US7755894B2 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

Info

Publication number
US7755894B2
US7755894B2 US11/309,344 US30934406A US7755894B2 US 7755894 B2 US7755894 B2 US 7755894B2 US 30934406 A US30934406 A US 30934406A US 7755894 B2 US7755894 B2 US 7755894B2
Authority
US
United States
Prior art keywords
heat pipes
heat
base plate
flat
dissipation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US11/309,344
Other versions
US20070215321A1 (en
Inventor
Ping-An Yang
Meng Fu
Shi-Wen Zhou
Chun-Chi Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Champ Tech Optical Foshan Corp
Original Assignee
Fu Zhun Precision Industry (Shenzhen) Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200610034554.9 priority Critical
Priority to CN200610034554 priority
Priority to CN 200610034554 priority patent/CN101039571B/en
Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHUN-CHI, FU, MENG, YANG, PING-AN, ZHOU, SHI-WEN
Application filed by Fu Zhun Precision Industry (Shenzhen) Co Ltd, Foxconn Technology Co Ltd filed Critical Fu Zhun Precision Industry (Shenzhen) Co Ltd
Publication of US20070215321A1 publication Critical patent/US20070215321A1/en
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FOXCONN TECHNOLOGY CO., LTD.
Publication of US7755894B2 publication Critical patent/US7755894B2/en
Application granted granted Critical
Assigned to FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
Assigned to CHAMP TECH OPTICAL (FOSHAN) CORPORATION reassignment CHAMP TECH OPTICAL (FOSHAN) CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, FOXCONN TECHNOLOGY CO., LTD.
Application status is Active legal-status Critical
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00Heat exchange conduits
    • F28F2210/10Particular layout, e.g. for uniform temperature distribution
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.

Description

FIELD OF THE INVENTION

The present invention relates to a heat dissipation device, more particularly to a heat dissipation device using heat pipes for enhancing heat removal from heat generating electronic devices.

DESCRIPTION OF RELATED ART

As computer technology continues to advance, electronic components such as central processing units (CPUs) of computers are being made to provide faster operational speeds and greater functional capabilities. When a CPU operates at high speed in a computer enclosure, its temperature can increase greatly. It is desirable to dissipate the heat quickly, for example by using a heat dissipation device attached to the CPU in the enclosure. This allows the CPU and other electronic components in the enclosure to function within their normal operating temperature ranges, thereby assuring the quality of data management, storage and transfer.

A conventional heat dissipation device comprises a heat sink and a heat pipe. The heat sink comprises a base and a plurality of fins extending from the base. The base defines a groove in a top surface thereof, and a bottom surface of the base is attached to an electronic component. Each heat pipe has an evaporating portion accommodated in the groove and a condensing portion inserted in the fins. The base absorbs heat produced by the electronic component and transfers the heat directly to the fins through the heat pipe. By the provision of the heat pipe, heat dissipation efficiency of the heat dissipation device is improved.

However, the groove has to be first formed on the top surface of the base so as to receive the evaporating portion of the heat pipe. The base has to be thick so as to form the groove thereon, and this leads to an increase in cost. Furthermore, it is a waste to cut material off the base to form the groove. Therefore, it is desirable to provide a heat dissipation device that eliminates the aforesaid drawbacks.

SUMMARY OF THE INVENTION

A heat dissipation device comprises a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other and thermally connect with the first base plate. The condensing sections thermally connect with the thermally conductive layer.

Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded view of a heat dissipation device in accordance with a preferred embodiment of the present invention;

FIG. 2 is an assembled view of the heat dissipation device in FIG. 1, together with an electronic package mounted on a printed circuit board; and

FIG. 3 is a bottom view of the heat dissipation device in FIG. 2.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1-3, a heat dissipation device 10 in accordance with a preferred embodiment of the present invention is illustrated. The heat dissipation device 10 is used to cool down an electronic package such as a central processing unit (CPU) 20 mounted on a printed circuit board 30; it comprises a base 100, a fin assembly 200 mounted on the base 100 and four fasteners 300 used for securing the heat dissipation device 10 onto the CPU 20. The base 100 comprises a first base plate 110, a second base plate 130 parallel to the first base plate 110, and four flattened heat pipes 150 sandwiched between the first and second base plates 110, 130 and separating the second base plate 130 from the first base plate 110. The four heat pipes 150 can be divided into two pairs, namely two first heat pipes 152 and two second heat pipes 154.

The first base plate 110 is substantially rectangular, and made of thermal conductive material such as copper or aluminum. The first base plate 110 is a flat member having a flat top surface supporting the heat pipes 150 and a flat bottom surface for directly contacting with the CPU 20 to absorbing heat therefrom. In this embodiment, the first base plate 110 is larger than the CPU 20 and smaller than the second base plate 130, which avails to reduce the cost of the heat dissipation device 10.

The second base plate 130 is also substantially rectangular, and made of thermal conductive material such as copper, aluminum. A through hole 132 is defined in each corner of the second base plate 130 for the fasteners 300 extending therethough to secure the heat dissipation device 10 onto a top surface of the CPU 20. The second base plate 130 is also a flat member having a flat top surface supporting the fin assembly 200 and a flat bottom surface facing the heat pipes 150.

The heat pipes 150 are U shaped. Each heat pipe 152, 154 comprises two separate parallel arms, which are in different length and are respectively functioned as an evaporating section 1522, 1542 and a condensing section 1524, 1544.

The heat pipes 152, 154 are assembled on the first base plate 110 and the second base plate 130 by soldering or adhering to form the base 100. When the base 100 is formed, the heat pipes 152, 154 are hooked one-inside-the-other, with the evaporating sections 1522, 1542 thereof abutting side by side against each other. The first heat pipes 152 are so oriented that they open to a same direction; and the second heat pipes 154 are so oriented that they open to a direction opposite to that of the first heat pipes 152. The evaporating sections 1522 of the first heat pipes 152 and the evaporating sections 1542 of the second heat pipes 154 are alternately arranged, and are located between the condensing sections 1524, 1544 of the heat pipes 152, 154. The condensing sections 1524 of the first heat pipes 152 closely contact adjacent condensing sections 1544 of the second heat pipes 154. In this embodiment, only the evaporating sections 1522, 1542 of the first and second pipes 1524, 1544 are fixed to the first base plate 110 to absorb heat therefrom; while the condensing sections 1524, 1544 of the first and second heat pipes 152, 154 spread out from the first base plate 110 and extend to reach other parts of the second base plate 130.

Thus, heat originating from the CPU 20 is absorbed by the first base plate 110 and conducted to the evaporating sections 1522, 1542 of the first and second heat pipes 152, 154, where it can then quickly spread to the second base plate 130 by the condensing sections 1524, 1544 of the heat pipes 152, 154. So a uniform temperature distribution in the second base plate 130 is achieved. This allows uniform transfer of heat from the second base plate 130 to the fin assembly 200 to improve the heat dissipation of the fin assembly 200; thus, the efficiency of the heat dissipation device 10 is promoted.

The fin assembly 200 comprises a plurality of individual fin plates 210 arranged side by side. Each fin plate 210 is made of a highly thermally conductive material such as aluminum or copper. Each fin plate 210 has a flange 212 bent from a bottom edge thereof, and the flanges 212 of the fin plates 210 are formed so as to be coplanar with each other to form a flat bottom surface. The fin assembly 200 can be mounted on the top surface of the second base plate 130. The fin plates 210 are arranged on the second base plate 130 at a predetermined interval and perpendicular to a direction which the arms of the heat pipes 152, 154 extend along. In other words, the fin plates 210 extend vertically while the heat pipes 152, 154 are arranged on a horizontal plane. Furthermore, four depressions 220 are defined in the fin assembly 200 corresponding to the through holes 132 defined in the second base plate 130 for facilitating installation of the fasteners 300. In another embodiment, the flat bottom surface of the fin plates 200 can serve as the second base plate 130, and the fin plates 210 can be directly mounted onto the heat pipes 152, 154 without the second base plate 130.

As described above, the top surface of the first base plate 110 and the bottom surface of the second base plate 130 are flat without the presence of the groove which exists in the conventional heat dissipation device. Thus, the first base plate 110 can be manufactured to be very thin to reduce the cost. Furthermore, the condensing sections 1524, 1544 of the heat pipes 152, 154 are bent from the evaporating section 1522, 1542 of the heat pipes 152, 154 and spread on the second base plate 130. This serves to uniformly transfer the heat from the second base plate 130 to the fin assembly 200 and to improve the utilization of the fin assembly 200 to dissipate the heat.

It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (20)

1. A heat dissipation device, comprising:
a first base plate having a flat top surface and a flat bottom surface adapted for connecting with a heat-generating electronic component;
two first heat pipes and two second heat pipes, each of the first and second heat pipes being generally U-shaped and comprising two straight arms, the first and second heat pipes being supported on the top surface of the first base plate;
a fin assembly located above the first and second heat pipes; and
a thermally conductive layer formed between the first and second heat pipes and the fin assembly, the thermal conductive layer having a flat surface contacting the first and second heat pipes;
wherein the first and second heat pipes are arranged side by side such that the straight arms of the first and second heat pipes are substantially parallel to each other and arranged alternately one straight arm after another.
2. The heat dissipation device as claimed in claim 1, wherein the thermally conductive layer comprises a second base plate parallel to the first base plate, the second base plate comprising a flat bottom surface in contact with the first and second heat pipes.
3. The heat dissipation device as claimed in claim 1, wherein each of the first and second heat pipes is flat, and the first and second heat pipes are arranged on a plane.
4. The heat dissipation device as claimed in claim 1, wherein each of the first heat pipes is oriented such that an open end of the U-shape points in a first direction, and each of the second heat pipes is oriented such that an open end of the U-shape points in a second direction different from the first direction.
5. The heat dissipation device as claimed in claim 2, wherein the straight arms of each of the first and second heat pipes are an evaporating section and a condensing section, respectively, the evaporating sections of the first and second heat pipes being arranged and abutting one another side by side to form four consecutively parallel evaporating sections thermally connecting with the first base plate, the condensing sections of the first and second heat pipes thermally connecting with the thermally conductive layer.
6. The heat dissipation device as claimed in claim 2, wherein the first base plate is smaller than the second base plate.
7. The heat dissipation device as claimed in claim 5, wherein the evaporating sections of the first and second heat pipes are fixed to the first base plate, while the condensing sections of the first and second heat pipes spread out from the first base plate and extend to reach the second base plate.
8. The heat dissipation device as claimed in claim 5, wherein the evaporating sections of the first and second heat pipes are located between the condensing sections of the first and second heat pipes.
9. The heat dissipation device as claimed in claim 2, wherein a through hole is defined in each corner of the second base plate for a fastener to extend therethough.
10. The heat dissipation device as claimed in claim 9, wherein four depressions are defined in the fin assembly corresponding to the through holes of the second base plate.
11. The heat dissipation device as claimed in claim 2, wherein the fin assembly comprises a plurality of individual fin plates arranged side by side, the fin plates comprise a plurality of flanges extending from bottom edges thereof, and the flanges of the fin plates are coplanar with each other and thermally connect with a flat top surface of the second base plate.
12. The heat dissipation device as claimed in claim 3, wherein the fin plates are oriented perpendicularly to the plane on which the heat pipes are arranged.
13. A base for removing heat from an electronic package, the base comprising:
a first base plate having a flat top surface, and a flat bottom surface adapted for engaging with the electronic package;
two first heat pipes and two second heat pipes, each of the first and second heat pipes being generally U-shaped and comprising two straight arms, the first and second heat pipes being supported on the top surface of the first base plate, and
a second base plate parallel to the first base plate and comprising a flat bottom surface in contact with the first and second heat pipes;
wherein the first and second heat pipes are arranged side by side such that the straight arms of the first and second heat pipes are substantially parallel to each other and arranged alternately one straight arm after another.
14. The base as claimed in claim 13, wherein the straight arms of each of the first and second heat pipes are an evaporating section and a condensing section, respectively, the evaporation sections of the first and second heat pipes being arranged and abutting one another side by side, the condensing sections of the first and second heat pipes being arranged side by side.
15. The base as claimed in claim 13, wherein each of the first and second heat pipes is flat, and the first and second heat pipes are arranged on a plane.
16. The heat dissipation device as claimed in claim 15, wherein each of the first heat pipes is oriented such that an open end of the U-shape points in a first direction, and each of the second heat pipes is oriented such that an open end of the U-shape points in a second direction opposite to the first direction.
17. An electronic assembly comprising:
a printed circuit board;
an electronic package mounted on the printed circuit board;
a first flat plate having a flat bottom surface engaging with the electronic package and a flat top surface;
two pairs of U-shaped heat pipes, each heat pipe having an evaporating section engaging with the flat top surface of the first flat plate, a condensing section substantially parallel to the evaporation section, and a bent section connecting the evaporation section and the condensing section, wherein in each pair of the heat pipes, one of the heat pipes is inverted with respect to the other of the heat pipes in a manner that the evaporation sections thereof are arranged and abut against one another side by side, and the condensing sections thereof are in contact with each other, whereby each pair of the heat pipes cooperatively forms a substantially closed thermal loop; and
a fin assembly having a bottom surface thermally connecting with the condensing sections of the pairs of heat pipes, wherein the pairs of heat pipes are sandwiched between the fin assembly and the first flat plate.
18. The electronic assembly of claim 17, further comprising a second flat plate sandwiched between the condensing sections of the pairs of heat pipes and the bottom surface of the fin assembly, the second flat plate thermally connecting the condensing sections of the pairs of heat pipes and the bottom surface of the fin assembly together.
19. The electronic assembly of claim 18, wherein the second flat plate is larger than the first flat plate, the evaporation sections of the pairs of heat pipes thermally connecting with the top flat surface of the first flat plate, and the condensing sections of the at least two heat pipes spreading out from the first flat plate.
20. The heat dissipation device as claimed in claim 13, wherein the two straight arms of each of the first and second heat pipes have different lengths.
US11/309,344 2006-03-16 2006-07-28 Heat dissipation device Active 2029-05-11 US7755894B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200610034554.9 2006-03-16
CN200610034554 2006-03-16
CN 200610034554 CN101039571B (en) 2006-03-16 2006-03-16 Heat radiator and base holder thereof

Publications (2)

Publication Number Publication Date
US20070215321A1 US20070215321A1 (en) 2007-09-20
US7755894B2 true US7755894B2 (en) 2010-07-13

Family

ID=38516568

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/309,344 Active 2029-05-11 US7755894B2 (en) 2006-03-16 2006-07-28 Heat dissipation device

Country Status (2)

Country Link
US (1) US7755894B2 (en)
CN (1) CN101039571B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090260782A1 (en) * 2008-04-17 2009-10-22 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US20110090647A1 (en) * 2009-10-21 2011-04-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Printed circuit board assembly
US20120273168A1 (en) * 2011-04-28 2012-11-01 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipe
US10128601B1 (en) 2014-10-25 2018-11-13 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7451806B2 (en) * 2006-07-24 2008-11-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7694727B2 (en) * 2007-01-23 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat pipes
US20080173430A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7753109B2 (en) * 2007-05-23 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7779897B2 (en) * 2007-07-02 2010-08-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7746640B2 (en) * 2007-07-12 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7609521B2 (en) * 2007-09-26 2009-10-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
CN101408301B (en) * 2007-10-10 2012-09-19 富准精密工业(深圳)有限公司 LED light fitting with heat radiating device
CN101466232B (en) 2007-12-21 2012-03-21 富准精密工业(深圳)有限公司 Radiating device
CN101573017B (en) 2008-04-28 2012-07-04 富准精密工业(深圳)有限公司 Radiating device
TW201012374A (en) * 2008-09-09 2010-03-16 Sunonwealth Electr Mach Ind Co Heat dissipating device
CN101742892B (en) 2008-11-20 2013-02-20 富准精密工业(深圳)有限公司 Heat pipe radiator
US20100126700A1 (en) * 2008-11-24 2010-05-27 Li-Ling Chen Heat-radiating base plate and heat sink using the same
US7679912B1 (en) * 2008-12-07 2010-03-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having heat pipe
US8027160B2 (en) * 2009-01-22 2011-09-27 Dell Products L.P. Heat sink including extended surfaces
CN102819302A (en) * 2011-06-09 2012-12-12 富准精密工业(深圳)有限公司 Radiator
CN102830772A (en) * 2011-06-15 2012-12-19 富准精密工业(深圳)有限公司 Radiating device
CN102892276B (en) * 2011-07-22 2016-05-11 富准精密工业(深圳)有限公司 Substrate and there is the heat abstractor of this substrate
CN102938995A (en) * 2011-08-15 2013-02-20 富准精密工业(深圳)有限公司 Heat dissipation device
US9417015B2 (en) 2012-02-22 2016-08-16 Thermal Corp. Heat exchanger backing plate and method of assembling same
US9013874B2 (en) * 2012-09-12 2015-04-21 Sk Hynix Memory Solutions Inc. Heat dissipation device
CN104640418A (en) * 2013-11-14 2015-05-20 升业科技股份有限公司 Heat dissipating module
US20170023306A1 (en) * 2015-07-22 2017-01-26 Compulab Ltd. Layered heat pipe structure for cooling electronic component
WO2017061408A1 (en) * 2015-10-08 2017-04-13 古河電気工業株式会社 Heat sink
CN106767062A (en) * 2016-12-27 2017-05-31 山东海晶电子科技有限公司 The copper-based pulsating heat pipe of Nanosurface
CN106679473A (en) * 2016-12-27 2017-05-17 山东海晶电子科技有限公司 Double-layer multi-channel panel nano-surface pulsating heat pipe and preparation method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US20040170000A1 (en) * 2003-01-27 2004-09-02 Kabushiki Kaisha Toshiba Heat dissipating device and electronic apparatus including the same
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20070107876A1 (en) * 2005-11-13 2007-05-17 Wan-Lin Xia Heat sink with heat pipes
US7227752B2 (en) * 2005-05-23 2007-06-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US7278470B2 (en) * 2005-11-21 2007-10-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US20040170000A1 (en) * 2003-01-27 2004-09-02 Kabushiki Kaisha Toshiba Heat dissipating device and electronic apparatus including the same
US20070131387A1 (en) * 2003-09-12 2007-06-14 Kenya Kawabata Heat sink with heat pipes and method for manufacturing the same
US7000687B2 (en) * 2004-04-22 2006-02-21 Hon Hai Precision Industry Co., Ltd. Heat dissipating device
US7227752B2 (en) * 2005-05-23 2007-06-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US7520316B2 (en) * 2005-10-05 2009-04-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with heat pipes
US20070107876A1 (en) * 2005-11-13 2007-05-17 Wan-Lin Xia Heat sink with heat pipes
US7278470B2 (en) * 2005-11-21 2007-10-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090260782A1 (en) * 2008-04-17 2009-10-22 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US8286693B2 (en) * 2008-04-17 2012-10-16 Aavid Thermalloy, Llc Heat sink base plate with heat pipe
US20110090647A1 (en) * 2009-10-21 2011-04-21 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Printed circuit board assembly
US8072762B2 (en) * 2009-10-21 2011-12-06 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Printed circuit board assembly
US20120273168A1 (en) * 2011-04-28 2012-11-01 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipe
US10128601B1 (en) 2014-10-25 2018-11-13 ComponentZee, LLC Fluid pressure activated electrical contact devices and methods

Also Published As

Publication number Publication date
US20070215321A1 (en) 2007-09-20
CN101039571A (en) 2007-09-19
CN101039571B (en) 2010-07-28

Similar Documents

Publication Publication Date Title
US20020159237A1 (en) Cooling arrangement for high density packaging of electronic components
US6958915B2 (en) Heat dissipating device for electronic component
US7110259B2 (en) Heat dissipating device incorporating heat pipe
US7215548B1 (en) Heat dissipating device having a fin also functioning as a fan duct
US7363963B2 (en) Heat dissipation device
US6938682B2 (en) Heat dissipation device
US7382047B2 (en) Heat dissipation device
US7391613B2 (en) Memory module assembly including a clamp for mounting heat sinks thereon
US7619893B1 (en) Heat spreader for electronic modules
US7028758B2 (en) Heat dissipating device with heat pipe
US7414850B2 (en) Heat dissipation module for electronic device
US7319588B2 (en) Heat dissipation device
US20070263355A1 (en) Heat dissipation system
US7327576B2 (en) Heat dissipation device
US20040108100A1 (en) Heat dissipator
US7100681B1 (en) Heat dissipation device having heat pipe
CN101605442B (en) Heat dissipation device
US7331379B2 (en) Heat dissipation device with heat pipe
US7145775B2 (en) Chassis conducted cooling thermal dissipation apparatus for servers
US7296617B2 (en) Heat sink
CN101776941B (en) Radiating device
US20040112572A1 (en) Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing
US7025125B2 (en) Heat dissipating device with heat pipe
US20090294114A1 (en) Heat dissipation device and manufacturing method thereof
CN101039571B (en) Heat radiator and base holder thereof

Legal Events

Date Code Title Description
AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, PING-AN;FU, MENG;ZHOU, SHI-WEN;AND OTHERS;REEL/FRAME:018020/0764

Effective date: 20060713

AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:024447/0076

Effective date: 20100519

Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:024447/0076

Effective date: 20100519

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:024447/0076

Effective date: 20100519

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:024447/0076

Effective date: 20100519

STCF Information on status: patent grant

Free format text: PATENTED CASE

FPAY Fee payment

Year of fee payment: 4

AS Assignment

Owner name: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:040240/0918

Effective date: 20160921

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:040240/0918

Effective date: 20160921

AS Assignment

Owner name: CHAMP TECH OPTICAL (FOSHAN) CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHAMP TECH OPTICAL (FOSHAN) CORPORATION;FOXCONN TECHNOLOGY CO., LTD.;REEL/FRAME:041364/0579

Effective date: 20170208

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552)

Year of fee payment: 8