US6160611A - Exposing apparatus and method - Google Patents

Exposing apparatus and method Download PDF

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Publication number
US6160611A
US6160611A US09/196,135 US19613598A US6160611A US 6160611 A US6160611 A US 6160611A US 19613598 A US19613598 A US 19613598A US 6160611 A US6160611 A US 6160611A
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United States
Prior art keywords
photomask
plate
pattern
light
moving
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Expired - Fee Related
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US09/196,135
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English (en)
Inventor
Eiichi Miyake
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Sanei Giken Co Ltd
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Sanei Giken Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Definitions

  • the present invention relates to exposing apparatuses and methods, and more particularly to an exposing apparatus and an exposing method for transferring patterns onto a plate by irradiation of light onto the plate having on its surface a layer of photosensitive material through a photomask which is positioned in the vicinity of the plate, which photomask is provided with a plurality of linear patterns in parallel or with patterns in arbitrary forms at least at one ends thereof.
  • a glass plate for a liquid crystal or plasma display is increasingly becoming larger in size.
  • the plate especially used for the plasma display has increased in size to achieve as large a dimension as 1 m ⁇ 1.5 m.
  • a first object of the present invention is to provide an exposing apparatus and an exposing method for performing an exposing process with high accuracy, which apparatus can readily be manufactured with low equipment and maintenance expenditure, even in the manufacture of an increasingly larger plate with a prescribed pattern.
  • a second object of the present invention is to provide an exposing apparatus and an exposing method which can be operated and performed even when a foreign matter adheres on the photomask.
  • patterns are transferred onto the plate by irradiation of light onto the plate having on its surface a layer of photosensitive material through a photomask which is positioned in the vicinity of the plate, which photomask is provided with a plurality of linear patterns in parallel or with patterns in arbitrary forms at least at one ends thereof.
  • the linear patterns on the photomask have their linear portions to be transferred onto the plate reduced in length.
  • the photomask and light irradiation device for directing light onto the plate through the photomask are relatively moved or stopped in the X and Y directions within a prescribed area including the plate, during which the patterns are sequentially transferred onto the plate by exposure.
  • photomask allows transfer of the linear patterns onto the plate with high accuracy by sequentially transferring the patterns onto the plate by exposure while the photomask is being relatively moved or stopped with respect to the plate.
  • the pattern is transferred while relatively moving the photomask with respect to the plate, even when the foreign matter or the like adheres on the photomask, it is not transferred onto the plate as the pattern.
  • the patterns on the photomask are divided into arbitrary portions in the direction which is orthogonal to the linear patterns to be transferred onto the plate.
  • further reduction in the size of the photomask can be achieved as the patterns on the photomask are divided into smaller groups.
  • light is directed to the patterns drawn on the photomask in the direction toward the plate through the photomask to form an image on the plate by means of an optical system interposed between the photomask and the plate.
  • the image of the patterns drawn on the photomask can be exposed and reduced in size onto the plate using for example the optical system, so that fine patterns are transferred onto the plate with high accuracy.
  • the light irradiation device for transferring the patterns drawn on the photomask onto the plate is provided above a photomask moving device for moving the photomask.
  • the light irradiation device can move along with and with respect to the photomask.
  • the light irradiation device is provided outside the photomask moving device for moving the photomask such that collimation beams from the light irradiation device can be deflected by a reflection mirror to reach the photomask and the plate.
  • the exposing apparatus further includes an entrance conveyer for carrying the plate from an entrance to the position for exposure, and an exit conveyer for carrying the plate from the position for exposure to an exit.
  • the light irradiation device is provided above the surface on which the plate is carried, which is formed by the entrance and exit conveyers. More preferably, laser beam is employed as the light source of the light irradiation device.
  • the photomask includes a photomask alignment mark in a prescribed position for alignment with the plate.
  • the photomask further includes a photomask alignment mechanism for alignment of the photomask with the plate in the X, Y and ⁇ directions.
  • a plate holder is further provided for holding the plate, which has an alignment mechanism for alignment of the photomask with the photomask alignment mechanism in the X, Y and ⁇ directions.
  • the photomask moves in both X and Y directions, whereas the plate is fixed.
  • the photomask moves in one of X and Y directions, whereas the plate is provided to move in the other direction.
  • clearance measuring and clearance adjusting devices are further provided for maintaining a prescribed clearance between the photomask and the plate.
  • a mechanism for changing the size of the area to be irradiated with light on the plate is provided.
  • an exposing apparatus is used for transferring patterns on a plate by irradiation of light onto the plate having on its surface a layer of photosensitive material through a photomask positioned in the vicinity of the plate, which photomask is provided with a plurality of linear patterns in parallel or with patterns in arbitrary forms at least at one ends of the linear patterns.
  • the linear patterns of the photomask are drawn with their linear portions to be transferred onto the plate reduced in length.
  • the photomask and a light irradiation device for directing light onto the plate through the photomask are relatively moved or stopped in the X and Y directions within a prescribed area including the plate, during which the patterns are sequentially transferred onto the plate by exposure.
  • An exposing process in the direction which is orthogonal to the plate provides patterns in grating form.
  • transfer of the linear patterns with high accuracy can be achieved by sequentially transferring the patterns onto the plate by exposure while the photomask is being relatively moved or stopped with respect to the plate. Further, the exposing process in the direction which is orthogonal to the plate provides the patterns in grating form.
  • the pattern is transferred while relatively moving the photomask with respect to the plate, even when the foreign matter or the like adheres on the photomask, it is not transferred onto the plate as the pattern.
  • the patterns on the photomask are divided into arbitrary portions in the direction which is orthogonal to the linear patterns.
  • the patterns are transferred onto the plate by exposure by suitably adjusting distances between the adjacent divided patterns.
  • patterns can be transferred onto the large plate by exposure with high accuracy and low cost by using the photomask further reduced in size.
  • the present invention can sufficiently be applied to the manufacture of the plate used for the increasingly larger plasma display, for example.
  • an exposing apparatus for transferring patterns onto a plate by irradiation of light onto the plate having on its surface a layer of photosensitive material through a photomask which is positioned in the vicinity of the plate, which photomask is provided with a plurality of linear patterns in parallel or with patterns in arbitrary forms at least at one ends thereof.
  • the linear patterns on the photomask have their linear portions to be transferred onto the plate reduced in length.
  • a collimation beam having a prescribed region for irradiation of light onto the plate through the photomask and a plate holder holding the plate can be moved or stopped in a direction which is parallel to the linear patterns on the photomask.
  • the patterns in arbitrary forms at least at one ends of the linear patterns of the photomask are transferred onto the plate by irradiation of light onto the plate through the photomask while moving or stopping the collimation beam with the plate fixed in a prescribed position with respect to the photomask.
  • the linear patterns of the photomask are transferred onto the plate through the photomask while moving the plate at an arbitrary speed with the collimation beam directed on the photomask, so that the linear patterns on the photomask having their linear portions reduced in length substantially extend to have prescribed lengths.
  • photomask allows transfer of the linear patterns onto the plate with high accuracy by sequentially transferring the patterns onto the plate by exposure while the photomask is being relatively moved or stopped with respect to the plate.
  • the pattern is transferred while relatively moving the photomask with respect to the plate, even when the foreign matter or the like adheres on the photomask, it is not transferred onto the plate as the pattern.
  • an area on photomask to be irradiated with the collimation beam is rectangular in shape which is determined by at least one of an optical system of a light source for directing the collimation beam and a light shielding plate having a light transmission window.
  • a length of a side of the area to be irradiated with light which is parallel to the linear pattern of the photomask is almost the same as or shorter than that of the linear pattern.
  • a length of a side of the area to be irradiated with light which is orthogonal to the linear pattern of the photomask is set such that the patterns in the same direction can be simultaneously transferred onto the plate.
  • the photomask is provided with: a slightly moving device capable of slightly moving in a ⁇ direction on a plane including the surface of the photomask; and a control device controlling the slightly moving device such that a direction of movement of a plate holder is parallel to the linear pattern of the photomask by moving the plate holder and measuring a distance in a direction which is almost orthogonal to the linear patterns of the photomask between one of two photomask alignment marks provided parallel to the linear patterns of the photomask and with an arbitrary distance therebetween and the linear pattern of the photomask, and one plate holder alignment mark provided in the plate holder which is guided by a straight rail and moves in parallel to the linear pattern of the photomask.
  • an alignment control device for aligning the photomask with the plate by moving the plate with respect to the photomask in X, Y and ⁇ directions and simultaneously reading positions of a plurality of photomask alignment marks provided in the photomask and the plate alignment marks provided in the plate corresponding to the photomask alignment marks, and based on an amount of displacement in position of the photomask alignment mark of the photomask and the plate alignment mark, further moving the plate in the X, Y and ⁇ directions.
  • an exposing method using the above described exposing apparatus for forming a two or three-dimensionally combined pattern using an intended material on the plate by combining the steps of: transferring the linear pattern of the photomask onto the plate a plurality of times in a direction which is parallel to or different from the linear pattern of the photomask; forming a photosensitive layer on the plate which is optically negative or positive; and forming a thin layer by development, etching or film formation using the intended material.
  • an exposing method using the above described exposing apparatus including steps of: transferring a first linear pattern of the photomask onto a first photosensitive layer on the plate; forming a pattern using an intended material by development, etching or the like; making the transferred pattern on the first photosensitive layer clear at least by development; forming a second photosensitive layer on the first photosensitive layer having the transferred pattern which has become clear; transferring a second linear pattern orthogonal to the first linear pattern onto the second photosensitive layer by exposure; and making the transferred pattern on the second photosensitive layer by development for forming patterns in grating forms or a number of rectangular patterns.
  • photomask allows transfer of the linear patterns onto the plate with high accuracy by sequentially transferring the patterns onto the plate by exposure while the photomask is being relatively moved or stopped with respect to the plate.
  • the pattern is transferred while relatively moving the photomask with respect to the plate, even when the foreign matter or the like adheres on the photomask, it is not transferred onto the plate as the pattern.
  • an exposing apparatus for positioning a photomask with a pattern in a prescribed shape in the vicinity of a plate having on its surface a layer of photosensitive material and transferring the pattern onto the plate by irradiation of light onto the plate through the photomask.
  • the photomask and a light irradiation device for directing light onto the plate through the photomask can be relatively moved or stopped in a prescribed area including the plate in X and Y directions.
  • the pattern to be transferred onto the plate is sequentially transferred onto the plate by exposure while the photomask is moved or stopped with respect to the plate.
  • FIG. 1 is a plan view shown in conjunction with a pattern to be transferred onto a glass plate according to a first embodiment of the present invention.
  • FIG. 2 is a plan view showing a photomask used for transferring the pattern shown in FIG. 1.
  • FIG. 3 is a plan view used for describing a basic principle of an exposing method according to the first embodiment of the present invention.
  • FIG. 4 is a side view used for describing the basic principle of the exposing method according to the first embodiment of the present invention.
  • FIGS. 5 to 8 are views used for describing the basic principle of the exposing method according to the first embodiment of the present invention.
  • FIG. 9 is a plan view showing an exposing apparatus for performing the exposing method according to the first embodiment of the present invention.
  • FIG. 10 is a side view showing the exposing apparatus for performing the exposing method according to the first embodiment of the present invention.
  • FIG. 11 is a partially enlarged view showing a portion denoted by A in FIG. 9.
  • FIG. 12 is a partially enlarged view showing a portion denoted by A' in FIG. 10.
  • FIGS. 13 and 14 are first and second diagrams shown in conjunction with alignment of the photomask and the plate according to the first embodiment.
  • FIG. 15A is a plan view shown in conjunction with a pattern to be transferred onto a plate according to a second embodiment of the present invention
  • FIG. 15B is a plan view showing a photomask used for transferring the pattern shown in FIG. 15A.
  • FIGS. 16A, 17A and 18A are plan views shown in conjunction with another patterns to be transferred onto the plate according to the second embodiment of the present invention
  • FIGS. 16B, 17B and 18B are plan views showing photomasks used for transferring the patterns shown in FIGS. 16A, 17A and 18A.
  • FIGS. 19A-19C are first diagrams used for describing an exposing method according to the second embodiment of the present invention.
  • FIGS. 20A-20C are second diagrams used for describing the exposing method according to the second embodiment of the present invention.
  • FIGS. 21A-21C are third diagrams used for describing the exposing method according to the second embodiment of the present invention.
  • FIGS. 22 and 23 are first and second plan views showing an exposing apparatus for performing the exposing method according to the second embodiment of the present invention.
  • FIG. 24 is a front view showing the exposing apparatus for performing the exposing method according to the second embodiment of the present invention.
  • FIG. 25 is a side view showing the exposing apparatus for performing the exposing method according to the second embodiment of the present invention.
  • FIG. 26 is a diagram shown in conjunction with alignment of a photomask in a direction of movement of the plate.
  • FIG. 27 is a plan view showing a beam generation device according to the second embodiment of the present invention.
  • FIG. 28 is a side view showing the beam generation device according to the second embodiment of the present invention.
  • FIG. 29 is a plan view showing a collection of lenses used for the beam generation device according to the second embodiment of the present invention.
  • FIG. 30 is a side view showing a collection of lenses used for the beam generation device according to the second embodiment of the present invention.
  • FIGS. 31A and 31B are diagrams respectively showing the collection of lenses shown in FIG. 30 viewed in accordance with arrows X 1 and X 2 .
  • FIG. 32 is a plan view showing the exposing apparatus according to the second embodiment of the present invention.
  • FIG. 33 is a side view showing the exposing apparatus according to the second embodiment of the present invention.
  • FIG. 34 is a diagram used for describing the exposing method for other patterns 105 and 106 to be transferred onto the glass plate.
  • FIG. 35 is a plan view showing another pattern 107 to be transferred onto the glass plate.
  • FIG. 36 is a plan view showing another pattern 108 to be transferred onto the glass plate.
  • a glass plate for a plasma display is exemplified.
  • a glass plate 1 and pattern 2 are provided, which pattern 2 having a plurality of patterns linearly extending in parallel in one direction (in the X direction in the drawing, which is hereinafter referred to as an X direction) of glass plate 1 on the surface thereof.
  • Terminal patterns T1 and T2 in prescribed forms are formed at both ends of pattern 2. It is noted that the terminal patterns may be formed at only one ends of the pattern. Further, alignment marks 3 for the plate are formed in four corners of glass plate 1 used in aligning plate 1A and the photomask for exposure in alignment.
  • Pattern 2 includes divided patterns P1, P2, P3 and P4 which are equally divided from pattern 2 into four portions in the direction which is orthogonal to the X direction (in the direction denoted by Y in the drawing, which will be hereinafter referred to as a Y direction).
  • pattern 2 is formed of divided patterns P1 to P4 of identical patterns.
  • Photomask 10A includes a pattern 11 having a linear portion 11a which corresponds to one of linear portions of divided patterns P1 to P4 of pattern 2 reduced in length in a longitudinal direction to be transferred onto plate 1A on a transparent glass plate 10, and terminal patterns T11 and T12 corresponding to terminal patterns T1 and T2 at its ends. Further, alignment marks 12 for the photomask are provided in four corners of glass plate 10 for alignment with plate 1A.
  • FIG. 3 is a top view showing plate 1A having on its surface photomask 10A and a layer of photosensitive material
  • FIG. 4 is a side view thereof.
  • photomask 10A is arranged in a prescribed position at one corner of plate 1A, showing a starting position for transferring pattern 11 onto the plate.
  • Irradiation light (collimation light) 20 which is used for transferring pattern 11 provided on photomask 10A onto plate 1A, is emanated from a light source (not shown in the drawing) arranged outside plate 1A horizontally and orthogonally to linear portion 11a of pattern 11.
  • Irradiation light (collimation light) 20 emanated from the light source is reflected by reflection mirrors 21 and 32, transmitted into photomask 10A from thereabove and directed onto plate 1A, as shown in FIGS. 3 and 4. It is noted that reflection mirror 32 is covered with a protection cover 31 and, the area of photomask 10 to be irradiated with irradiation light 20 can be adjusted by opening and closing shutters 30a, 30b and 30c provided for protection cover 31.
  • reflection mirror 32, protection cover 31 and shutters 30a to 30c comprise a first light irradiation device 30.
  • Photomask 10A is provided to maintain a small clearance (which is between 0.05 mm and 0.5 mm) with respect to plate 1A.
  • Photomask 10A and irradiation light 20 have a mechanism moving in the X and Y directions (whose detailed description will be later provided). Referring to FIGS. 5 to 8, a method of transferring pattern 11 on photomask 10A onto plate 1A with such mechanism will be described.
  • photomask 10A is moved in the X direction at the same speed as that for first light irradiation device 30 to transfer the linear portion of pattern 2 onto plate 1A, as shown in FIG. 6 (with reference to arrows A1 to A3 in FIG. 8).
  • divided pattern P1 for plate 1A shown in FIG. 1 is transferred onto plate 1A.
  • photomask 10A and first light irradiation device 30 are relatively moved in the Y direction by one divided patterns and also moved in the -X direction which is opposite to the direction shown in FIGS. 5 to 7.
  • next divided pattern P2 is transferred onto plate 1A.
  • Repeating the operation to transfer divided patterns P3 and P4 by exposure provides pattern 2 formed on the entire surface of plate 1A as shown in FIG. 1.
  • shutters 30a and 30c are in an open state and shutter 30b is in a closed state, so that alignment marks 3 are transferred onto the four corners of plate 1A.
  • shutters 30a and 30c are in the closed state as alignment marks 3 need not be transferred.
  • FIG. 8 is a side view showing the operation of first light irradiation device 30 shown in FIGS. 5 to 7.
  • FIG. 9 is a top view of an exposing apparatus 100
  • FIG. 10 is a side view thereof
  • FIG. 11 is a diagram showing in enlargement a region denoted by A in FIG. 9
  • FIG. 12 is a diagram showing in enlargement a region denoted by A in FIG. 10.
  • exposing apparatus 100 includes an entrance station 100A for carrying plate 1A to exposing apparatus 100, an exposing station 100B for performing the exposing process for plate 1A and an exit station 100C for carrying plate 1A outside exposing apparatus 100. While an exit mechanism for plate 1A in each of stations 100A to 100C is not described in detail, a roller conveyer or a carrying mechanism using a plate carrying fork and a plate lift pin or the like may generally be employed.
  • exposing station 100B is provided with a first light irradiation device 30 having reflection mirrors 21 and 32 which are movable in the X and Y directions above plate 1A.
  • a photomask frame 10a for moving photomask 10A in the X and Y directions and a photomask X direction driving device 200X and a photomask Y direction driving device 200Y for moving photomask frame 10a in the X and Y directions are provided.
  • photomask driving device 200X a driving device 30X for driving first light irradiation device 30 in the X direction is provided. It is noted that photomask driving device 200Y is also used as a device for moving first light irradiation device 30 in the Y direction.
  • photomask frame 10a and photomask driving device 200X Provided between photomask frame 10a and photomask driving device 200X are a photomask XY ⁇ slightly driving device 200a for fine adjusting the position of photomask 10A in the X, Y and ⁇ directions, and a photomask Z direction driving device 200Z for vertically moving photomask frame 10a with respect to plate 1A for adjusting a distance between photomask 10a and plate 1A.
  • Photomask driving device 200Y further includes a CCD camera 51 for reading photomask alignment marks 12 on photomask 10A and plate alignment marks 3 on plate 1A.
  • Camera driving devices 500X and 500Y for driving camera in the X and Y directions, respectively, are attached to CCD camera 51.
  • a plate YX ⁇ fine adjusting device 100a is provided between a plate holder 150 at exposing station 100B and a frame 40 on which plate holder 150 is placed.
  • Frame 40 is provided with a light source 22 for directing collimation light 20 to exposing station 100B.
  • a sensor 50 for sensing the distance between plate 1A and photomask 10A is attached to photomask frame 10a.
  • plate 1A carried from the entrance is placed on entrance station 10A, and carried to exposing station 100B after alignment.
  • plate 1A is fixed to plate holder 150 by vacuum suction.
  • photomask 10A is kept in the position in which corresponding alignment marks on photomask 10A and plate 1A almost match at the upper right corner of plate 1A.
  • the position of photomask 10A is adjusted using photomask XY ⁇ slightly driving device 200a and photomask driving devices 200X and 200Y so that the pattern drawn on photomask 10A is accurately aligned in the X and Y directions of photomask driving devices 200X and 200Y.
  • photomask alignment marks 12A to 12D on photomask 10A and plate alignment marks 3A to 3D on plate 1A are aligned.
  • corresponding alignment marks on photomask 10A and plate 1A are aligned at each corner of plate 1A by moving CCD camera 51 and photomask 10A. Thereby, the position of the alignment marks is read and the displacement in position is calculated. Based on the result, the plate 1A is aligned in the X, Y and ⁇ directions using plate XY ⁇ slightly driving device 100a .
  • photomask 10A is placed back in the position in which alignment marks 3A on plate 1A and photomask alignment marks 12A on photomask 10A are aligned, that is, the starting position of the exposing process.
  • first light irradiation device 30 and photomask 10A are moved in the X direction at the same speed when first light irradiation device 30 comes above the middle portion of linear portion 11a of pattern 11 on photomask 1A. Thereafter, only photomask 10A is stopped in the position in which photomask alignment mark 12B on photomask 10A and plate alignment mark 3B on plate 1A are aligned, and first light irradiation device 30 is kept on moving until it comes outside plate 1A.
  • photomask 10A After photomask 10A is moved in the Y direction by a prescribed pitch, the exposing process is performed for plate 1A using again photomask 10A through the process similar to that described above.
  • photomask 10A is provided with the pattern divided into four portions in the Y direction, so that the pitch between the adjacent patterns can be adjusted by suitably controlling the amount of photomask 10A moved in the Y direction by photomask driving device 200Y.
  • the distance between photomask 10a and plate 1A is always sensored by a distance sensor 50 (shown in FIG. 11) attached to photomask frame 10a and, based on the resulting data, photomask driving device 200Z is automatically controlled to make the distance constant.
  • Plate 1A for which the exposing process is completed at exposing station 100B would be carried out of the apparatus from the exit for a next step after it is moved to exit station 100C.
  • the amount to be shifted in the Y direction can slightly be controlled, or photomask 10A can manually or. automatically be changed to employ a photomask having a pattern with a slightly different pitch so as to cope with any extension or contraction of plate 1A due to other processing treatment for plate 1A.
  • a plurality of different patterns may be drawn onto a single photomask so that the patterns are separately transferred onto the plate by exposure.
  • photomasks corresponding to the patterns are employed for the exposing process.
  • the plate can be rotated by 90° for a similar exposing process to provide a pattern in grating form on the plate.
  • a laser light source may also be used as the light source.
  • the light source is externally provided for emanating collimation light, which is directed toward the photomask using the reflection mirror, a light source device may be provided above the photomask and moved along with the photomask.
  • the light source device is provided above the apparatus to save space, thereby avoiding increase in size of the apparatus when viewed from above.
  • the photomask can be moved in the X and Y directions with respect to the plate.
  • the above mentioned exposing method can be implemented as long as the photomask and the plate are relatively moved in the X and Y directions, and therefore another structure may be employed in which one of the plate and the photomask is moved in the X direction and the other in the Y direction.
  • FIGS. 15A and 15B a plate 101A and a photomask 110A of a plasma display according to the present embodiment will be described with reference to FIGS. 15A and 15B.
  • plate 101A includes a glass plate 101 and is provided on its surface with a pattern 102 having a plurality of linear patterns in parallel in an X direction of glass plate 101.
  • terminal patterns T101 and T102 are formed which are both in prescribed forms. It is noted that the terminal pattern may be formed only at one end. Further, alignment marks for the plate 103 are formed at four corners of glass plate 101 for exposure in alignment of plate 101A and the photomask.
  • Photomask 110A has a pattern 111 on a transparent glass plate 110.
  • Pattern 111 includes a linear pattern 111a which is obtained by reducing the length of linear portion of pattern 102 to be transferred onto plate 101, and terminal patterns T11 and T112 corresponding to terminal patterns T101 and T102. Further, alignment marks for the photomask 112 are formed at four corners of glass plate 110 for alignment of plate 101A.
  • plate 101B without terminal patterns T101 and T102 as shown in FIG. 16A and photomask 110B without terminal patterns T1 and T112 as shown in FIG. 16B can be used.
  • a plate 101C and a photomask 110C may be used as shown in FIGS. 17A and 17B.
  • Plate 101C includes glass plate 101 which has on its surface patterns 104 in parallel in the X direction of glass plate 101, two in the X direction and three in the Y direction, that is, six in total. Terminal patterns T105 and T106 in prescribed forms are provided at both ends of each of patterns 104.
  • photomask 110C has on a transparent glass plate 110 three patterns 114 in the Y direction, which includes a linear portion 114a which is obtained by reducing the length of the linear portion of pattern 104 to be transferred onto plate 101C, and terminal patterns T115 and T116 corresponding to terminal patterns T105 and T106.
  • plate 101D without terminal patterns T105 and T106 as shown in FIG. 18A and photomask 110D without terminal patterns T115 and T116 as shown in FIG. 18B can be used.
  • FIGS. 19A, 20A, 21A and FIGS. 19B, 20B, 21B which are respectively plan and side views.
  • photomask 110A is arranged in a prescribed position at one end of glass plate 101, showing a starting position for transferring pattern 111 onto the plate.
  • a collimation beam 130A which is used for transferring pattern 111 on photomask 110A onto glass plate 101, is directed from a light source (later described) positioned outside glass plate 101 horizontally and in parallel to linear pattern 111a of pattern 111.
  • Collimation beam 130A directed from the light source is reflected by a planar mirror 131 and, after passing through a light shielding plate 132, transmitted through photomask 110A from above toward glass plate 101. It is noted that an area to be irradiated with collimation beam 130A can be determined by an optical system on the side of the light source for directing collimation beam 130 or by an opening 132a of light shielding plate 132.
  • a length of a side of the area to be irradiated with collimation beam 130A which is parallel to linear pattern 111a of photomask 110A is almost the same as or shorter than that of the linear pattern.
  • a length of a side of the area to be irradiated with collimation beam 130A which is orthogonal to linear pattern 111a of photomask 110A is set such that patterns 111a arranged in the same direction are simultaneously transferred.
  • Photomask 110A is provided to have a small clearance (0.05-0.5 mm) with respect to glass plate 101 to avoid contact therewith as in the case of the above described first embodiment.
  • Planar mirror 131 for reflecting collimation beam 130A and glass plate 101 have mechanisms which move in the X direction (which will later be described in detail).
  • terminal pattern T112 is transferred onto glass plate 101 by directing light onto glass plate 101 through photomask 110A while moving planar mirror 131 above terminal pattern T112 of photomask 110A with glass plate 101 fixed.
  • the area to be irradiated with collimation beam 130A is determined by the optical system on the side of the light source for directing collimation beam 130A, and therefore light shielding plate 132 is used for preventing irradiation of collimation beam 130A onto an area which needs not be irradiated with light.
  • linear pattern 111a of pattern 111 of photomask 110A is transferred onto glass plate 101 while moving only glass plate 101 in the X direction with planar mirror 131 fixed above a central portion of pattern 111a of photomask 110A.
  • terminal pattern T111 is transferred onto plate 110A by directing light onto glass plate 101 through photomask 110A with glass plate 101 fixed in the position where terminal pattern T11 is transferred onto the plate in a prescribed position. Thereafter, planar mirror 131 is further moved in the X direction and stopped.
  • patterns 111 of photomask 110A shown in FIG. 15B are collectively transferred onto the entire surface of glass plate 101.
  • glass plate 101 and planar mirror 131 are movable in FIGS. 19A, 19B, 20A, 20B, 21A and 21B.
  • FIGS. 19C, 20C and 21C for example, patterns 111 of photomask 110A are similarly transferred onto glass plate 101 collectively while moving glass plate 101 and light shielding plate 132 having a prescribed area for irradiation movable, and fixing planar mirror 131.
  • the area to be irradiated with collimation beam 130A is determined by an opening 132a formed in light shielding plate 132.
  • FIGS. 22 and 23 are plan views of a plate moving exposing device 140
  • FIGS. 24 and 25 are front and side views thereof, respectively.
  • FIG. 26 is a diagram shown in conjunction with alignment of photomask 110A in the direction in which glass plate 101 moves.
  • plate moving exposing device 140 is provided with a rails 142 extending in the X direction on a frame 141 with a prescribed distance therebetween.
  • Rails 142 have a plate holder 145 for holding glass plate 101 such that it can be moved in the X direction.
  • a ball screw 144 is provided between frame 141 and plate holder 145 which is driven by a motor 143, so that plate holder 145 moves along rails 142 as ball screw 144 rotates in a prescribed direction.
  • Plate holder 145 includes an X, Y and ⁇ adjusting mechanism 145A for adjusting a position in the X, Y and ⁇ directions within the surface of glass plate 101. Further, a plate mark 145a is formed for accurately verifying the direction in which plate holder 145 moves.
  • a mask holder 146b and a mask frame 146a having a mechanism (later described) which slightly moves mask holder 146b in the ⁇ direction are provided.
  • Mask frame 146a has an elevating unit 149 for elevating or lowering mask frame 146b to adjust a distance between glass plate 101 held by plate holder 145 and photomask 110A held by mask holder 146b, and has an elevating rod 147 controlled by elevating unit 149.
  • Photomask alignment marks 112 are formed in prescribed positions at four corners of photomask 110A for preliminary aligning photomask 110A with glass plate 101 and verifying if it is moved in parallel to plate holder 145.
  • mask holder 146b is provided with a rotating shaft 146c at one end such that it can be rotated with respect to mask frame 146a, and with a rotation actuator 148 at the other end for rotating mask holder 146b about rotating shaft 146c in L and R directions in the drawing.
  • a CCD camera 150A for reading photomask alignment marks 112 formed in photomask 110A and plate mark 145a formed in plate holder 145 is supported by an X direction rod 151 which can be moved in the X direction. Further, X direction rod 151 is movably supported by Y direction rail 152 through a block 155. Y direction rail 152 is secured to mask frame 146.
  • FIGS. 27 and 28 are plan and side views showing collimation beam generation device 130, respectively.
  • the light directed from a light source 138 is reflected by collection mirror 138a upwardly, changes its travelling direction by planar mirror 133, and is collected by a collection of lenses 134.
  • the light from collection of lenses 134 changes its travelling direction by planar mirror 135, and turns to a collimation beam having a prescribed area for irradiation by a curved mirror 136. Then, the collimation beam is reflected by planar mirror 131 and directed to photomask 110A.
  • Collection of lenses 134 has a lens supporting member 134a.
  • Two fly eye lenses 134b are arranged in parallel and, on the side of fly eye lens 134b opposite to light source 138, a convex cylindrical lens 134c is arranged.
  • the light directed form light source 138 turns to a collimation beam which greatly extends in the plane direction (the direction indicated by ⁇ 1 in FIG. 29), but not greatly extends in the side direction (the direction indicated by ⁇ 2 in FIG. 30).
  • the collimation beam with a desired area for irradiation see a dimension L ⁇ S in FIG. 27) can be obtained.
  • An overall structure of an exposing apparatus 300 including the above described plate moving exposing device and collimation beam generation device 130 will now be described with reference to FIGS. 32 and 33.
  • plate moving exposing device 140 On the entrance side of plate moving exposing device 140, an entrance station 301 for carrying glass plate 101 into plate moving exposing device 140 and an exit station 302 for carrying out glass plate 101 for which an exposing process has been performed out of plate moving exposing device 140 are provided.
  • a roller conveyer may be used for transportation, or a transportation mechanism using a plate transportation fork and a plate lift pin may be used as in the first embodiment.
  • a photomask stoker 303 is provided above entrance station 301 for storing a plurality of photomasks, automatically moving a desired photomask to plate moving exposing device 140 for taking out and storing the photomask in plate moving exposing device 140. It is noted that a part of movement of the photomask may be performed using a glass plate transporting means and a moving mechanism for a plate holder.
  • collimation beam generation device 130 is provided above plate moving exposing device 140 and exit station 302.
  • space required for installing exposing apparatus 300 can be reduced.
  • the linear pattern is transferred onto the plate.
  • a two or three-dimensionally combined pattern may be formed using an intended material on the plate by combining the steps of: transferring the linear pattern of the photomask onto the plate a plurality of times in a direction which is parallel to or different from the linear pattern of the photomask; forming a photosensitive layer on the plate which is optically negative or positive; and forming a thin layer by development, etching or film formation using the intended material.
  • patterns having patterns in grating forms or polygonal patterns can be formed onto the plate.
  • a plate 101E having a photosensitive layer on which a linear pattern 104 is transferred is formed in accordance with the method described in each of the above embodiments using a photomask 110E having a linear pattern 122 on a photosensitive layer on a glass plate.
  • plate lOlE is rotated by 90° with respect to the photosensitive layer on which linear pattern 104 is transferred of other photosensitive layer which is further formed after the photosensitive layer on which linear pattern 104 is transferred. Thereafter, the pattern is transferred using a photomask 110F having a linear pattern 123.
  • a plate 101F having pattern in grating 105 is obtained when a resist film of positive type is used, and glass plate 101G having a plurality of polygonal patterns 106 is obtained when a resist of negative type is used.
  • the present invention is not limited to the formation of the above described plate 101F having pattern in grating form 105 and plate 101G having the plurality of polygonal patterns.
  • 36 can also be formed by employing the steps of: making the transferred pattern onto the first photosensitive layer clear by development; forming a second photosensitive layer onto the first photosensitive layer with the transferred pattern made clear by development; transferring a second linear pattern which is orthogonal to a first linear pattern onto the second photosensitive layer by exposure; and making the transferred pattern on the second photosensitive layer clear by development so that the pattern in grating form of a plurality of polygonal patterns are formed with an intended material.
  • the pattern on the photomask has been described only as being transferred onto a layer intended on the glass plate as a linear pattern.
  • the present invention is not limited to this and, for example, patterns in various forms can be transferred onto a layer intended on a glass plate using patterns in rectangular form, stripe form, or other different forms.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
US09/196,135 1997-12-18 1998-11-20 Exposing apparatus and method Expired - Fee Related US6160611A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP34938697 1997-12-18
JP9-349386 1997-12-18
JP10215811A JPH11237744A (ja) 1997-12-18 1998-07-30 露光装置および露光方法
JP10-215811 1998-07-30

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US (1) US6160611A (de)
EP (1) EP0924571B1 (de)
JP (1) JPH11237744A (de)
KR (1) KR100328377B1 (de)
DE (1) DE69802063T2 (de)
TW (1) TW417181B (de)

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US6320659B1 (en) * 1998-09-22 2001-11-20 Sanei Giken Co., Ltd. Clearance measuring device and method for exposure
US20070070319A1 (en) * 2005-09-28 2007-03-29 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus, exposure apparatus and exposure method
US20080078960A1 (en) * 2003-02-20 2008-04-03 Peter Ekberg Pattern generation methods and apparatuses
US20120113403A1 (en) * 2009-04-03 2012-05-10 Koichi Kajiyama Exposure method and exposure apparatus
US8982321B2 (en) 2009-04-03 2015-03-17 V Technology Co., Ltd. Exposure method and exposure apparatus
US9207546B2 (en) 2009-12-14 2015-12-08 V Technology Co., Ltd. Exposure method and exposure apparatus
JP2017181936A (ja) * 2016-03-31 2017-10-05 株式会社オーク製作所 露光装置
US9841669B2 (en) 2014-02-13 2017-12-12 Lg Chem, Ltd. Method for forming conductive mesh pattern, and mesh electrode and laminate manufactured thereby
US11032913B2 (en) 2016-11-30 2021-06-08 Nitto Denko Corporation Wired circuit board and production method thereof
CN116088283A (zh) * 2023-04-12 2023-05-09 深圳市龙图光罩股份有限公司 掩模版预校准方法、系统、电子设备以及可读存储介质

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JP4538884B2 (ja) * 2000-03-08 2010-09-08 凸版印刷株式会社 大型基板の露光装置
JP4503212B2 (ja) * 2002-03-12 2010-07-14 奇美電子股▲ふん▼有限公司 露光システム、及び該露光システムを応用した液晶パネルのカラーフィルタ形成方法。
JP4884148B2 (ja) * 2005-09-28 2012-02-29 株式会社半導体エネルギー研究所 レーザー処理装置、露光装置及び露光方法
JP2007164085A (ja) * 2005-11-15 2007-06-28 Nsk Ltd 近接露光方法
CN101410761A (zh) * 2006-06-14 2009-04-15 日本精工株式会社 曝光装置
US8139199B2 (en) * 2007-04-02 2012-03-20 Nikon Corporation Exposure method, exposure apparatus, light converging pattern formation member, mask, and device manufacturing method
JP2011048209A (ja) * 2009-08-28 2011-03-10 Hitachi High-Technologies Corp プロキシミティ露光装置、プロキシミティ露光装置の露光領域変更方法、及び表示用パネル基板の製造方法

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US6320659B1 (en) * 1998-09-22 2001-11-20 Sanei Giken Co., Ltd. Clearance measuring device and method for exposure
US20080078960A1 (en) * 2003-02-20 2008-04-03 Peter Ekberg Pattern generation methods and apparatuses
US8754350B2 (en) 2005-09-28 2014-06-17 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus, exposure apparatus and exposure method
US20070070319A1 (en) * 2005-09-28 2007-03-29 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus, exposure apparatus and exposure method
US8982321B2 (en) 2009-04-03 2015-03-17 V Technology Co., Ltd. Exposure method and exposure apparatus
US8497979B2 (en) * 2009-04-03 2013-07-30 V Technology Co., Ltd. Exposure method and exposure apparatus
US20120113403A1 (en) * 2009-04-03 2012-05-10 Koichi Kajiyama Exposure method and exposure apparatus
US9207546B2 (en) 2009-12-14 2015-12-08 V Technology Co., Ltd. Exposure method and exposure apparatus
US9841669B2 (en) 2014-02-13 2017-12-12 Lg Chem, Ltd. Method for forming conductive mesh pattern, and mesh electrode and laminate manufactured thereby
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JP2017181936A (ja) * 2016-03-31 2017-10-05 株式会社オーク製作所 露光装置
US11032913B2 (en) 2016-11-30 2021-06-08 Nitto Denko Corporation Wired circuit board and production method thereof
US11266024B2 (en) 2016-11-30 2022-03-01 Nitto Denko Corporation Wired circuit board and production method thereof
CN116088283A (zh) * 2023-04-12 2023-05-09 深圳市龙图光罩股份有限公司 掩模版预校准方法、系统、电子设备以及可读存储介质

Also Published As

Publication number Publication date
KR19990063144A (ko) 1999-07-26
JPH11237744A (ja) 1999-08-31
DE69802063D1 (de) 2001-11-22
EP0924571A3 (de) 1999-08-18
EP0924571B1 (de) 2001-10-17
DE69802063T2 (de) 2002-06-27
EP0924571A2 (de) 1999-06-23
TW417181B (en) 2001-01-01
KR100328377B1 (ko) 2002-10-09

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