | 2002-09-05 | Satoshi Okada | Scintillator panel, radiation detector and manufacture methods thereof |
FR2821671A1 (fr) | 2001-03-02 | 2002-09-06 | Gtm Construction | Procede d'evaluation de la couleur d'une surface et de l'homogeneite de cette couleur |
FR2831671A1 (fr) | 2001-10-26 | 2003-05-02 | Trixell Sas | Detecteur de rayonnement x a l'etat solide |
US7402814B2 (en) * | 2001-10-26 | 2008-07-22 | Trixell S.A.S. | Solid-state x-ray detector |
US7105830B2 (en) * | 2003-03-12 | 2006-09-12 | Canon Kabushiki Kaisha | Radiation detecting device and method of manufacturing the same |
US7705317B2 (en) * | 2004-08-20 | 2010-04-27 | Hamamatsu Photonics K.K. | Radiation imaging device and radiation imaging method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10126433B2 (en) | 2014-11-10 | 2018-11-13 | Halliburton Energy Services, Inc. | Energy detection apparatus, methods, and systems |
Also Published As
Publication number | Publication date |
---|---|
FR2891401A1 (fr) | 2007-03-30 |
EP1927140A1 (fr) | 2008-06-04 |
JP2009509151A (ja) | 2009-03-05 |
WO2007036417A1 (fr) | 2007-04-05 |
FR2891401B1 (fr) | 2007-10-26 |
US20080206917A1 (en) | 2008-08-28 |
IL189468A0 (en) | 2008-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8044480B2 (en) | Production of a radiation detector | |
US7402814B2 (en) | Solid-state x-ray detector | |
US20100291726A1 (en) | Method of Fabricating a Radiation Detector | |
US7193218B2 (en) | Radiation detection device, method of producing the same, and radiation image pick-up system | |
US20130187054A1 (en) | Radiation imaging apparatus and radiation imaging system | |
EP1481264B1 (fr) | Dispositif d'imagerie radiographique | |
KR20040081369A (ko) | 방사선검출장치 및 그 제조방법 | |
JPS61110079A (ja) | 放射線検出器 | |
JP2006337184A (ja) | 放射線検出装置 | |
EP3244236B1 (fr) | Détecteur de rayonnement et son procédé de fabrication | |
US20110260066A1 (en) | Solid-state x-ray detector | |
KR20030015896A (ko) | 장수명 방사선 검출기 | |
CN109782330B (zh) | X射线探测器及显像设备 | |
JP4443421B2 (ja) | 固体x線検出器 | |
US20200400843A1 (en) | Radiation detection panel, radiation detector, and method for manufacturing radiation detection panel | |
JP2008089459A (ja) | X線検出器、シンチレータパネル、x線検出器の製造方法およびシンチレータパネルの製造方法 | |
KR20150046624A (ko) | 엑스선 검출장치 | |
CN109830562B (zh) | 一种探测器、探测器的制造方法和显示装置 | |
KR101903268B1 (ko) | 방사선 검출기 및 신틸레이터 패널 | |
KR101914132B1 (ko) | X선 디텍터 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: THALES,FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DAST, PATRICK;REEL/FRAME:020663/0910 Effective date: 20080312 Owner name: THALES, FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:DAST, PATRICK;REEL/FRAME:020663/0910 Effective date: 20080312 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20151025 |