US6737581B2 - Configuration of a plurality of circuit modules - Google Patents

Configuration of a plurality of circuit modules Download PDF

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Publication number
US6737581B2
US6737581B2 US09/858,421 US85842101A US6737581B2 US 6737581 B2 US6737581 B2 US 6737581B2 US 85842101 A US85842101 A US 85842101A US 6737581 B2 US6737581 B2 US 6737581B2
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Prior art keywords
circuit modules
configuration according
connecting elements
region
circuit
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US09/858,421
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US20020050376A1 (en
Inventor
Jürgen Högerl
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Polaris Innovations Ltd
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Infineon Technologies AG
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Assigned to INFINEON TECHNOLOGIES AG reassignment INFINEON TECHNOLOGIES AG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: QIMONDA AG
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    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the invention relates to a configuration of a plurality of circuit modules disposed essentially one above the other approximately in the form of a stack.
  • a respective connecting device is provided for the external electrical bonding of the circuit modules.
  • An electrical connection is at least partially provided between the connecting devices of the circuit modules, and an electrical connection of various connecting devices among one another is respectively formed by essentially direct mechanical and electrical contact of various connecting devices.
  • circuit engineering In circuit engineering, and, in particular, in semiconductor electronics, it has for some time been endeavored to construct circuit configurations that realize as high a number of components and/or circuit functions as possible in the smallest space. It is accordingly endeavored to keep reducing the size of the corresponding components and circuit functions within the bounds of physical possibilities. Because, in the endeavor, it is not possible to go below certain physical limits, it must be expected that, for each electronic component, there will be a minimum size, based on physical principles, but, under certain circumstances, the minimum size can only be realized in mass production with considerable expenditure in terms of cost.
  • the connecting devices necessary in each case for the external electrical bonding of the respective circuit modules must also be at least partially electrically and electronically connected to one another by a plurality of connecting elements, i.e., the initially electrically isolated circuit modules must be interconnected by connecting devices that have to be provided.
  • Various concepts for the interconnection have been proposed to interconnect the connecting devices of the respective circuit modules.
  • the prior art includes, for example, a positioning of circuit modules of various sizes one above the other so that a frustopyramidal structure of circuit modules decreasing in their base area in the vertical direction from the bottom upward is produced and is then disposed as a stack on a corresponding carrier. For interconnection, corresponding wire bonds are then individually led down from each circuit module onto the surface of the common carrier, where the actual electrical bonding with the outside and among the modules is then realized on a corresponding conductive substrate.
  • One disadvantage of such a procedure is that circuit modules of different sizes, i.e., base areas, have to be configured, resulting in a problematical combination of identical modules.
  • Another disadvantage is that respective individual wire bonds have to be formed and pulled, which, although it does not preclude automation of the bonding, makes such an automatic process difficult.
  • circuit modules of an identical size are stacked one above the other, the interconnection of the circuit modules lying at the top by corresponding wire bonds is necessary even if the circuit module disposed at the very bottom can be attached and bonded on the common carrier, for example, by flip-chip technology.
  • U.S. Pat. No. 5,016,138 to Woodman discloses a configuration of a plurality of circuit modules in which the circuit modules are disposed essentially one above the other, for instance, in a stack.
  • a connecting device with a plurality of connecting elements is provided for the external bonding of the circuit modules.
  • the connecting device is realized by respectively disposing the individual chips on a separate carrier, on which the contacts of the chips are then led out through a printed-on circuit configuration to the margin of the carrier, to corresponding contact pins that are disposed in the edge region of the carrier.
  • the respective entireties of contact pins are then electrically bonded and interconnected by a plurality of bonding and interconnecting plates reaching laterally around the stack.
  • a disadvantage of such a procedure is that each circuit module must, in turn, be placed on a carrier and that the interconnection of the various carriers necessitates the assembly of a multiplicity of individual components because an inherent interconnection of modules is not possible here on account of their natural construction.
  • a circuit configuration including a connection carrier, circuit modules disposed essentially one above another approximately in a stack, each of the circuit modules having a connecting device for externally and electrically bonding the circuit modules, the connecting device having at least one series configuration of connecting elements disposed essentially in a plane, the connecting elements disposed on the connection carrier, and the connecting device of at least one of the circuit modules at least partially electrically connected to another connecting device of at least one different one of the circuit modules in direct mechanical and electrical contact.
  • the circuit modules are disposed essentially one above the other approximately in the form of a stack.
  • a connecting device with a plurality of connecting elements is provided for the external electrical bonding of the circuit modules.
  • An electrical connection is at least partially provided between the connecting devices of the circuit modules.
  • the configuration according to the invention of a plurality of circuit modules is characterized in that an electrical connection of various connecting devices among one another is respectively formed by essentially direct mechanical and electrical contact between connecting elements of various connecting devices.
  • the configuration according to the invention of a plurality of circuit modules is made particularly advantageous if the connecting elements have the same form or have essentially the same effect with regard to their geometrical, mechanical and/or electrical properties. Specifically when essentially coinciding circuit modules are used, it is appropriate for all the connecting elements that form the connecting device of the respective circuit modules to be identically configured, which allows for a mass production process.
  • the connecting elements are fixed on the connection carrier.
  • the connecting elements are preferably configured as a connecting wire, which is formed, in particular, with an essentially linear extent.
  • a connecting element in the form of a connecting wire, all the distances, for example from a contact region on any face of the circuit module to its margin, can be bridged in a simple way.
  • connecting wires have particularly favorable properties with regard to their dimensional stability and mechanical durability. They are simple to produce, can be easily shaped, and are, nevertheless, resistant enough to be used in an automatic assembly and component-insertion machine.
  • the connecting elements each have a first end for the electrical bonding to a respective circuit module. Furthermore, a second end is provided, which may serve if appropriate for the electrical bonding to at least one other connecting element of another circuit module. Furthermore, the connecting element, in particular, the connecting wire, has a main region, which extends between the first end and the second end of the connecting element and which covers, in particular, the distance between the regions to be bonded.
  • a particularly simple geometrical configuration provides that the second ends of the connecting elements, in particular, the connecting wires, each have a region extending essentially linearly and/or essentially perpendicularly in relation to the main region.
  • the connecting elements in particular, the connecting wires, preferably have essentially the form of a hook, in particular, an elongated hook, an “L”, a claw or the like.
  • a kind of shoulder or the like it is preferred in such case for a kind of shoulder or the like to be respectively formed in a transitional region between the main region of the connecting element and the first and/or second end of the connecting element.
  • a contact with the circuit module to be interconnected can be established and, on the other hand, an interconnection with vertically neighboring circuit modules can be realized in a particularly simple way.
  • the connecting element, the shoulders, and, in particular, the second end region of the connecting elements are suitable for forming a contact with other connecting elements.
  • the connecting elements of the configuration according to the invention of a plurality of circuit modules are each flexibly resilient, in particular, in the region of the second ends. The resiliency allows the connecting elements to take up the tolerances during the positioning, and the resultant mechanical damage, without defects occurring in the connecting elements themselves or at the contact points.
  • a configuration according to the invention of a plurality of circuit modules is advantageously formed specifically by configuring each of the circuit modules in essentially the same form and/or to have essentially the same effect with regard to their geometrical, mechanical and/or electrical, especially electronic, properties.
  • the circuit modules are preferably each configured such that they are essentially of a flat, laminar, or similar form and/or essentially planar, with an upper side and an underside in each case. Such configuration likewise permits a particularly high packing density, which can then be achieved in a simple way, in particular, within an automatic production process.
  • the circuit modules preferably have in each case at least one semiconductor chip, in particular, a memory device, and/or they are configured as such a device.
  • the stacking of memory elements one above the other has the enormous advantage that the electronic similarity of essentially identical circuit modules can be utilized. Achievement of the highest possible utilization of the wiring surface area is also necessary and desirable in the case of memory devices. Such utilization can be achieved in a simple way based on the configuration according to the invention of a plurality of circuit modules.
  • the circuit modules For the electrical bonding of the circuit modules to their connecting devices, in particular, to the respective connecting elements, the circuit modules have in each case at least one contact region, which is provided, in particular, with a plurality of contacts for the external electrical bonding.
  • these contacts are generally realized by what are referred to as pads, which specifically realize the contact point of the internal semiconductor structure with the outside world.
  • the connecting elements of the connecting device of a circuit module in particular, the first ends thereof, are electrically bonded in each case to the contacts of the contact region of the respective circuit module.
  • the contacts are preferably formed by metallic regions on the circuit modules, to be precise, preferably on their underside and, in particular, by pads, as they are known.
  • the contact regions are in each case formed on an underside of the circuit module, in an essentially central region thereof in each case.
  • CPC center pad chips
  • the connecting device has least one series configuration of, in particular, equidistantly spaced-apart, parallel, and/or flush aligned and/or similarly oriented connecting elements, which are preferably aligned along at least one edge region of the respective circuit module. It is, thus, of particular advantage that, for example, connecting wires of the same form and length are disposed such that they are aligned parallel to one another and flush—in the manner of a comb.
  • the connecting device prefferably has two series configurations of connecting elements and for the series configurations, in particular, the connecting elements thereof, to be disposed in each case such that they laterally coincide with one another or are staggered in relation to one another.
  • the series configurations preferably lie essentially in a common plane and are disposed essentially mirror-symmetrically in relation to an axis lying in the plane.
  • the construction achieves the effect that the two series configurations of connecting elements are opposite each other such that the first ends respectively of the connecting elements of the series are facing one another and that the second ends—for the external electrical bonding—are in each case furthest away from one another.
  • allowance can be made for the respective configuration of the contacts on the underside of the circuit module.
  • the connecting elements or connecting wires form, for example, bonding legs, which in a coinciding configuration are aligned essentially in a co-linear manner.
  • each of the series configurations extends for example along one edge of the associated circuit module, with the result that two opposite edges remain free, while the two series configurations of connecting elements run at least partially along the two other opposite edges of the circuit module.
  • the connecting device has in each case four series configurations of connecting elements. These four series configurations are respectively disposed essentially along at least one edge region and lie in pairs opposite one another.
  • the configuration achieves the effect, for example in the case of a circuit module with a square or rectangular base area, that a series of connecting elements extends in each case along an edge of the circuit module. Accordingly, a particularly high number of connecting devices can be formed.
  • the plurality of series configurations in particular, the connecting elements thereof, lie essentially in a common plane. It is also provided that the series configurations lying respectively opposite one another, in particular, the connecting elements thereof, are aligned mirror-symmetrically in relation to an axis in the plane. The individual connecting elements of the opposite series configurations are then again aligned in a co-linear or coinciding manner or the connecting elements are staggered in relation to one another.
  • the series configurations can indeed be formed in each case by individual and separate connecting elements.
  • the series configurations are advantageously formed in each case by an assembly of connecting elements that are disposed on a connection carrier and/or are fixed there.
  • an adhesive or adhesively bonding medium in particular, a double-sided adhesive medium, may be formed as the connecting carrier, in particular, as a tape.
  • the individual connecting elements are then able, in particular, to be applied and/or embedded there.
  • a kind of double-sided adhesive tape or a corresponding embedding or adhesive bonding compound can be envisaged.
  • the series configurations of circuit modules provided directly one above the other have at least partially essentially vertically coinciding connecting elements. Consequently, the directly neighboring connecting elements of the circuit modules disposed directly one above the other can be brought into contact with one another in a particularly simple way to bring about an interconnection of the circuit modules.
  • a connecting element of a first circuit module that is disposed vertically higher in each case is to be electrically bonded by its second end in the region of a shoulder or of the second end of the respective vertically coinciding connecting element of the second circuit module disposed directly vertically thereunder.
  • the construction is realized in a particularly simple way, in particular, by forming the mechanical and electrical contact of the connecting elements by soldering, welding, in particular, laser welding, and/or based on a force closure with spring pretensioning in the region of the second ends of the connecting elements.
  • a carrier is provided, on which is disposed, fixed, and/or electrically bonded the lowermost of the circuit modules.
  • a housing device is formed, in particular, in the form of a casting compound, in which at least the circuit modules can be accommodated.
  • circuit modules provided in the prior art has the disadvantage that compromises have to be made with regard to the circuit modules to be used, or else require a considerable expenditure for the connection of the circuit modules to one another.
  • spacing elements there are provided spacing elements, with respective spacing elements provided between every adjacent pair of the circuit modules.
  • the spacing elements remove heat from the circuit modules, preferably, the spacing elements are heat sinks.
  • FIG. 1 is a cross-sectional view of one circuit module for use in a plurality of circuit modules according to the invention
  • FIG. 2 is a fragmentary, diagrammatic, bottom plan view of the circuit module of FIG. 1;
  • FIG. 3 fragmentary, diagrammatic, bottom plan view of an alternative embodiment of the circuit module of FIG. 1;
  • FIG. 4 is a diagrammatic side view of a connecting element for use in an exemplary embodiment of the plurality of circuit modules according to the invention
  • FIG. 5 is a perspective view of an underside of the circuit module of FIG. 1;
  • FIG. 6 is a cross-sectional view of exemplary embodiment of a configuration of a plurality of circuit modules according to the invention.
  • FIG. 1 there is shown, in a schematic and partly sectional side view, a circuit module 2 , as it is used in an exemplary embodiment of the configuration according to the invention of a plurality of circuit modules 2 .
  • the circuit module 2 essentially includes a chip 20 , which may, for example, also be cast into a corresponding substrate.
  • the circuit module 2 has essentially a flat, plate-like and cuboidal shape and has edge or side regions 11 a and 11 b . While the upper side 2 b of the circuit module 2 remains free, the connecting device 5 for external electrical bonding is formed on the underside 2 a of the circuit module. See FIG. 2 .
  • the connecting device 5 includes two series configurations 10 a and 10 b of connecting elements 6 formed on a respective connection carrier 12 .
  • the connecting elements 6 respectively have a main region 9 , a first end region 7 and a second end region 8 .
  • the end regions 7 are formed, respectively, for being connected to a contact region 3 of the circuit module 2 and there, in particular, to contacts 4 .
  • the second ends 8 of the connecting elements 6 are intended for electrical bonding to other connecting elements 6 of other circuit modules 2 .
  • the connecting elements 6 respectively have a shoulder 8 a in the transitional region between the main region 9 and the second end 8 .
  • a shoulder region 7 a is also respectively provided in the transitional region between the main region 9 and the first end of the connecting element 6 .
  • a spacing element 22 is respectively formed on the underside 2 a of the circuit module 2 .
  • FIG. 2 the underside 2 a of the circuit module 2 shown in FIG. 1 is represented, with the spacing elements 22 omitted.
  • the contact region 3 Formed in a central region 2 c of the underside 2 a of the circuit module 2 is the contact region 3 , which has a plurality of contacts 4 . Extending from the contacts 4 are connecting elements 6 in the form of connecting wires 6 a, the connecting wires 6 a being electrically bonded by their first ends 7 to the contacts 4 . The wires 6 a then extend from the central region 2 c on the underside 2 a linearly toward the edge regions 11 a and 11 b , where they run out into their second ends 8 , which extend perpendicularly upward out of the plane of the drawing.
  • the connecting elements 6 or the connecting wires 6 a of the connecting devices 5 that belong to the edge regions 11 a and 11 b of the circuit module 2 are respectively constructed as series configurations 10 a , 10 b , disposed in a staggered and flush manner.
  • the connecting wires 6 a run alternately outward to the right or outward to the left to the edge region 11 b or 11 a of the circuit module 2 .
  • FIG. 3 illustrates that the connecting elements 6 or 6 a of the series configurations 10 a and 10 b may also be aligned in a coinciding manner, where two adjacent series of contacts 4 are provided in the central region 2 c of the underside 2 a of the circuit module 2 , in the contact region 3 of the circuit module 2 .
  • FIG. 3 is identical to the construction shown in FIG. 2 .
  • FIG. 4 schematically illustrates a partly sectional side view of a connecting element 6 or a connecting wire 6 a as it is used in the circuit module 2 shown in FIG. 1 for the external electrical bonding of circuit modules 2 to one another.
  • a linearly extending main region 9 essentially forms the connecting wire 6 a or the connecting element 6 .
  • the connecting wire 6 a has a first end 7 , which leaves the main region 9 of the connecting wire 6 a from a first shoulder region 7 a .
  • Formed opposite the first end 7 is a second end 8 , which leaves the main region 9 of the connecting wire 6 a from a second shoulder region 8 a .
  • the second end 8 a is formed by an essentially linear wire portion, which is essentially formed perpendicularly in relation to the main region 9 of the connecting wire 6 a .
  • the connecting wire 6 a has, in the exemplary embodiment, essentially the form of an elongated hook, a claw, or an “L”.
  • circuit module 2 from FIG. 1 is represented in FIG. 5 in a perspective view from below, with one of the spacing elements 22 having been omitted for clarity.
  • the circuit module 2 in turn, includes a circuit configuration 20 , which, if appropriate, is accommodated in a corresponding casting compound.
  • the upper side of the circuit configuration 20 consequently, also forms the upper side 2 b of the circuit module 2 .
  • the underside 2 a of the circuit module 2 is essentially formed by the connecting device 5 , which has two series configurations 10 a , 10 b of connecting elements 6 or connecting wires 6 a.
  • the connecting elements 6 or connecting wires 6 a have, in turn, the form of an elongated hook or a claw or an “L”, a linearly extending main region 9 with a first end 7 and a second end 8 .
  • the plurality of connecting elements 6 or connecting wires 6 a of the two series configurations 10 a , 10 b are staggered, offset with respect to one another, and run with their first ends 7 in the region of the contacts 4 of the contact region 3 in the central region 2 c of the underside 2 a of the circuit module 2 perpendicularly toward the marginal regions 11 a , 11 b of the circuit module 2 .
  • the second ends 8 of the connecting elements 6 or the connecting wires 6 a are then essentially formed at the marginal regions 11 a and 11 b of the circuit module 2 .
  • the second ends 8 which are essentially disposed perpendicularly on the main regions 9 of the connecting wires 6 a , are aligned such that they point away from the circuit configuration 20 and the upper side or surface 2 b of the circuit module 2 .
  • a spacing element 22 is provided respectively, covering the series configuration 10 a or 10 b from the underside.
  • the series configurations 10 a , 10 b are disposed respectively on a connection carrier 12 , for example, in the form of a flex tape, and are attached there.
  • FIG. 6 shows a schematic and partly sectional side view of an exemplary embodiment of the configuration according to the invention of a plurality of circuit modules.
  • circuit modules 2 of identical geometrical construction are disposed one above the other on a carrier 14 .
  • the circuit modules 2 are separated from one another and from the carrier 14 by correspondingly provided spacing elements 22 .
  • Each of the circuit modules 2 has a circuit configuration 20 , which may be embedded in a corresponding casting compound.
  • the upper side 2 b of a circuit module 2 that is disposed lower in the vertical alignment is respectively in contact with the underside 2 a of the circuit module 2 following upward in the vertical direction.
  • the lowermost circuit module 2 rests with its underside 2 a or the corresponding spacing elements 22 on the upper side of the carrier 14 and is electrically bonded there.
  • the upper side 2 b of the uppermost circuit module 2 remains free or is in direct contact with the housing material of the housing device 15 .
  • the spacing elements 22 may serve additionally for removing heat from the circuit modules 2 stacked one above the other. For heat removal purposes, they are then formed from a material enhancing heat transport and, to increase the size of their surface area, preferably extend beyond the edge regions, which are not occupied by contact elements.
  • the connecting elements 6 or connecting wires 6 a of a circuit module 2 disposed at the top in the vertical direction are in mechanical and electrical contact by their second ends 8 with the connecting devices 6 or connecting wires 6 a of the circuit module 2 respectively disposed directly thereunder in the vertical direction, to be precise, in particular, in what are referred to as the shoulder regions 8 a of the connecting elements 6 or connecting wires 6 a .
  • the connecting wires 6 a or connecting elements 6 of the circuit module 2 disposed at the very bottom are then attached and electrically bonded directly on the carrier 14 and, consequently, realize the external connection, for example, in a higher-level circuit device or application.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Multi-Conductor Connections (AREA)
US09/858,421 2000-05-16 2001-05-16 Configuration of a plurality of circuit modules Expired - Lifetime US6737581B2 (en)

Applications Claiming Priority (3)

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DE10023869 2000-05-16
DE10023869.6 2000-05-16
DE10023869A DE10023869C2 (de) 2000-05-16 2000-05-16 Anordnung einer Mehrzahl von Schaltungsmodulen

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US20120135567A1 (en) * 2004-08-25 2012-05-31 Micron Technology, Inc. Methods and apparatuses for transferring heat from stacked microfeature devices

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DE10023869C2 (de) 2002-09-26
KR100538524B1 (ko) 2005-12-23
KR20010106254A (ko) 2001-11-29
DE10023869A1 (de) 2002-01-17
US20020050376A1 (en) 2002-05-02
EP1156529A2 (de) 2001-11-21
EP1156529A3 (de) 2004-09-29
TW521544B (en) 2003-02-21
JP2002016218A (ja) 2002-01-18

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