US7372132B2 - Resin encapsulated semiconductor device and the production method - Google Patents
Resin encapsulated semiconductor device and the production method Download PDFInfo
- Publication number
- US7372132B2 US7372132B2 US11/062,867 US6286705A US7372132B2 US 7372132 B2 US7372132 B2 US 7372132B2 US 6286705 A US6286705 A US 6286705A US 7372132 B2 US7372132 B2 US 7372132B2
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- United States
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- circuit board
- semiconductor device
- base plate
- plate
- resin encapsulated
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 110
- 239000011347 resin Substances 0.000 title claims abstract description 67
- 229920005989 resin Polymers 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 62
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 50
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000002923 metal particle Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 96
- 239000002245 particle Substances 0.000 abstract description 26
- 230000005855 radiation Effects 0.000 abstract description 13
- 238000005476 soldering Methods 0.000 abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 239000006071 cream Substances 0.000 abstract description 4
- 229920001296 polysiloxane Polymers 0.000 abstract description 4
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract description 3
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 abstract description 3
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 55
- 230000000052 comparative effect Effects 0.000 description 25
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 24
- 238000000034 method Methods 0.000 description 16
- 230000006837 decompression Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 10
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- 230000008859 change Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
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- 238000004299 exfoliation Methods 0.000 description 4
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- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
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- 241001481828 Glyptocephalus cynoglossus Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
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- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
Description
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004073305A JP3988735B2 (en) | 2004-03-15 | 2004-03-15 | Semiconductor device and manufacturing method thereof |
JP2004-073305 | 2004-03-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050221538A1 US20050221538A1 (en) | 2005-10-06 |
US7372132B2 true US7372132B2 (en) | 2008-05-13 |
Family
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US11/062,867 Active 2026-01-29 US7372132B2 (en) | 2004-03-15 | 2005-02-23 | Resin encapsulated semiconductor device and the production method |
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US (1) | US7372132B2 (en) |
JP (1) | JP3988735B2 (en) |
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US20090039498A1 (en) * | 2007-08-06 | 2009-02-12 | Infineon Technologies Ag | Power semiconductor module |
US20100065962A1 (en) * | 2007-08-06 | 2010-03-18 | Infineon Technologies Ag | Power semiconductor module |
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Also Published As
Publication number | Publication date |
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DE102005008491A1 (en) | 2005-11-03 |
JP2005260181A (en) | 2005-09-22 |
DE102005008491B4 (en) | 2009-08-20 |
US20050221538A1 (en) | 2005-10-06 |
JP3988735B2 (en) | 2007-10-10 |
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