US8013357B2 - Side view light emitting diode package - Google Patents
Side view light emitting diode package Download PDFInfo
- Publication number
- US8013357B2 US8013357B2 US12/495,854 US49585409A US8013357B2 US 8013357 B2 US8013357 B2 US 8013357B2 US 49585409 A US49585409 A US 49585409A US 8013357 B2 US8013357 B2 US 8013357B2
- Authority
- US
- United States
- Prior art keywords
- side part
- lead
- groove
- front side
- extended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Definitions
- This document is directed to a light emitting diode (LED) technology and particularly to a side view LED package.
- LED light emitting diode
- LED Light emitting diodes
- LEDs are semiconductor elements that emit non-conformity, narrow band light beams when being applied with a forward bias voltage. LEDs have been widely employed as a display for small electronics and the applicable areas are increased more and more.
- LED packages may be classified into top view types and side view types according to the use. Side view types of LED packages are typically used for a backlight of a portable device such as laptop computers or cell phones.
- An LED package includes a housing and a lead frame.
- the housing may include a front side part and a rear side part.
- the lead frame is located between the front side part and the rear side part.
- An LED chip is placed on a pad of the lead frame and receives electricity from an external power supply to emit light.
- a cavity is formed in the center of the front side part of the housing.
- the light generated from the LED chip is externally radiated through the cavity.
- a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of an LED chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.
- the third groove may be located at a middle and upper part of a rear surface of the front side part, and the first and second grooves may be located at a left and lower part and a right and lower part, respectively, of the rear surface of the rear side part.
- a height of the middle and upper part of the rear surface may be lower than a height of both ends of the rear side part so that a space is formed at the middle and upper part of the rear side part, wherein the heat dissipation part may be extended from a first section of the first lead through the third groove in a direction of a z axis and then extended in a direction of an ⁇ x axis within the space.
- a part of the heat dissipation part, which is extended to an outside of the LED package, may be formed to cover a top surface of the housing.
- the front side part may further include a protrusion that externally protrudes from a front surface.
- the present embodiment may effectively dissipate heat generated from the LED chip by extending a heat dissipation part from the lead frame in the LED package to the outside of the LED package.
- FIG. 1 is a perspective view illustrating a 100 according to an exemplary embodiment of the present invention
- FIG. 2 is a front view illustrating the LED package 100 shown in FIG. 1 .
- FIG. 3 is a rear perspective view illustrating the LED package 100 shown in FIG. 1 ;
- FIG. 4 is a bottom perspective view illustrating the LED package 100 shown in FIG. 1 ;
- FIG. 5 is a perspective view illustrating an exemplary lead frame 130 included in the LED package 100 shown in FIG. 1 ;
- FIG. 6 is a right side view illustrating the LED package 100 shown in FIG. 1 ;
- FIG. 7 is a perspective view illustrating an LED package according to another exemplary embodiment.
- front side and “front surface” are used to refer to a part of the LED package viewed in the direction of ⁇ x axis, the terms “rear side” and “rear surface” in the direction of x axis, the terms “left side” and “right side” in the direction of y axis and ⁇ y axis, respectively.
- FIG. 1 is a perspective view illustrating an LED package 100 according to an exemplary embodiment and FIG. 2 is a front view illustrating the LED package 100 shown in FIG. 1 .
- the LED package 100 includes a housing and a lead frame 130 .
- the housing includes a first side part 110 and a rear side part 120 that are integrally formed to each other.
- the lead frame 130 is arranged between the first side part 110 and the rear side part 120 .
- the first side part 110 has a cavity 111 through which the lead frame 130 is externally exposed.
- a resin transmitting a specific wavelength of light is filled in the cavity 111 , thus constituting a light emitting window.
- An LED chip (not shown) is arranged on a pad of the lead frame 130 and exposed to the external through the light emitting window.
- the resin may contain a phosphor that absorbs a certain wavelength of light to radiate another wavelength of light.
- An inner wall surrounds the cavity 111 and may be inclined by a predetermined angle with respect to a central axis of the LED package 100 which is parallel with x axis. That is, the distance between the central axis and the inner wall 115 may decrease as going to the direction of ⁇ x axis.
- the structure thusly designed allows light emitted from the LED chip (not shown) to be effectively reflected to the outside, thus improving luminance efficiency of the LED package 100 .
- the inner wall 115 may include total eight sub-surfaces, each shaped as a trapezoid. Upper sub-surfaces located at the upper side and lower sub-surfaces located at the lower side are symmetrical to each other with respect to a central axis parallel with y axis, and three left sub-surfaces located at the left side respectively are symmetrical to three right sub-surfaces located at the right side respectively with respect to a central axis parallel with z axis.
- a protrusion 116 may be protruded from a front surface of the first side part 110 .
- the protrusion 116 may prevent the resin from overflowing out of the cavity 111 .
- the lead frame 130 includes a first lead 131 and a second lead 132 that are connected to the anode and the cathode, respectively, of the LED chip (not shown).
- a heat dissipation part 133 d may be extended from the first lead 131 .
- the lead frame 130 will be described in more detail with reference to FIGS. 5 and 6 .
- FIG. 3 is a rear perspective view illustrating the LED package 100 shown in FIG. 1
- FIG. 4 is a bottom perspective view illustrating the LED package 100 shown in FIG. 1
- FIG. 5 is a perspective view illustrating an exemplary lead frame 130 included in the LED package 100 shown in FIG. 1
- FIG. 6 is a right side view illustrating the LED package 100 shown in FIG. 1 .
- a middle and upper part, a left and lower part, and a right and lower part of the rear surface of the first side part 110 include a first groove 113 , a second groove 114 , and a third groove 112 , respectively.
- the lead frame 130 may be extended through the grooves as described later.
- a height H 2 of the rear side part 120 at both ends thereof is lower than a height H 1 of the first side part 110 at both ends thereof by a difference in height ⁇ H. That is, the rear side part 120 is depressed at both ends from a bottom surface of the first side part 110 in the direction of z axis as much as the difference in height ⁇ H.
- the difference in height ⁇ H yields a first space SP 1 .
- the rear side part 120 includes a front side sub part 121 and a rear side sub part 122 .
- a width W 2 of the rear side sub part 122 is narrower than a width W 1 of the front side sub part 121 by a difference in width ⁇ W.
- the rear side sub part 122 is depressed from a left surface of the front side sub part 121 as much as 1 ⁇ 2 difference in width ⁇ W in the direction of y axis and from a right surface of the front side sub part 121 as much as 1 ⁇ 2 difference in width ⁇ W in the direction of ⁇ y axis.
- the difference in height ⁇ W yields a second space SP 2 .
- a height H 3 of the rear side part 120 at a middle part is lower than the height H 2 of the rear side sub part 122 by a difference in height ⁇ H′. That is, the rear side part 120 is depressed at its middle part from a top surface of the rear side sub part 122 as much as the difference in height ⁇ H′ in the direction of ⁇ z axis. Due to the difference in height ⁇ H′, a third space SP 3 is formed.
- the lead frame 130 includes a first lead 131 and a second lead 132 .
- An LED chip (not shown) may be arranged on the first lead 131 .
- the anode of the LED chip is connected to the first lead 131 and the cathode is connected to the second lead 132 .
- the first lead 131 includes a first section 131 a, a second section 131 b, and a third section 131 c
- the second lead 132 includes a fourth section 132 a, a fifth section 132 b, and a sixth section 132 c
- the first lead 131 may further include a heat dissipation part 133 d for externally dissipating heat generated from an LED chip (not shown).
- a part of the first section 131 a is exposed to the external through the cavity 111 and the other parts of the first section 131 a are covered by the first side part 110 thus not to be viewed from the outside.
- a part of the fourth section 132 a is exposed to the external through the cavity 111 and the other parts of the fourth section 132 a are covered by the first side part 110 thus not to be viewed from the outside.
- the second section 131 b is extended from the first section 131 a through the first groove 113 in the direction of ⁇ z axis and then further extended in the direction of ⁇ x axis within the SP 1 .
- the second section 131 b may be accommodated in the SP 1 not to be viewed as the LED package 100 is seen from the front surface. Accordingly, the area of the first side part 110 may be increased as much as the space conventionally occupied by the second section 131 b in the LED package 100 of a limited height, that is, the area of the cavity 111 may be broadened, thus making it possible to increase the amount of light emitted from the LED chip.
- the fifth section 132 b is extended from the fourth section 132 a through the second groove 114 in the direction of ⁇ z axis and then further extended in the direction of ⁇ x axis within the SP 1 .
- the fifth section 132 b may be accommodated in the SP 1 not to be viewed as the LED package 100 is seen from the front surface.
- the area of the first side part 110 may be increased as much as the space conventionally occupied by the fifth section 132 b in the LED package 100 of a limited height, that is, the area of the cavity 111 may be broadened, thus making it possible to increase the amount of light emitted from the LED chip.
- the third section 131 c is extended from the second section 131 b in the direction of ⁇ y axis within the SP 1 and then further extended in the direction of z axis within the SP 2 .
- the third section 131 c may be accommodated in the SP 2 not to be viewed as the LED package 100 is seen from the front surface. Accordingly, the area of the first side part 110 may be increased as much as the space conventionally occupied by the third section 131 c in the LED package 100 of a limited height, that is, the area of the cavity 111 may be broadened, thus making it possible to increase the amount of light emitted from the LED chip.
- the sixth section 132 c is extended from the fifth section 132 b in the direction of y axis within the SP 1 and then further extended in the direction of z axis within the SP 2 .
- the sixth section 132 c may be accommodated in the SP 2 not to be viewed as the LED package 100 is seen from the front surface. Accordingly, the area of the first side part 110 may be increased as much as the space conventionally occupied by the sixth section 132 c in the LED package 100 of a limited height, that is, the area of the cavity 111 may be broadened, thus making it possible to increase the amount of light emitted from the LED chip.
- the second section 131 b and the third section 131 c of the first lead 131 which are exposed to the outside of the first side part 110
- the fifth section 132 b and the sixth section 132 c of the second lead 132 which are exposed to the outside of the first side part 110
- the heat dissipation part 133 d is extended from the first section 131 a through the third groove 112 in the direction of z axis and then further extended in the direction of ⁇ x axis within the SP 3 .
- the heat dissipation part 133 d may be accommodated in the SP 3 as shown in FIG. 3 not to be viewed as the LED package 100 is seen from the front surface as shown in FIG. 2 .
- the area of the first side part 110 may be increased as much as the space conventionally occupied by the heat dissipation part 133 d in the LED package 100 of a limited height, that is, the area of the cavity 111 may be broadened, thus making it possible to increase the amount of light emitted from the LED chip.
- the heat dissipation part 133 d may be extended in both directions of y axis and ⁇ y axis to be shaped as the letter “T” as seen from the top surface.
- the heat dissipation part 133 d is shaped as the letter “T” as seen from the top surface, the present embodiment is not limited thereto.
- the heat dissipation part 133 d may be formed in various shapes, such as a dash, a cross “+”, a circle, a triangle, a rectangle, etc.
- the exemplary embodiment may effectively dissipate heat generated from the LED chip (not shown) through the heat dissipation part 133 d that is externally extended from the first section 131 a to the outside of the LED package 100 .
- FIG. 7 is a perspective view illustrating an LED package according to another exemplary embodiment.
- the heat dissipation part 133 d may be formed to cover the top surface of the housing as broad as possible in order to increase the area of heat dissipation. As shown in FIG. 7 , the heat dissipation part 133 d may be formed so that the area of the heat dissipation part 133 d covering the top surface of the housing is equal to that of the top surface of the housing for the simplicity of manufacturing the heat dissipation part 133 d and mounting the same on the substrate.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0063509 | 2008-07-01 | ||
KR1020080063509A KR100986202B1 (en) | 2008-07-01 | 2008-07-01 | Side view light-emitting diode package |
Publications (2)
Publication Number | Publication Date |
---|---|
US20100001308A1 US20100001308A1 (en) | 2010-01-07 |
US8013357B2 true US8013357B2 (en) | 2011-09-06 |
Family
ID=41463684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/495,854 Expired - Fee Related US8013357B2 (en) | 2008-07-01 | 2009-07-01 | Side view light emitting diode package |
Country Status (3)
Country | Link |
---|---|
US (1) | US8013357B2 (en) |
JP (1) | JP2010016358A (en) |
KR (1) | KR100986202B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110070673A1 (en) * | 2006-02-01 | 2011-03-24 | Saiki Yamamoto | Semiconductor device and method for manufacturing the same |
US10608153B2 (en) | 2016-01-28 | 2020-03-31 | Lg Innotek Co., Ltd. | Light emitting device package and light emitting apparatus having the same |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101028195B1 (en) * | 2010-01-18 | 2011-04-11 | 엘지이노텍 주식회사 | Light emitting device package and light unit having the same |
KR101047676B1 (en) * | 2010-04-01 | 2011-07-08 | 엘지이노텍 주식회사 | Lighting device and light unit having the same |
KR101049488B1 (en) * | 2010-06-28 | 2011-07-15 | 주식회사 루멘스 | Side view type light emitting device package and backlight module |
CN103190009B (en) | 2010-09-03 | 2016-05-25 | 日亚化学工业株式会社 | Light-emitting device and light-emitting device array of packages |
CN102456818A (en) * | 2010-11-03 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | Lead frame with light-emitting diode |
JP5862572B2 (en) * | 2010-11-11 | 2016-02-16 | 日亜化学工業株式会社 | LIGHT EMITTING DEVICE AND CIRCUIT BOARD MANUFACTURING METHOD |
KR101766720B1 (en) * | 2010-11-25 | 2017-08-23 | 엘지이노텍 주식회사 | Light Emitting Device Package |
CN202024182U (en) * | 2010-12-02 | 2011-11-02 | 旭丽电子(广州)有限公司 | Light source device for backlight module and LED package structure of light source device |
US9287477B2 (en) * | 2011-06-08 | 2016-03-15 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
KR101908656B1 (en) * | 2012-04-09 | 2018-10-16 | 엘지이노텍 주식회사 | A light emitting device package |
US10418298B2 (en) * | 2013-09-24 | 2019-09-17 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming dual fan-out semiconductor package |
US20170170146A1 (en) * | 2015-12-15 | 2017-06-15 | Industrial Technology Research Institute | Semiconductor device and manufacturing method of the same |
JP6388012B2 (en) * | 2016-09-30 | 2018-09-12 | 日亜化学工業株式会社 | Light emitting device |
JP6583297B2 (en) * | 2017-01-20 | 2019-10-02 | 日亜化学工業株式会社 | Composite substrate for light emitting device and method for manufacturing light emitting device |
JP7057512B2 (en) * | 2019-08-30 | 2022-04-20 | 日亜化学工業株式会社 | Light emitting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953952B2 (en) * | 2002-09-05 | 2005-10-11 | Nichia Corporation | Semiconductor device and an optical device using the semiconductor device |
US20070247841A1 (en) * | 2006-04-21 | 2007-10-25 | Nichia Corporation | Light emitting device |
US20080048201A1 (en) * | 2006-08-23 | 2008-02-28 | Seoul Semiconductor Co., Ltd. | Light emitting diode package employing lead terminal with reflecting surface |
US7566159B2 (en) * | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4108318B2 (en) * | 2001-11-13 | 2008-06-25 | シチズン電子株式会社 | Light emitting device |
JP2003168824A (en) * | 2001-11-30 | 2003-06-13 | Sanyo Electric Co Ltd | Led display and its manufacturing method |
JP3991961B2 (en) * | 2002-09-05 | 2007-10-17 | 日亜化学工業株式会社 | Side-emitting type light emitting device |
JP4341951B2 (en) | 2003-05-07 | 2009-10-14 | シチズン電子株式会社 | Light emitting diode and its package structure |
JP2005191530A (en) * | 2003-12-03 | 2005-07-14 | Sumitomo Electric Ind Ltd | Light emitting device |
JP2005252168A (en) | 2004-03-08 | 2005-09-15 | Nichia Chem Ind Ltd | Surface mount light emitting device |
JP4789433B2 (en) * | 2004-06-30 | 2011-10-12 | 三洋電機株式会社 | LED display housing and LED display |
JP4542453B2 (en) * | 2005-03-24 | 2010-09-15 | 日亜化学工業株式会社 | Light emitting device |
DE102006032416A1 (en) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Radiation-emitting component |
JP4922663B2 (en) * | 2006-05-18 | 2012-04-25 | スタンレー電気株式会社 | Semiconductor optical device |
KR100749666B1 (en) * | 2006-06-27 | 2007-08-14 | 서울반도체 주식회사 | Side view type led package with heat sink protrusion |
JP4952215B2 (en) * | 2006-08-17 | 2012-06-13 | 日亜化学工業株式会社 | Light emitting device |
JP2007027801A (en) | 2006-11-01 | 2007-02-01 | Sanyo Electric Co Ltd | Led display device and manufacturing method thereof |
TWM312020U (en) * | 2006-12-04 | 2007-05-11 | Lighthouse Technology Co Ltd | Light emitting diode package structure |
-
2008
- 2008-07-01 KR KR1020080063509A patent/KR100986202B1/en not_active IP Right Cessation
-
2009
- 2009-05-29 JP JP2009130134A patent/JP2010016358A/en active Pending
- 2009-07-01 US US12/495,854 patent/US8013357B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6953952B2 (en) * | 2002-09-05 | 2005-10-11 | Nichia Corporation | Semiconductor device and an optical device using the semiconductor device |
US20070247841A1 (en) * | 2006-04-21 | 2007-10-25 | Nichia Corporation | Light emitting device |
US20080048201A1 (en) * | 2006-08-23 | 2008-02-28 | Seoul Semiconductor Co., Ltd. | Light emitting diode package employing lead terminal with reflecting surface |
US7566159B2 (en) * | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110070673A1 (en) * | 2006-02-01 | 2011-03-24 | Saiki Yamamoto | Semiconductor device and method for manufacturing the same |
US8198108B2 (en) * | 2006-02-01 | 2012-06-12 | Nichia Corporation | Semiconductor device and method for manufacturing the same |
US10608153B2 (en) | 2016-01-28 | 2020-03-31 | Lg Innotek Co., Ltd. | Light emitting device package and light emitting apparatus having the same |
Also Published As
Publication number | Publication date |
---|---|
KR100986202B1 (en) | 2010-10-07 |
KR20100003556A (en) | 2010-01-11 |
JP2010016358A (en) | 2010-01-21 |
US20100001308A1 (en) | 2010-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8013357B2 (en) | Side view light emitting diode package | |
US10134967B2 (en) | Light emitting device | |
US7705366B2 (en) | LED package having lead frames | |
US7804105B2 (en) | Side view type LED package | |
JP5745495B2 (en) | LIGHT EMITTING ELEMENT AND LIGHTING SYSTEM HAVING THE SAME | |
KR102014955B1 (en) | Light source module for vehicle | |
US20080158856A1 (en) | Light-emitting device with a long lifespan | |
US7847300B2 (en) | Light-emitting diode package | |
CN107949922B (en) | Light emitting diode package | |
KR100798382B1 (en) | Lead frame having heat emitting portion and light emitting diode package using the same | |
KR102017464B1 (en) | Substrate for mounting laser diode using light source module for vehicle | |
KR100993903B1 (en) | Side view light-emitting diode package | |
US20210091287A1 (en) | Light emitting diode package | |
KR100983252B1 (en) | Led panel with heat sink | |
KR101041503B1 (en) | Semiconductor light emitting device package | |
US8581278B2 (en) | Light-emitting diode packaging structure | |
US9887179B2 (en) | Light emitting diode device and light emitting device using the same | |
KR101807398B1 (en) | Packaging method of light emitting means and reflector, and structure thereof | |
US11293613B2 (en) | Vehicle luminaire and vehicle lighting tool | |
US8896009B2 (en) | Light emitting diode with two alternative mounting sides for mounting on circuit board | |
KR20090047306A (en) | Light emitting diode package | |
KR101628869B1 (en) | Back light unit | |
US20070181899A1 (en) | Light emitting diode package | |
KR20190019691A (en) | Light emitting diode package | |
KR20130003413A (en) | Led lamp |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ALTI-ELECTRONICS CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PARK, KYOUNG-IL;LEE, JIN-WON;KIM, SUN-HONG;AND OTHERS;REEL/FRAME:023383/0746 Effective date: 20090630 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
REMI | Maintenance fee reminder mailed | ||
FPAY | Fee payment |
Year of fee payment: 4 |
|
SULP | Surcharge for late payment | ||
AS | Assignment |
Owner name: AURORATECH LIGHTING LLC, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ALTI-ELECTRONICS CO., LTD;REEL/FRAME:044986/0747 Effective date: 20180111 |
|
AS | Assignment |
Owner name: BENCH WALK LIGHTING LLC, NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AURORATECH LIGHTING, LLC;REEL/FRAME:047298/0759 Effective date: 20180228 |
|
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20190906 |