US6362108B1 - Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant - Google Patents
Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant Download PDFInfo
- Publication number
- US6362108B1 US6362108B1 US09/553,037 US55303700A US6362108B1 US 6362108 B1 US6362108 B1 US 6362108B1 US 55303700 A US55303700 A US 55303700A US 6362108 B1 US6362108 B1 US 6362108B1
- Authority
- US
- United States
- Prior art keywords
- composition
- colloidal silica
- chemical polishing
- mechanical chemical
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 48
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- 239000000126 substance Substances 0.000 title claims abstract description 25
- 229920000642 polymer Polymers 0.000 title claims abstract description 21
- 239000011810 insulating material Substances 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000008119 colloidal silica Substances 0.000 claims abstract description 46
- 239000007900 aqueous suspension Substances 0.000 claims abstract description 26
- 239000002245 particle Substances 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 22
- 239000000725 suspension Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- -1 aluminium hydroxychloride Chemical compound 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 238000005299 abrasion Methods 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- CFAKWWQIUFSQFU-UHFFFAOYSA-N 2-hydroxy-3-methylcyclopent-2-en-1-one Chemical compound CC1=C(O)C(=O)CC1 CFAKWWQIUFSQFU-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000001837 2-hydroxy-3-methylcyclopent-2-en-1-one Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000005376 alkyl siloxane group Chemical group 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 1
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Definitions
- the present invention relates to a composition for mechanical chemical polishing of a layer in an insulating material based on a polymer with a low dielectric constant.
- each metallic interconnecting level must be electrically insulated. To this end, each level is encapsulated in a dielectric layer.
- the interconnecting metallic tracks of integrated circuits are most often made by metal reactive ionic etching according the following sequence: an aluminium or aluminium alloy film approximately 10 ⁇ 12 m thick is deposited by means of a beam of electrons or beam of ions (sputtering); the design of the interconnecting circuit is then transferred there by photolithography then by reactive ionic etching (RIE).
- RIE reactive ionic etching
- the tracks thus defined are then covered with a dielectric layer, usually based on silicon oxide, most often obtained by decomposition in the vapour phase of tetraethylorthosilicate (TEOS). This layer is then planarized by mechanical chemical polishing.
- fluorinated poly(arylethers) such as Flare®
- poly(arylethers) such as PAE-2,
- poly(p-xylylene) such as Parylene® N and poly( ⁇ , ⁇ , ⁇ ′, ⁇ ′-tetrafluoro-p-xylylene) such as Parylene® F,
- aromatic hydrocarbons such as SiLK®.
- these polymers with a low dielectric constant must in the main satisfy the following criteria:
- the polymer layer deposited must then be able to be planarized by mechanical chemical polishing.
- a subject of the present Application is therefore a composition for mechanical chemical polishing of a layer in an insulating material based on a polymer with a low dielectric constant, characterized in that said polishing composition comprises an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles, not linked to each other by siloxane bonds and water as the suspension medium.
- acid aqueous suspension of cationized colloidal silica is meant an acid aqueous suspension of colloidal silica surface modified by tri- or tetravalent metal oxides such as aluminium, chromium, gallium, titanium or zirconium and which are in particular described in the book “The Chemistry of Silica—R. K. Iler-Wiley Interscience (1979)” p. 410-411.
- the acid aqueous suspension of cationized colloidal silica containing colloidal silica particles, not linked to each other by siloxane bonds is obtained from a solution of aluminium hydroxychloride at approximately 50% by weight in which an alkaline silica sol stabilized with sodium and at a pH of about 9 is introduced under agitation.
- an alkaline silica sol stabilized with sodium and at a pH of about 9 is introduced under agitation.
- insulating material based on a polymer with a low dielectric constant of SiLK® type is meant a material as described by PH. Towsend et al in Mat. Res. Soc. Symp. Proc. 1997, 476, p. 9-17. This material is constituted by an oligomeric solution with a viscosity of 30 centipoises the polymerization of which does not require a catalyst and does not lead to the formation of water.
- the polymerized network is an aromatic hydrocarbon which does not contain fluorine. Its dielectric constant is 2.65, its glass transition temperature is greater than 490° C. and its refractive index is 1.63.
- the aforementioned aqueous suspension of colloidal silica is cationized by tri- or tetravalent metal oxides such as aluminium, chromium, gallium, titanium or zirconium and quite particularly aluminium.
- the above composition for mechanical chemical polishing will have a pH comprised between 1 and 6, preferably between 2 and 4.
- the above polishing composition contains cationized colloidal silica particles, not linked to each other by siloxane bonds, with a diameter comprised between 3 and 250 nanometers, preferably between 10 and 50 nanometers.
- a subject of the present invention is also a process for mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant in which abrasion of said layer of insulating material is carried out by rubbing said layer using a fabric containing an abrasive, characterized in that the abrasive contains an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles, not linked to each other by siloxane bonds, and water as the suspension medium.
- a subject of the present invention is also an abrasive which is useful in particular for mechanical chemical polishing of a layer of insulating material based on a polymer with a low dielectric constant, comprising a fabric impregnated with an acid aqueous suspension of cationized colloidal silica containing individualized colloidal silica particles, not linked to each other by siloxane bonds, with a diameter comprised between 3 and 250 nanometers, with a pH comprised between 1 and 6, and water as the suspension medium.
- the abrasive composition 1 is constituted by an acid aqueous suspension of colloidal silica, containing colloidal silica particles not linked to each other by siloxane bonds, and cationized by aluminium hydroxychloride described previously which has the following characteristics:
- pH of the aqueous suspension 3.5
- An abrasive composition 1 according to the invention is obtained.
- a deposit of SiLK® of 10000 ⁇ thickness is carried out by centrifugation on 200 mm diameter slices of silicon. Then the layer is polymerized during a post-curing at 450° C.
- the slices are then polished on a PRESI 2000 polisher under the following polishing conditions:
- the polishing speed and the non-uniformity are determined by measuring the thickness of SiLK® using an ellipsometer before and after polishing, at 17 points of the slice.
- This abrasive composition 1 allows the following results to be obtained:
- the abrasive composition 2 is similar to abrasive composition 1, but at a concentration by weight of colloidal silica of 15%.
- An abrasive composition 2 according to the invention is obtained.
- this abrasive composition 2 allows the following results to be obtained:
- the abrasive composition 3 is constituted by an acid aqueous suspension of colloidal silica, containing colloidal silica particles not linked to each other by siloxane bonds, and cationized by aluminium hydroxychloride described previously which has the following characteristics:
- pH of the aqueous suspension 3.5
- An abrasive composition 3 according to the invention is obtained.
- this abrasive composition 3 allows the following results to be obtained:
- the abrasive composition is constituted by an acid aqueous suspension of colloidal silica, containing colloidal silica particles not linked to each other by siloxane bonds, the characteristics of which are the following:
- this abrasive composition produced the following result:
- This low speed forbids the use of this composition for the polishing of layers based on a polymer with a low dielectric constant.
- the abrasive composition is constituted by a basic aqueous suspension of colloidal silica containing colloidal silica particles not linked to each other by siloxane bonds, the characteristics of which are the following:
- this abrasive composition produced the following result.
- This low speed forbids the use of this composition for the polishing of layers based on a polymer with a low dielectric constant.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Element Separation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9905123A FR2792643B1 (fr) | 1999-04-22 | 1999-04-22 | Composition de polissage mecano-chimique de couches en un materiau isolant a base de polymere a faible constante dielectrique |
| FR99-05123 | 1999-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US6362108B1 true US6362108B1 (en) | 2002-03-26 |
Family
ID=9544750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/553,037 Expired - Lifetime US6362108B1 (en) | 1999-04-22 | 2000-04-20 | Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant |
Country Status (17)
| Country | Link |
|---|---|
| US (1) | US6362108B1 (de) |
| EP (1) | EP1046690B1 (de) |
| JP (1) | JP3967522B2 (de) |
| KR (1) | KR100607919B1 (de) |
| CN (1) | CN1153823C (de) |
| AT (1) | ATE272100T1 (de) |
| CZ (1) | CZ300220B6 (de) |
| DE (1) | DE60012399T2 (de) |
| DK (1) | DK1046690T3 (de) |
| ES (1) | ES2223441T3 (de) |
| FR (1) | FR2792643B1 (de) |
| HU (1) | HU228376B1 (de) |
| ID (1) | ID25822A (de) |
| MY (1) | MY124983A (de) |
| PT (1) | PT1046690E (de) |
| SG (1) | SG83204A1 (de) |
| TW (1) | TW491886B (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030157034A1 (en) * | 2000-05-11 | 2003-08-21 | Weitao Jia | Dental acid etchant composition and method of use |
| US20030157804A1 (en) * | 2001-12-27 | 2003-08-21 | Lothar Puppe | Composition for the chemical mechanical polishing of metal and metal/dielectric structures |
| US20050026205A1 (en) * | 2001-10-26 | 2005-02-03 | Lothar Puppe | Method of polishing metal and metal/dielectric structures |
| TWI393771B (zh) * | 2006-07-21 | 2013-04-21 | Cabot Microelectronics Corp | 加強氧化物移除速率之鎵與鉻離子 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3899456B2 (ja) | 2001-10-19 | 2007-03-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
| FR2831179B1 (fr) | 2001-10-22 | 2005-04-15 | Rhodia Chimie Sa | Procede de preparation en milieu aqueux de compositions pigmentaires a base de silice |
| CN1705725A (zh) * | 2002-10-22 | 2005-12-07 | 皮斯洛奎斯特公司 | 化学机械抛光铜表面用的腐蚀延迟抛光浆液 |
| JP2005268667A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| US7052373B1 (en) * | 2005-01-19 | 2006-05-30 | Anji Microelectronics Co., Ltd. | Systems and slurries for chemical mechanical polishing |
| CN101077961B (zh) * | 2006-05-26 | 2011-11-09 | 安集微电子（上海）有限公司 | 用于精细表面平整处理的抛光液及其使用方法 |
| JP6878772B2 (ja) * | 2016-04-14 | 2021-06-02 | 昭和電工マテリアルズ株式会社 | 研磨剤、研磨剤用貯蔵液及び研磨方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5382272A (en) | 1993-09-03 | 1995-01-17 | Rodel, Inc. | Activated polishing compositions |
| EP0773270A2 (de) | 1995-11-10 | 1997-05-14 | Tokuyama Corporation | Poliersuspensionen und Verfahren zu ihrer Herstellung |
| US5885334A (en) * | 1996-05-15 | 1999-03-23 | Kabushiki Kaisha Kobe Seiko Sho | Polishing fluid composition and polishing method |
| US6043159A (en) | 1996-10-23 | 2000-03-28 | Clariant Chimie S.A. | Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon |
| US6046111A (en) * | 1998-09-02 | 2000-04-04 | Micron Technology, Inc. | Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates |
| EP1000995A1 (de) | 1998-11-09 | 2000-05-17 | Clariant (France) S.A. | Schleifmittelzusammensetzung zur Verwendung in der Elektronikindustrie |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2677646B2 (ja) * | 1988-12-26 | 1997-11-17 | 旭電化工業株式会社 | コロイダルシリカの製造方法 |
| FR2761629B1 (fr) * | 1997-04-07 | 1999-06-18 | Hoechst France | Nouveau procede de polissage mecano-chimique de couches de materiaux semi-conducteurs a base de polysilicium ou d'oxyde de silicium dope |
-
1999
- 1999-04-22 FR FR9905123A patent/FR2792643B1/fr not_active Expired - Lifetime
-
2000
- 2000-04-12 HU HU0001483A patent/HU228376B1/hu not_active IP Right Cessation
- 2000-04-18 SG SG200002196A patent/SG83204A1/en unknown
- 2000-04-18 MY MYPI20001633A patent/MY124983A/en unknown
- 2000-04-19 EP EP00810343A patent/EP1046690B1/de not_active Expired - Lifetime
- 2000-04-19 PT PT00810343T patent/PT1046690E/pt unknown
- 2000-04-19 DK DK00810343T patent/DK1046690T3/da active
- 2000-04-19 AT AT00810343T patent/ATE272100T1/de not_active IP Right Cessation
- 2000-04-19 ES ES00810343T patent/ES2223441T3/es not_active Expired - Lifetime
- 2000-04-19 DE DE60012399T patent/DE60012399T2/de not_active Expired - Lifetime
- 2000-04-20 US US09/553,037 patent/US6362108B1/en not_active Expired - Lifetime
- 2000-04-20 ID IDP20000313D patent/ID25822A/id unknown
- 2000-04-21 JP JP2000120314A patent/JP3967522B2/ja not_active Expired - Lifetime
- 2000-04-21 KR KR1020000021188A patent/KR100607919B1/ko active IP Right Grant
- 2000-04-21 TW TW089107528A patent/TW491886B/zh not_active IP Right Cessation
- 2000-04-21 CN CNB001180320A patent/CN1153823C/zh not_active Expired - Lifetime
- 2000-04-21 CZ CZ20001494A patent/CZ300220B6/cs not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5382272A (en) | 1993-09-03 | 1995-01-17 | Rodel, Inc. | Activated polishing compositions |
| EP0773270A2 (de) | 1995-11-10 | 1997-05-14 | Tokuyama Corporation | Poliersuspensionen und Verfahren zu ihrer Herstellung |
| US5885334A (en) * | 1996-05-15 | 1999-03-23 | Kabushiki Kaisha Kobe Seiko Sho | Polishing fluid composition and polishing method |
| US6043159A (en) | 1996-10-23 | 2000-03-28 | Clariant Chimie S.A. | Chemical mechanical polishing process for layers of isolating materials based on silicon derivatives or silicon |
| US6046111A (en) * | 1998-09-02 | 2000-04-04 | Micron Technology, Inc. | Method and apparatus for endpointing mechanical and chemical-mechanical planarization of microelectronic substrates |
| EP1000995A1 (de) | 1998-11-09 | 2000-05-17 | Clariant (France) S.A. | Schleifmittelzusammensetzung zur Verwendung in der Elektronikindustrie |
Non-Patent Citations (9)
| Title |
|---|
| Abstract for JP Patent No. 2172812 XP-002127019. |
| EPO Search Report. |
| G. R. Yang, Y.-P, Zhao, Jam M. Neirynck, Shyam P. Murarka, R. J. Gutmann, Journal of Electronic Materials, vol. 26, No. 8, 1997, pp. 935-940. |
| J. M. Neirynck, S. P. Muraraka, R. J. Gutmann, Materials Research Society Symposium Proceedings, (1995) vol. 381, pp. 229-235. |
| L. Peters, Semiconductor International -Sep. 1998, pp. 64-74. |
| N. H. Hendricks, Materials Research Society Symposium Proceedings, vol. 443, (1997) pp. 3-14. |
| P. H. Townsend, S. J. Martin, J. Godschalx, D. R. Romer, D. W. Smith, Jr., D. Castillo, R. DeVries, G. Buske, N. Rondan, S. Froelicher, J. Marshall, E. Q. Shaffer, J-H. Im, Materials Research Society Symposium Proceedings, 1997, vol. 476, pp. 9-17. |
| R. K. Iler, The Chemistry of Silica, A. Wiley-Interscience Publication (1979) pp. 410-411. |
| Y. L. Wang, C. Liu, S-T. Chang, M.-S. Tsai, M-S. Feng, W.-T Tseng, Thin Solid Films (1997) 308-309, pp. 550-554. |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030157034A1 (en) * | 2000-05-11 | 2003-08-21 | Weitao Jia | Dental acid etchant composition and method of use |
| US6753001B2 (en) * | 2000-05-11 | 2004-06-22 | Pentron Clinical Technologies, Llc | Dental acid etchant composition |
| US20050026205A1 (en) * | 2001-10-26 | 2005-02-03 | Lothar Puppe | Method of polishing metal and metal/dielectric structures |
| US20030157804A1 (en) * | 2001-12-27 | 2003-08-21 | Lothar Puppe | Composition for the chemical mechanical polishing of metal and metal/dielectric structures |
| TWI393771B (zh) * | 2006-07-21 | 2013-04-21 | Cabot Microelectronics Corp | 加強氧化物移除速率之鎵與鉻離子 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY124983A (en) | 2006-07-31 |
| EP1046690B1 (de) | 2004-07-28 |
| FR2792643B1 (fr) | 2001-07-27 |
| TW491886B (en) | 2002-06-21 |
| ES2223441T3 (es) | 2005-03-01 |
| KR20000071761A (ko) | 2000-11-25 |
| ATE272100T1 (de) | 2004-08-15 |
| KR100607919B1 (ko) | 2006-08-04 |
| HUP0001483A2 (en) | 2001-03-28 |
| HUP0001483A3 (en) | 2003-02-28 |
| SG83204A1 (en) | 2001-09-18 |
| ID25822A (id) | 2000-11-09 |
| DK1046690T3 (da) | 2004-09-27 |
| JP2000351957A (ja) | 2000-12-19 |
| DE60012399D1 (de) | 2004-09-02 |
| HU228376B1 (en) | 2013-03-28 |
| DE60012399T2 (de) | 2004-12-23 |
| FR2792643A1 (fr) | 2000-10-27 |
| CZ300220B6 (cs) | 2009-03-18 |
| CZ20001494A3 (cs) | 2001-04-11 |
| EP1046690A1 (de) | 2000-10-25 |
| CN1153823C (zh) | 2004-06-16 |
| HU0001483D0 (en) | 2000-06-28 |
| PT1046690E (pt) | 2004-10-29 |
| JP3967522B2 (ja) | 2007-08-29 |
| CN1272519A (zh) | 2000-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7252695B2 (en) | Abrasive composition for the integrated circuit electronics industry | |
| EP1724317B1 (de) | Wässrige Dispersion für chemisch-mechanisches Polieren, chemisch-mechanisches Polierverfahren und Kit zur Zubereitung einer wässrigen Dispersion für chemisch-mechanisches Polieren | |
| US8574330B2 (en) | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device | |
| RU2356926C2 (ru) | Абразивные частицы для механической полировки | |
| US7695637B2 (en) | Slurry composition for chemical mechanical polishing and precursor composition thereof | |
| KR101461261B1 (ko) | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 | |
| KR100704690B1 (ko) | 연마액 및 연마방법 | |
| US7247179B2 (en) | Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal | |
| US6362108B1 (en) | Composition for mechanical chemical polishing of layers in an insulating material based on a polymer with a low dielectric constant | |
| US20110027997A1 (en) | Polishing liquid for cmp and polishing method | |
| TWI500749B (zh) | 使用適用於增加氧化矽移除之研磨組成物化學機械研磨基板之方法 | |
| KR20020050161A (ko) | ＳｉＯ₂분리층의 화학 기계적 연마용 산성 연마 슬러리 | |
| JPWO2007060869A1 (ja) | 化学機械研磨用水系分散体および化学機械研磨方法 | |
| SG171909A1 (en) | Method to selectively polish silicon carbide films | |
| US20030047710A1 (en) | Chemical-mechanical polishing | |
| KR20150032495A (ko) | 저결점의 화학적 기계적 폴리싱 조성물 | |
| Chen et al. | Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: hydrido-organo siloxane and methyl silsesquioxane | |
| US7887609B2 (en) | Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same | |
| JP2006352096A (ja) | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット | |
| JP4001219B2 (ja) | 化学機械研磨用水系分散体及び化学機械研磨方法 | |
| KR101030733B1 (ko) | 금속 기판의 화학-기계적 연마방법 | |
| US20020127954A1 (en) | Process for the chemical-mechanical polishing of isolation layers produced using the STI technology, at elevated temperatures |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: CLARIANT (FRANCE) S.A., FRANCE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:JACQUINOT, ERIC;LETOURNEAU, PASCAL;RIVOIRE, MAURICE;REEL/FRAME:011781/0488;SIGNING DATES FROM 20000321 TO 20000410 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| AS | Assignment |
Owner name: CLARIANT INTERNATIONAL LTD, SWITZERLAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CLARIANT (FRANCE);REEL/FRAME:015629/0413 Effective date: 20041130 Owner name: AZ ELECTRONIC MATERIALS USA CORP., NEW JERSEY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CLARIANT INTERNATIONAL LTD;REEL/FRAME:015629/0416 Effective date: 20041216 |
|
| FPAY | Fee payment |
Year of fee payment: 4 |
|
| FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| FPAY | Fee payment |
Year of fee payment: 8 |
|
| FPAY | Fee payment |
Year of fee payment: 12 |
|
| AS | Assignment |
Owner name: MERCK PATENT GMBH, GERMANY Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AZ ELECTRONIC MATERIALS USA CORP.;REEL/FRAME:034742/0206 Effective date: 20141212 |