CN102938995A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
CN102938995A
CN102938995A CN201110232274XA CN201110232274A CN102938995A CN 102938995 A CN102938995 A CN 102938995A CN 201110232274X A CN201110232274X A CN 201110232274XA CN 201110232274 A CN201110232274 A CN 201110232274A CN 102938995 A CN102938995 A CN 102938995A
Authority
CN
China
Prior art keywords
cover plate
radiating fin
heat
base plate
fin group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201110232274XA
Other languages
Chinese (zh)
Inventor
彭学文
李伟
刘豪侠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN201110232274XA priority Critical patent/CN102938995A/en
Priority to US13/337,061 priority patent/US20130043006A1/en
Publication of CN102938995A publication Critical patent/CN102938995A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device comprises a substrate and a heat dissipation fin group arranged on the base plate. The substrate comprises a base plate, a cover plate and a support part clamped between the base plate and the cover plate, wherein the base plate, the cover plate and the support part jointly form a cavity. The heat dissipation device comprises a heat tube penetrating through the cover plate, wherein the heat tube comprises a U-shaped evaporation end, a condensation end and a connecting section connected between the evaporation end and the condensation end. The U-shaped evaporation end is accommodated in the cavity, the condensation end is arranged in the heat dissipation fin group in a penetrating mode, and a plane formed by the condensation end and the connecting section and a plane where the U-shaped evaporation end is located form a nonzero included angle. The heat dissipation device adopts thin design, saves used materials and is simple and stable in structure and high in heat dissipation efficiency.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, refer to especially a kind of heat abstractor of electronic component.
Background technology
Along with the electronic and information industry development, the main electronic component of each electronic installation inside, such as central processing unit running frequency and speed in continuous lifting; And along with electronic performance constantly promotes, the classification of each peripheral electronic component and quantity also constantly increase.The heat that the increase of high-frequency high-speed and quantity will make electronic component produce increases thereupon, so that the electronic installation internal temperature constantly raises, performance when the electronic installation operation in serious threat, for guaranteeing the normal operation of electronic installation energy, usually adopt a heat abstractor in time to discharge the amount of heat that electronic component produces.
In the existing field of radiating, heat abstractor generally includes substrate, heat pipe and radiating fin.This substrate is generally one by the heat conductivility solid flat board made of metal material preferably, and itself and electronic component are sticked and directly absorb the heat that electronic component produces.This substrate is provided with through hole, and heat pipe is arranged in the heat that produces with better absorption electronic component in the through hole of this substrate usually.Yet along with environmental protection consciousness deeply and electronic product more and more to the trend of lightening development, not only the materials amount is large to plug the mode of heat pipe in the larger substrate of thickness, and can not satisfy the demand of frivolous product.Simultaneously, along with the lifting of electronic component running frequency, the heat of its release is corresponding increase also, and the radiating efficiency of above-mentioned typical heat abstractor is just not enough to some extent, so that affects the integral heat sink efficient of heat abstractor.
Summary of the invention
In view of this, be necessary to provide a kind of slimming, radiating efficiency is higher and the substrate of stabilized structure and have the heat abstractor of this substrate.
A kind of heat abstractor, comprise substrate and be located at radiating fin group on the substrate, this substrate comprises base plate, cover plate and is held on strutting piece between base plate, the cover plate, the common cavity that forms of this base plate, cover plate and strutting piece, this heat abstractor comprises the heat pipe that wore cover plate, described heat pipe comprises U-shaped evaporation ends, condensation end and connects the linkage section of this evaporation ends and condensation end, this U-shaped evaporation ends is contained in this cavity, this condensation end is placed through in the radiating fin group, and the plane that this condensation end and linkage section form and the plane at this U-shaped evaporation ends place are non-zero included angle.
Compared with prior art, above-mentioned heat abstractor adopts slim cover plate and the structure of base plate sandwiched heat pipe and strutting piece, structural entity thickness is reduced, material saving, contact with the direct of radiating fin group by heat pipe, cover plate, enlarge active surface, thus the radiating efficiency of this heat abstractor promoted; In addition, above-mentioned heat abstractor adopts the heat pipe with U-shaped evaporation ends, and the Temperature Distribution on the balanced base plate of not only can trying one's best can also play stable center of gravity, supporting role to linkage section, the condensation end that extends that be inclined upwardly, and increases the reliability of heat abstractor.And because the setting of strutting piece makes structure when reaching the slimming requirement, and intensity and reliability etc. are also very high, strengthen the stability of slimming structure.
With reference to the accompanying drawings, the invention will be further described in conjunction with embodiment.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of the heat abstractor of an embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the three-dimensional exploded view of radiating bottom plate among Fig. 1.
Fig. 4 is the three-dimensional exploded view of another angle of heat abstractor among Fig. 1.
The main element symbol description
Heat abstractor 100
Substrate 10
The radiating fin group 20
Base plate 11
Cover plate 12
Strutting piece 13
Heat pipe 14
Body 111
Sidewall 112
Through hole 113、123、133
Breach 121
The first support 131
The second support 132
Cavity 30
Evaporation ends 141
Condensation end 142
Linkage section 143
Radiating fin 21
Gas channel 22
Perforation 211
Open slot 212
The bottom 23
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
As shown in Figure 1, this heat abstractor 100 comprises a substrate 10 and a radiating fin group 20.This heat abstractor 100 can be located on the circuit board (not shown), and its bottom 23 is used for contacting with heat-generating electronic elements (not shown) on the circuit board, to absorb its heat.
Please consult simultaneously Fig. 2 and Fig. 3, this substrate 10 comprises a base plate 11, a cover plate 12, is held on a strutting piece 13 and two heat pipes 14 between this base plate 11 and this cover plate 12.
Concrete, described base plate 11 comprises a body 111 and symmetrical two side 112.This body 111 is square and is used for contacting with the heat-generating electronic elements (not shown), and the marginal portion of this body 111 offers some through holes 113.In the present embodiment, the quantity of described through hole 113 is four, and four drift angles that correspond respectively to base plate 11 offer symmetrically and evenly, and certainly, in other embodiments, position and quantity that described through hole 113 is offered can be adjusted according to actual needs.This two side 112 is positioned at the both sides of the edge of these body 111 symmetries, and certainly these body 111 edge-perpendicular upwards bending extend to form.
It is one lamellar that this cover plate 12 is, and its two surface is the plane, and this cover plate 12 be arranged in parallel with this body 111, and usually, the thickness of this cover plate 12 is not more than the 0.8mm(millimeter).Breach 121 is all offered at the middle part at the dual-side edge that described cover plate 12 and sidewall 112 are corresponding, and this two breach 121 is used for wearing described heat pipe 14.Also offer on 12 4 drift angles of this cover plate with base plate 11 on the through hole 123 of through hole 113 corresponding connections.
Described strutting piece 13 comprises strip the first support 131 and the second support 132.Described the first support 131 and the second support 132 are parallel to each other and are fastened between cover plate 12 and the base plate 11, this first support 131 and this second support 132 are attached at this body 111 and are not formed with the two edges of sidewall 112 and vertical with this two side 112, and described base plate 11, strutting piece 13 and cover plate 12 enclose docking and form a cavity 30.Wherein, the thickness of the height that extends of described sidewall 112 and this strutting piece 13 all with the deep equality of this cavity 30.
The width of the length of each support and base plate 11 about equally, offer respectively two through hole 133 on the first support 131 and the second support 132, and the spacing of two through hole 133 equates with the two through hole 113 of the same side of base plate 11 and cover plate 12,123 spacing on the same support, thereby can pass through connector, through hole 113,123 as described in wearing such as screw etc., 133 and with as described in base plate 11, strutting piece 13 be connected with cover plate 12, to form described substrate 10.The thickness of described the first support 131 and the second support 132 and the deep equality of cavity 30, so the upper and lower surface of described strutting piece 13 can be respectively and the Surface Contact of cover plate 12 and base plate 11, thereby play a supporting role when connecting described base plate 11 with cover plate 12 by connector.When this substrate 10 was subject to pressure perpendicular to base plate 11 and cover plate 12, described strutting piece 13 can be this thin base 10 and bears partial pressure, strengthens intensity and the reliability of structure, prevents that substrate 10 from deforming.
The 14 adjacent settings of described two heat pipes, each heat pipe 14 comprise an evaporation ends 141, a condensation end 142 and connect a linkage section 143 of this evaporation ends 141 and this condensation end 142.
Concrete, the evaporation ends 141 of each heat pipe 14 is placed in the cavity 30 of described cover plate 12, strutting piece 13 and base plate 11 docking formation, and places between the first support 131 and the second support 132, and this evaporation ends 141 roughly is " U " shape flat.In the present embodiment, evaporation ends 141 " U " the shape opening of this two heat pipe 14 arranges opposite direction.This evaporation ends 141 fits with the body 111 of this base plate 11, and the thickness of this evaporation ends 141 equates with the thickness of this described strutting piece 13, thereby also play the effect that supporting substrate 10 increases structural strength in heat conduction.This evaporation ends 141 can directly adopt the mode of sandwiched to be placed in the cavity 30, when fixing heat pipe 14, also can adopt heat-conducting glue to be coated between evaporation ends 141 and cover plate 12, the base plate 11.This evaporation ends 141 can also adopt the mode of welding to be fixed on the base plate 11, installs and fixes thereby be beneficial to.
Described linkage section 143 upwards bends from these evaporation ends 141 mutual close ends and extends, and to lopsidedness, in the present embodiment, linkage section 143 incline directions of this two heat pipe 14 mutually away from, each linkage section 143 roughly is arc shaped, this linkage section 143 is flat with the end that this evaporation ends 141 is connected, and this flat end is extended and faded to cylindric to condensation end 142 by evaporation ends 141.This linkage section 143 stretches out in cavity 30 via two breach 121 of described cover plate 12, to extend the condensation end 142 that connects this heat pipe 14.
The condensation end 142 of described two heat pipes 14 extends from the terminal horizontal of this two linkage section 143, and the condensation end 142 of each heat pipe 14 all is parallel to each other with described strutting piece 13.142 one-tenth of this condensation ends are cylindric, and its length is identical with the length of described strutting piece 13.Described condensation end 142 wore this radiating fin group 20, to reach fast and effectively heat exchange.
Further, the plane that the condensation end 142 of this two heat pipe 14 and linkage section 143 form and the plane at this evaporation ends 141 places are non-zero included angle, and namely this heat pipe 14 presents the stability that stereochemical structure can promote this heat abstractor 100.
See also Fig. 1 and Fig. 4, this radiating fin group 20 is installed on the cover plate 12 of substrate 10.Above-mentioned radiating fin group 20 comprises some radiating fins that mutually combine 21.These radiating fins 21 are parallel to each other, interval and vertically arranging.Form a gas channel 22 between every adjacent two radiating fins 21.The cover plate 12 of the bottom surface of described radiating fin group 20 and this substrate 10 fits.Offer the perforation 211 that runs through this radiating fin group 20 on the described radiating fin group 20.Described perforation 211 is extended along the direction perpendicular to radiating fin group 20.In the present embodiment, the quantity of described perforation 211 is two, and this two perforation 211 parallels, the interval, and arranges near the top of radiating fin group 20, in order to the condensation end 142 of accommodating this heat pipe 14.Be appreciated that ground, the position of offering of described perforation 211 can be according to the actual conditions needs and difference.The side opening of described radiating fin group 20 is provided with open slot 212.Described open slot 212 is extended to the bottom surface of radiating fin group 20 by the end of described perforation 211.In the present embodiment, the quantity of described open slot 212 is two, and this two open slot 212 is arranged at respectively the relative two sides of radiating fin group 20.Described open slot 212 is corresponding with the linkage section 143 of this heat pipe 14 in position in the opening part of radiating fin group 20 bottom surfaces, with the linkage section 143 of accommodating this heat pipe 14.
During assembling, with the be sticked bottom surface of this radiating fin group 20 of cover plate 12, the condensation end 142 of a heat pipe 14 is wherein worn in the perforation 211 of this radiating fin group 20, and the linkage section 143 that makes this heat pipe 14 is contained in the corresponding open slot 212 and wears the breach 121 of this cover plate 12, then the condensation end 142 of another heat pipe 14 is worn in another perforation 211 of this radiating fin group 20, make simultaneously the linkage section 143 of this heat pipe 14 be contained in another corresponding open slot 212 and wear another breach 121 of this cover plate 12.Then strutting piece 13 is fitted in the both sides of the edge without sidewall of this base plate 11, and the through hole 133 on the strutting piece 13 is aimed at respectively with the through hole 113 on the base plate 11.The evaporation ends 141 of this heat pipe 14 conformed on this base plate 11 and with this strutting piece 13 parallel.Make the evaporation ends 141 of this heat pipe 14 be fixed in this base plate 11, can adopt welding or with modes such as the bonding connections of heat-conducting glue.Through hole 113 on cover plate 12 and the base plate 11 is all aimed at the through hole 133 on the strutting piece.The mode that adopts screw to connect wears successively through hole 113, through hole 123 and through hole 133 with each screw, thereby cover plate 12, base plate 11 is connected to form described substrate 10.
The heat that this heat abstractor 100 produces main heat-generating electronic elements conducts to the evaporation ends 141 of heat pipe 14 by the base plate of substrate 10, conduct to condensation end 142 by evaporation ends 141 again, make simultaneously heat conduct to rapidly cover plate 12, then outwards distribute by radiating fin group 20.By heat pipe 14, cover plate 12 contacts with the direct of radiating fin group 20, enlarge active surface, thereby promote the radiating efficiency of this heat abstractor 100, because these substrate 10 main cover plates 12 by slimming, base plate 11 and strutting piece 13 jointly enclose assembling and form, make the integral thickness of this substrate 10 thinner, more save material, adapt to the trend of advocating at present environmental protection and energy saving, the heat pipe 14 that employing has a U-shaped evaporation ends 141 Temperature Distribution on the balanced base plate 11 of not only can trying one's best, can also be to the linkage section 143 that is inclined upwardly and extends, condensation end 142 plays stable center of gravity, supporting role, the reliability of increase heat abstractor 100.In addition, this strutting piece 13 is located between cover plate 12 and the base plate 11, thereby makes this substrate 10 have high intensity and reliability.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.

Claims (9)

1. heat abstractor, comprise substrate and be located at radiating fin group on the substrate, this substrate comprises base plate, cover plate and be held on base plate, strutting piece between the cover plate, this base plate, the common cavity that forms of cover plate and strutting piece, it is characterized in that: this heat abstractor comprises the heat pipe that wore cover plate, described heat pipe comprises the U-shaped evaporation ends, condensation end and connect the linkage section of this evaporation ends and condensation end, this U-shaped evaporation ends is contained in this cavity, this condensation end is placed through in the radiating fin group, and the plane that this condensation end and linkage section form and the plane at this U-shaped evaporation ends place are non-zero included angle.
2. heat abstractor as claimed in claim 1, it is characterized in that: the marginal portion of described base plate and cover plate is provided with through hole, this strutting piece is provided with the perforation corresponding with described through hole, and described base plate, strutting piece and cover plate are connected and fixed via the connector that wore described through hole and perforation.
3. heat abstractor as claimed in claim 1, it is characterized in that: described cover plate is offered breach, and this heat pipe stretches out in the cavity via this breach and is connected with this radiating fin group.
4. heat abstractor as claimed in claim 1, it is characterized in that: this strutting piece comprises the first support and the second support that is parallel to each other, described the first support and the second support are positioned at the relative both sides of heat pipe.
5. heat abstractor as claimed in claim 1, it is characterized in that: the quantity of described heat pipe is 2, the U-shaped opening of these two heat pipes arranges in the opposite direction.
6. heat abstractor as claimed in claim 5 is characterized in that: the linkage section of two heat pipes from two U-shaped evaporation ends mutually close end upwards bending extend, and to mutually away from direction tilt.
7. heat abstractor as claimed in claim 1 is characterized in that: this radiating fin group comprises the radiating fin that some spaces arrange, and described radiating fin is positioned at the upper surface that this cover plate is not provided with the part of through hole.
8. heat abstractor as claimed in claim 1, it is characterized in that: offer the perforation that runs through this radiating fin group on the described radiating fin group, the condensation segment of described heat pipe is placed through in this perforation.
9. heat abstractor as claimed in claim 1, it is characterized in that: the side opening of described radiating fin group is provided with open slot, and described open slot extends to bottom surface with the radiating fin group from the end of boring a hole, and the linkage section of described heat pipe is placed in the open slot.
CN201110232274XA 2011-08-15 2011-08-15 Heat dissipation device Pending CN102938995A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201110232274XA CN102938995A (en) 2011-08-15 2011-08-15 Heat dissipation device
US13/337,061 US20130043006A1 (en) 2011-08-15 2011-12-24 Heat disspation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110232274XA CN102938995A (en) 2011-08-15 2011-08-15 Heat dissipation device

Publications (1)

Publication Number Publication Date
CN102938995A true CN102938995A (en) 2013-02-20

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US (1) US20130043006A1 (en)
CN (1) CN102938995A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI817573B (en) * 2022-06-21 2023-10-01 艾姆勒科技股份有限公司 Two-phase immersion-cooling heat-dissipation structure with high density fins

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CN105258539B (en) * 2015-10-09 2018-07-31 东莞汉旭五金塑胶科技有限公司 Radiator
USD805042S1 (en) * 2015-10-27 2017-12-12 Tsung-Hsien Huang Combined heat exchanger base and embedded heat pipes
JP6407214B2 (en) * 2016-08-02 2018-10-17 株式会社ソニー・インタラクティブエンタテインメント Electronics
TWI604782B (en) * 2016-12-09 2017-11-01 Cooler Master Tech Inc Heat pipe side-by-side heat sink and its production method
USD924186S1 (en) * 2020-03-09 2021-07-06 Cambricon Technologies Corporation Limited Board card

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CN101039571B (en) * 2006-03-16 2010-07-28 富准精密工业(深圳)有限公司 Heat radiator and base holder thereof
US7753109B2 (en) * 2007-05-23 2010-07-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
CN101528018A (en) * 2008-03-07 2009-09-09 富准精密工业(深圳)有限公司 Heat radiating device and manufacturing method thereof
CN101621907B (en) * 2008-07-04 2012-03-21 富准精密工业(深圳)有限公司 Heat sink
US7679912B1 (en) * 2008-12-07 2010-03-16 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having heat pipe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI817573B (en) * 2022-06-21 2023-10-01 艾姆勒科技股份有限公司 Two-phase immersion-cooling heat-dissipation structure with high density fins

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Application publication date: 20130220