US5194697A - Electrically conductive feedthrough connection and methods of manufacturing same - Google Patents

Electrically conductive feedthrough connection and methods of manufacturing same Download PDF

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Publication number
US5194697A
US5194697A US07/496,460 US49646090A US5194697A US 5194697 A US5194697 A US 5194697A US 49646090 A US49646090 A US 49646090A US 5194697 A US5194697 A US 5194697A
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US
United States
Prior art keywords
diaphragm
terminal lead
substrate
coefficient
feedthrough connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US07/496,460
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English (en)
Inventor
Frank Hegner
Thomas Klahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
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Endress and Hauser SE and Co KG
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Publication date
Application filed by Endress and Hauser SE and Co KG filed Critical Endress and Hauser SE and Co KG
Assigned to ENDRESS U. HAUSER GMBH U. CO. reassignment ENDRESS U. HAUSER GMBH U. CO. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: HEGNER, FRANK, KLAHN, THOMAS
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0075—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a ceramic diaphragm, e.g. alumina, fused quartz, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Definitions

  • the present invention relates to an electrically conductive feedthrough connection through a hole of a high-temperature-resistant and vacuum-proof insulating part, particularly of ceramic, glass, or a single crystal, which feedthrough connection is designed as a terminal lead covered with active solder and soldered into the hole.
  • the terminal lead has a coefficient of thermal expansion less than that of the insulating part.
  • the connection is used in a pressure sensor comprising a diaphragm and a substrate which have spaced-apart, flat inner surfaces, provided with at least one conductive or resistive layer for forming at least one capacitor or strain gage, respectively, and wherein the conductive surfaces are electrically connected to the respective rear side via the feedthrough connection.
  • the connection is manufactured by inserting the covered lead into the hole and then the insulating part and inserted lead are placed in a vacuum, or a gas atmosphere with a pressure not exceeding 10 mbars, and then heated until the active solder has completely melted.
  • the electrically conductive feedthrough connection through a hole of a high-temperature-resistant and vacuum-proof insulating part, particularly of ceramic, glass, or a single crystal, is designed as a terminal lead covered with active solder and inserted into the hole, the terminal lead having a coefficient of thermal expansion less than that of the insulating part.
  • the feedthrough connection is used in a pressure sensor comprising a diaphragm and a substrate which have spaced-apart, flat inner surfaces which are provided with at least one conductive layer or resistive layer for forming at least one capacitor or strain gage, respectively, and are electrically connected to the respective rear side via the feed-through connection.
  • the covered lead is inserted into the hole, and the thus equipped insulating part is placed in a vacuum and heated until the active solder has completely melted.
  • Mn--Mo paste can be applied only by hand, the applied layer having to be of uniform thickness.
  • Mn--Mo paste is not particularly suitable for very-high-purity alumina ceramics.
  • the object of the invention is to provide a feed-through connection which is generally suitable for high-temperature-resistant and vacuum-proof insulating parts, particularly of ceramic, glass, or a single crystal, and not only for alumina-ceramic parts, can be manufactured in a single high-temperature step and is inexpensive, mechanically heavily loadable, and high-vacuum-tight.
  • the active solder used in the invention consists of a soldering material, mostly a brazing solder such as Ag, Ag--Cu, or Ag--Cu13 In, alloyed with at least one reactive element, such as Ti, Zr, Be, Hf, or Ta, with Ti having proved to be the most effective alloying element.
  • the reactive element wets the surfaces of the parts to be soldered, so that no metallization, such as the above-mentioned Mn--Mo coating, is necessary.
  • oxide ceramic the high affinity of the reactive element for oxygen causes a reaction with the ceramic, which leads to the formation of mixed oxides and free valency electrons.
  • Active solder can also be used with nonoxide ceramic or glass without previous metallization.
  • Preferred active-solder alloys are ductile and contain 2 to 5% of Ti which is homogeneously embedded in a matrix of, e.g., Ag--Cu. They can be processed like normal brazing solders, so that the terminal leads, too, can readily be covered with them.
  • active solders are the alloys Ag--Ti, Ag--Cu--Ti, and Ag--Cu--In--Ti, whose soldering temperatures range between 750° and 1000° C.
  • step soldering grade soldering (gradations in the melting points) is also possible with active solders.
  • the strengths of active solders are identical with the strengths of comparable Ti-free brazing solders.
  • the bond strength to ceramic for example, is greater than, the strength of the ceramic itself; in a tensile test, the fracture will therefore lie in the ceramic, not in the ceramic-to-solder interface.
  • soldering results e.g., to reduce the evaporation of the solder or to reduce surface oxides, it may be advantageous to carry out the heating or soldering process in a defined gas atmosphere of inert gas and/or reactive gas.
  • the soldering temperature of the active solder should be 70° to 100° C. above the liquidus temperature to obtain an optimum reaction of the Ti with, e.g., ceramic. In this manner, high strength and vacuum tightness are achieved.
  • Pressure sensors with electrical feed-through connections in accordance with the invention are characterized by high mechanical strength, loadability, and resistance to temperature changes as well as by very good and very reliable vacuum tightness while being easy to manufacture.
  • the quality of the feed-through connection can be examined quickly and simply by radiography with X-rays.
  • an active solder can be used for soldering in feed-through connections, particularly of pressure sensors.
  • FIGS. 1a and 1b are schematic cross-sectional views of a feed-through connection
  • FIG. 2 is a schematic cross-sectional view of a development of the feed-through connection of FIG. 1;
  • FIG. 3 is a plan view of a pressure sensor with feed-through connections
  • FIG. 4 is a section taken along line IV--IV of FIG. 3.
  • FIGS. 1a and 1b show a feed-through connection in schematic cross sections.
  • FIG. 1a shows the condition before the heating of an insulating part 1, in which a terminal lead 4 covered with active solder 3 is inserted in a hole 2.
  • FIG. 1b illustrates the cooled-down condition after the melting of the active solder; from the active-solder-covered terminal lead 4 of FIG. 1a, the feed-through connection 6, connecting this terminal lead with the insulating part 1 in a vacuum-tight manner by means of the solder layer 5, has formed.
  • any detachment of the solder layer from the insulating part after cooling can be prevented by making the terminal lead 4 from a metal with a coefficient of thermal expansion less than that of the insulating part 1. During cooling, the insulating part and the terminal lead will then shrink to approximately the same extent, so that the active-solder layer will be virtually stressfree.
  • the coefficient of expansion of the terminal lead is made substantially less than that of the insulating part.
  • the joint with the terminal lead and the insulating part are under pressure after the melting and cooling steps. This is especially important if the insulating part is made of brittle material, because the latter must not be subjected to any tensile stress.
  • the coefficient of expansion of alumina ceramic is about 7 ppm/K, and that of Ag--Cu active solder about 19 ppm/K. If use is made of an Mo terminal lead, whose coefficient of expansion is about 5 ppm/K, detachment of the solder layer from the ceramic is reliably avoided and vacuum tightness of the feed-through connection is assured even with larger to large hole diameters. This effect is particularly marked with the use of tungsten, whose coefficient of expansion at room temperature is 4.5 ppm/K. Tantalum (6.5 ppm/K), rhenium (5.9 ppm/K), molybdenum (5.0 ppm/K), and osmium (4.7 ppm/K) are also suitable.
  • zirconium oxide (10.5 ppm/K) is used for the insulating material, other metals with a coefficient of expansion lower than 10.5 ppm/K are suitable as well.
  • FIG. 2 shows a development of the feed-through connection of FIG. 1 in a schematic cross section.
  • a suitable length of a terminal lead 4 covered with active solder is inserted into the hole 2 so as to be flush with one end of the latter, and the active solder is melted on.
  • the conductor path 7 is deposited by, e.g., sputtering.
  • the conductor path 7 and the exposed surface of the terminal lead 4 form an electrically highly conductive and mechanical joint.
  • a conductive layer may be deposited on the respective underside by, e.g., sputtering, but this is not shown for the sake of clarity.
  • the pressure sensor 10 of FIGS. 3 and 4 has a diaphragm 11 in the form of a circular disk with planeparallel surfaces which is joined around its periphery to a circular substrate 12 sb as to be separated from the latter by a defined distance d, thus forming a chamber 13 between the flat surface of the substrate 12 and the opposite surface of the diaphragm 11.
  • the diaphragm 11 and the substrate 12 are, for example, ceramic parts whose compositions may differ.
  • the diaphragm 11 is elastic, so that it can deform when pressure is applied to it.
  • the substrate 12 may be solid and rigid, but if desired, it may also be a flat elastic disk like the diaphragm 11. By means of the formed part 22, diaphragm 11 and substrate 12 are permanently joined together.
  • the conductive layer 15 of the substrate 12 has a terminal lead 17 connected thereto which is sealed in a hole 19 and brought out through the substrate 12.
  • the two conductive layers 14, 15 form the electrodes of a capacitor whose capacitance depends on the distance between the conductive layers.
  • This capacitance can be measured by means of an electronic circuit connected to the terminal leads 4, 17, and is, therefore, a measure of the pressure applied to the diaphragm 11.
  • FIGS. 3 and 4 The peculiarity of the pressure sensor illustrated in FIGS. 3 and 4 consists in the way the feed-through connections are designed. They may take the forms shown in FIGS. 1 and 2, which both use active solder. To make the connection between the parts 11, 12, a thermal process is used which allows a direct connection of the diaphragm 11 and the substrate 12 with the formed part 22, which is also made of active solder, without previous deposition of a metallized layer.
  • the substrate must be provided with an opening aligned with the terminal lead 4, so that it can be electrically connected to the latter by means of a conventional soft solder.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)
  • Insulating Bodies (AREA)
  • Liquid Crystal (AREA)
US07/496,460 1989-03-21 1990-03-20 Electrically conductive feedthrough connection and methods of manufacturing same Expired - Lifetime US5194697A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3909186 1989-03-21
DE3909186A DE3909186A1 (de) 1989-03-21 1989-03-21 Elektrisch leitende durchfuehrung und verfahren zu ihrer herstellung

Publications (1)

Publication Number Publication Date
US5194697A true US5194697A (en) 1993-03-16

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Country Status (10)

Country Link
US (1) US5194697A (ja)
EP (1) EP0414872B1 (ja)
JP (1) JPH03501061A (ja)
AT (1) ATE99832T1 (ja)
CA (1) CA2028113C (ja)
DE (2) DE3909186A1 (ja)
DK (1) DK0414872T3 (ja)
ES (1) ES2047920T3 (ja)
IE (1) IE900947L (ja)
WO (1) WO1990011610A1 (ja)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368220A (en) * 1992-08-04 1994-11-29 Morgan Crucible Company Plc Sealed conductive active alloy feedthroughs
US5380955A (en) * 1992-12-08 1995-01-10 International Business Machines Corporation Device for passing a member through a sealed chamber wall
US5600530A (en) * 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck
US5670063A (en) * 1991-05-26 1997-09-23 Endress + Hauser Gmbh + Co. Method for making an interface connection through an insulating part
EP0797084A1 (de) 1996-03-23 1997-09-24 ENVEC Mess- und Regeltechnik GmbH + Co. Verfahren zum Herstellen von kapazitiven, in Nullpunkt-Langzeit-Fehlerklassen sortierten Keramik-Absolutdruck-Sensoren
US5877424A (en) * 1995-12-22 1999-03-02 Hegner; Frank Capacitive pressure measuring arrangement having protection against interference signals
US6111198A (en) * 1998-06-15 2000-08-29 Olin Aegis Duplex feedthrough and method therefor
US6213101B1 (en) 1999-10-29 2001-04-10 James W. Numbers Method and apparatus for blocking fluid and fuel vapors
US6305975B1 (en) 2000-10-12 2001-10-23 Bear Instruments, Inc. Electrical connector feedthrough to low pressure chamber
US6346675B1 (en) * 1999-02-19 2002-02-12 Micronas Gmbh Coupling and method for its manufacture
US6501025B2 (en) 1999-11-04 2002-12-31 Clements Manufacturing L.L.C. Method and apparatus for blocking fluid and fluid vapors
US6591685B2 (en) * 2000-03-10 2003-07-15 W.E.T. Automotive Systems Ag Pressure sensor
US6628024B1 (en) * 2002-07-30 2003-09-30 Honeywell International, Inc. Hermetically sealed feed-through assembly for gas turbine engine starter generators and related methods
WO2004095015A1 (en) * 2003-04-17 2004-11-04 The Boc Group Plc Electrochemical solid electrolyte sensor for the detection of oxygen, hydrocarbons and moisture in vacuum environments
US20040266038A1 (en) * 2001-10-17 2004-12-30 Hymite A/S, A Kgs. Lyngby, Denmark Corporation Semiconductor structures having through-holes sealed with feed-through metalization
US20110186123A1 (en) * 2010-02-01 2011-08-04 Fujifilm Corporation Substrate with insulation layer and thin-film solar cell
CN103221330A (zh) * 2010-12-02 2013-07-24 微-埃普西龙测量技术有限两合公司 包括优选为多层的陶瓷基板的传感器及其制造方法
US20150090004A1 (en) * 2013-10-01 2015-04-02 Onesubsea Ip Uk Limited Electrical Conductor and Method of Making Same
EP3985816A1 (en) * 2020-10-14 2022-04-20 Hilti Aktiengesellschaft Protection sleeve

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JP2564234Y2 (ja) * 1991-12-02 1998-03-04 住友電気工業株式会社 原子炉格納容器の壁貫通部における電線貫通部
DE102004024920B4 (de) * 2004-05-19 2009-06-10 Trafag Ag Drucksensor
DE102005040819A1 (de) * 2005-08-27 2007-03-08 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Lot sowie Verfahren zu dessen Anbringung
DE102009003178A1 (de) 2009-05-18 2010-11-25 Endress + Hauser Gmbh + Co. Kg Keramisches Bauteil mit mindestens einer elektrischen Durchführung, Verfahren zu dessen Herstellung und Drucksensor mit einem solchen Bauteil
DE102012208757A1 (de) * 2012-05-24 2013-07-04 Ifm Electronic Gmbh Verfahren zur Herstellung einer kapazitiven Druckmesszelle
DE102015103053A1 (de) 2015-03-03 2016-09-08 Halla Visteon Climate Control Corporation Elektrodurchführungseinheit
DE102016100394A1 (de) 2016-01-12 2017-07-13 Hanon Systems Elektrische Stromdurchführungsanordnung und Verfahren zu deren Herstellung und Montage

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US2121590A (en) * 1936-04-09 1938-06-21 Siemens Ag Vacuum-and gas-tight vessel for electric apparatus
US3436109A (en) * 1965-12-15 1969-04-01 Corning Glass Works Stressed hermetic seal and method of making said seal
US3858097A (en) * 1973-12-26 1974-12-31 Bendix Corp Pressure-sensing capacitor
US3901772A (en) * 1972-12-01 1975-08-26 Quartex Societe Pour L Applic Method of sealing by brazing of a metal part on a ceramic part
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US3436109A (en) * 1965-12-15 1969-04-01 Corning Glass Works Stressed hermetic seal and method of making said seal
US3901772A (en) * 1972-12-01 1975-08-26 Quartex Societe Pour L Applic Method of sealing by brazing of a metal part on a ceramic part
US3858097A (en) * 1973-12-26 1974-12-31 Bendix Corp Pressure-sensing capacitor
US4345299A (en) * 1980-11-03 1982-08-17 Motorola, Inc. Capacitive pressure transducer assembly with improved output lead design
US4371588A (en) * 1980-12-08 1983-02-01 Kyle James C Electrical insulating material with hermetic seal
EP0351701B1 (de) * 1988-07-22 1993-06-02 Endress u. Hauser GmbH u. Co. Drucksensor und Verfahren zu seiner Herstellung

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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670063A (en) * 1991-05-26 1997-09-23 Endress + Hauser Gmbh + Co. Method for making an interface connection through an insulating part
US5600530A (en) * 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck
US5368220A (en) * 1992-08-04 1994-11-29 Morgan Crucible Company Plc Sealed conductive active alloy feedthroughs
US5380955A (en) * 1992-12-08 1995-01-10 International Business Machines Corporation Device for passing a member through a sealed chamber wall
US5877424A (en) * 1995-12-22 1999-03-02 Hegner; Frank Capacitive pressure measuring arrangement having protection against interference signals
EP0797084A1 (de) 1996-03-23 1997-09-24 ENVEC Mess- und Regeltechnik GmbH + Co. Verfahren zum Herstellen von kapazitiven, in Nullpunkt-Langzeit-Fehlerklassen sortierten Keramik-Absolutdruck-Sensoren
US6111198A (en) * 1998-06-15 2000-08-29 Olin Aegis Duplex feedthrough and method therefor
US6346675B1 (en) * 1999-02-19 2002-02-12 Micronas Gmbh Coupling and method for its manufacture
US6213101B1 (en) 1999-10-29 2001-04-10 James W. Numbers Method and apparatus for blocking fluid and fuel vapors
US6501025B2 (en) 1999-11-04 2002-12-31 Clements Manufacturing L.L.C. Method and apparatus for blocking fluid and fluid vapors
US6591685B2 (en) * 2000-03-10 2003-07-15 W.E.T. Automotive Systems Ag Pressure sensor
US6305975B1 (en) 2000-10-12 2001-10-23 Bear Instruments, Inc. Electrical connector feedthrough to low pressure chamber
US20040266038A1 (en) * 2001-10-17 2004-12-30 Hymite A/S, A Kgs. Lyngby, Denmark Corporation Semiconductor structures having through-holes sealed with feed-through metalization
US7057274B2 (en) * 2001-10-17 2006-06-06 Hymite A/S Semiconductor structures having through-holes sealed with feed-through metalization
US6628024B1 (en) * 2002-07-30 2003-09-30 Honeywell International, Inc. Hermetically sealed feed-through assembly for gas turbine engine starter generators and related methods
WO2004095015A1 (en) * 2003-04-17 2004-11-04 The Boc Group Plc Electrochemical solid electrolyte sensor for the detection of oxygen, hydrocarbons and moisture in vacuum environments
US20110186123A1 (en) * 2010-02-01 2011-08-04 Fujifilm Corporation Substrate with insulation layer and thin-film solar cell
CN103221330A (zh) * 2010-12-02 2013-07-24 微-埃普西龙测量技术有限两合公司 包括优选为多层的陶瓷基板的传感器及其制造方法
US20130223031A1 (en) * 2010-12-02 2013-08-29 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor comprising a multi-layered ceramic substrate and method for its production
US9144155B2 (en) * 2010-12-02 2015-09-22 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor comprising a multi-layered ceramic substrate and method for its production
CN103221330B (zh) * 2010-12-02 2016-08-03 微-埃普西龙测量技术有限两合公司 包括优选为多层的陶瓷基板的传感器及其制造方法
US20150090004A1 (en) * 2013-10-01 2015-04-02 Onesubsea Ip Uk Limited Electrical Conductor and Method of Making Same
EP3985816A1 (en) * 2020-10-14 2022-04-20 Hilti Aktiengesellschaft Protection sleeve

Also Published As

Publication number Publication date
IE900947L (en) 1990-09-21
WO1990011610A1 (de) 1990-10-04
DE3909186A1 (de) 1990-09-27
DK0414872T3 (da) 1994-03-21
EP0414872A1 (de) 1991-03-06
CA2028113A1 (en) 1990-09-22
CA2028113C (en) 1997-12-09
ATE99832T1 (de) 1994-01-15
ES2047920T3 (es) 1994-03-01
JPH03501061A (ja) 1991-03-07
EP0414872B1 (de) 1994-01-05
DE59004109D1 (de) 1994-02-17

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