US4772540A - Manufacture of microsieves and the resulting microsieves - Google Patents

Manufacture of microsieves and the resulting microsieves Download PDF

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Publication number
US4772540A
US4772540A US06/771,315 US77131585A US4772540A US 4772540 A US4772540 A US 4772540A US 77131585 A US77131585 A US 77131585A US 4772540 A US4772540 A US 4772540A
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United States
Prior art keywords
photoresist
electrically conductive
microsieve
fixed
substrate
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Expired - Lifetime
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US06/771,315
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English (en)
Inventor
Mordechai Deutsch
Tamar Landau
Richard E. Gordon
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Bar Ilan University
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Bar Ilan University
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Priority to US06/771,315 priority Critical patent/US4772540A/en
Assigned to BAR ILAN UNIVERSITY, RAMAT GAN, ISRAEL reassignment BAR ILAN UNIVERSITY, RAMAT GAN, ISRAEL ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: DEUTSCH, MORDECHAI, LANDAU, TAMAR, GORDON, RICHARD E.
Priority to DE3689701T priority patent/DE3689701T2/de
Priority to IL79807A priority patent/IL79807A/xx
Priority to AT86306526T priority patent/ATE102664T1/de
Priority to EP86306526A priority patent/EP0213902B1/fr
Priority to JP61205030A priority patent/JPS62117610A/ja
Priority to CA000517223A priority patent/CA1309689C/fr
Priority to DK412586A priority patent/DK412586A/da
Priority to CN86105330.3A priority patent/CN1004124B/zh
Publication of US4772540A publication Critical patent/US4772540A/en
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves

Definitions

  • This invention relates to improved methods for manufacturing extremely thin, very delicate metallic structures possessing grid-like patterns of minute, closely spaced, precisely dimensioned apertures.
  • Such apertured metal structures hereinafter referred to as “microsieves” are especially useful in sorting and sieving objects of only a few microns in size.
  • One such microsieve designated a “cell carrier” is described in Spanish patent No. 522,207, granted June 1, 1984, and in commonly assigned, copending U.S. patent application Ser. No. 550,233, filed Nov. 8, 1983, the disclosure of which is incorporated by reference herein, for classifying biological cells by size.
  • the cell carrier is prepared employing a modified photo-fabrication technique of the type used in the manufacture of transmission electron microscope grids.
  • the cell carrier is on the order of only a few microns in thickness and possesses a numerically dense pattern of minute apertures. Even with the exercise of great care, the very delicate nature of the cell carrier makes it difficult to manipulate, for example, to insert it in a holder of the type shown in aforesaid U.S. patent application Ser. No. 550,233, without causing it appreciable damage, frequently in the form of a structural deflection or deformation which renders it useless for its intended use.
  • FIG. 1(a) is a plan view of the cell carrier
  • FIGS. 1(b) and 1(c) are perspective and side elevational views, respectively, of a typical secticn of the cell carrier
  • FIGS. 2(a) through 2(e) are side elevational views of successive steps in the manufacture of a section of the cell carrier.
  • the cell carrier 10 shown in FIG. 1(a) is a very thin metallic disk, for example, about 8 to 10 microns in thickness, with a square-shaped, grid-like pattern of apertures 11 with centers about 15 microns apart defined within its geometric center.
  • the cell carrier can be fabricated from a variety of metals including copper, nickel, silver, gold, etc., or a metal alloy.
  • the apertures actually number 100 on a side for a total of 10,000 apertures and are thus able to receive, and retain, up to 10,000 cells of the desired size with each cell occupying a single aperture.
  • Keyway 12 is provided to approximately orient the cell carrier within its holder.
  • a representative section of grid 11 of cell carrier 10 possesses numerous apertures or holes 20 arranged in a matrix-like pattern of rows and columns along axes X and Y respectively. This arrangement makes it possible to label and locate any one aperture in terms of its position along coordinates X and Y.
  • the shape of apertures 20 enables biological cells 21 of preslected dimensions to be effectively held to the carrier by applying means, such as a pressure differential between the upper and the bottom side of the carrier, or electromagnetic forces.
  • carrier 10 is chosen to have apertures of sizes so that when the matter, for example, blood, containing the various cell groups is placed on carrier 10, most, if not all, of the apertures become occupied by cells of the group of interest with each aperture containing one such cell.
  • the apertures can be sized to receive, say, lymphocytes of which there are two principal sizes, namely, those of 7 microns and those of 10-15 microns, with the former being the cells of most interest and the latter being washed away from the upper surface 10t of the grid under a continuous flow of fluid.
  • apertures 20 will have an upper cross-sectional diameter of about 6 microns and a lower cross-sectional diameter of about 2 microns or so. In this way, a lymphocyte from the desired population of cells can easily enter an aperture but once it has occupied the aperture, it cannot pass out through the bottom side 10b of the carrier.
  • the cut-out areas 30(d) about the bottom of each aperture have no functional significance and result from the procedures whereby the cell carrier is manufactured as discussed below in connection with FIGS. 2(a) through 2(e).
  • photoemulsion layer 30 has been selectively exposed to a source of actinic radiation employing a conventional mask procedure to produce a patterned surface of discrete areas of unexposed photoemulsion 30(a) surrounded by a continuous area 30(b) of exposed photoemulsion.
  • mandrel 31 is removed and the fixed areas 30(a) of the photoemulsion are dissolved, or etched, away to provide carrier 10 containing the desired pattern, or grid, of apertures 20.
  • a circumferential cut-away area 30(d) which possesses no role in the operation of the cell carrier is defined in the bottom of each aperture once fixed photoemulsion areas 30(a) are removed.
  • the aforedescribed method for making a microsieve is subject to a number of disadvantages, foremost among them being the practical difficulty of providing a sufficient thickness, or aperture height, without simultaneously unduly reducing the numerical density of the apertures.
  • the structure is mechanically very fragile and as a result, is difficult to manipulate without causing it to be distorted or damaged.
  • Still another disadvantage lies in the fact that the sloping sides of apertures 20 make it easy for them to be occupied by more than one cell. Ideally, an essentially vertical slope is desired to prevent or minimize this possibility; however, such a slope cannot be obtained with the foregoing method.
  • Yet a further object of the invention is to provide a microsieve in which a substantial proportion of the walls of the individual apertures are essentially perpendicular to the microsieve surface.
  • an ordinarily delicate microsieve is provided with greater resistance to mechanical distortion by being integrally formed with a rigid frame or by having its thickness built up to an extent where it is significantly more capable of with-standing flex.
  • microsieve Since the microsieve is formed as an integral part of a larger, frame member, it can be readily handled without significant risk of damage.
  • microsieve as used herein shall be understood to include not only cell carriers and similar devices but other kinds of precision sieves, screens, grids, scales, reticules, and the like.
  • FIGS. 1(a) through 1(c) and 2(a) through 2(e) are illustrative of a known type of microsieve and its method of manufacture and are fully described above.
  • FIG. 3 is a side elevational, greatly enlarged view of a portion of one embodiment of microsieve in accordance with this invention.
  • FIGS. 5(a) through 5(f) are side elevational views of successive steps in the manufacture of a frame-supported microsieve in accordance with the present invention.
  • FIGS. 6, 7, 8(a) and 8(b) are side elevational views illustrative of still other embodiments of microsieves in accordance with this invention and the methods used in their manufacture.
  • FIG. 3 is illustrative of a preferred microsieve in accordance with this invention shown generally at 10. As shown, the sides of apertures 20 are essentially vertical in contrast to the sloping sides of the apertures in the prior art microsieve of FIGS. 1(a)-(c). This arrangement helps to lessen the opportunity for more than one cell to occupy more than one aperture and also minimizes distortion of the light path which can result from apertures with comparatively gentle sloping walls.
  • Microsieve 10 of FIG. 3 is made by a modification of the known method illustrated in FIGS. 2(a)-(e). Specifically, instead of laying down a thickness of photoresist 30 of only about 1 micron as in FIG. 2(a), the thickness of the photoresist layer is made to be about 7 microns or so. Thus, when the fixed areas of photoresist are eventually removed to provide the sieve, undercut areas 30(d) will actually have the straight-bore configuration shown in FIG. 3. In use, the undercut areas 30(d) of microsieve 10 face upwardly, i.e., toward upper face 40. At upper face 40, the diameter of apertures 20 is about 6 microns and in the constricted area 60, the diameter is about 2 microns; the diameter of the opening at under surface 50 of microsieve 10 is of no significance to the functioning of the device.
  • Microsieve 10 of FIGS. 5(a)-(f) illustrates still another embodiment of the present invention.
  • surface 13a of rigid frame member 13 which is fabricated from an electrically conductive material such as copper, nickel, gold, silver, etc., is placed against a suitable nonadherent surface 11, e.g., one which is substantially optically flat, either directly thereon or indirectly upon a thin foil 12 which serves as a shim to separate surface 13a a short distance, e.g., 5 to 20 microns or so, from surface 11.
  • Frame member 13 possesses a relatively large aperture 14, preferably circular in configuration and defined within the geometric center of surface 13a of the frame, filled with a hardenable electrically conductive material 15, e.g., Wood's alloy which solidifies below its melting point of about 65° C., to form a smooth surface 17.
  • Electrical contact 16 is inserted before, during or after hardening of electrically conductive material 15. Once electrically conductive material 15 has become hardened, i.e., by being cooled to below its solidification point, it will possess a smooth surface 17 of electrically conductive material corresponding to the configuration of the large aperture 14 and surrounded by surface 13a of frame member 13.
  • surface 11 The sole function of surface 11 is to provide corresponding surface 17 of the electrically conductive material, when hardened, with a smooth, striation-free surface and that of optional foil 12 to extend surface 17 some short distance beyond surface 13a of frame 13. After electrically conductive material 15 has hardened, surface 13a of frame 13 is removed from contact with surface 11 and inverted to the face-up position as shown in FIG. 5(b).
  • the height (or thickness) of photoresist 18 will be on the order of about 1 or 2 microns, the precise thickness being dependent in large measure upon the rheological properties of the particular photoresist selected.
  • FIG. 5(c) conventional masking/exposure techniques (as described above in connection with FIGS. 2(a)-(e) which are illustrative of the prior art) provide a grid-like pattern of unexposed areas of photoresist 18(a) surrounded by a continuous area of exposed photoresist 18(b). Following conventional developing, fixing and clearing operations, there is provided the fixed areas of photoresist 18(a) supported on Wood's metal 15 as shown in FIG. 5d.
  • This electrodeposited metal 19 completely surrounds areas of fixed photoresist.
  • electrically conductive material 15 is removed from frame member 13, usually with only a simple breaking-away action, and the fixed areas of photoresist are removed by dissolution or etching with an appropriate solvent to provide the finished, completely self-supporting microsieve spanning what had originally been large aperture 14 of frame member 13.
  • copper frame member 13' of microsieve 10' initially does not possess an aperture.
  • an etchant resistant, electrically non-conductive coating 20 is applied to the underside of frame member 13' except for an exposed, bare copper metal area 21 directly beneath the microsieve portion to be formed from electroplated nickel 19' layer.
  • An etchant which selectively removes copper metal but which does not affect nickel is then used to remove central copper core 22 and fixed areas 18'b of photoresist are removed to provide a finished microsieve 10' similar to that shown in FIG. 5(f).
  • central aperture 14 of frame member 13' is filled with a readily meltable or solvent-soluble electrically non-conductive material 30, e.g., a paraffin wax, in place of electrically conductive material 15 of FIG. 5(a).
  • a readily meltable or solvent-soluble electrically non-conductive material 30 e.g., a paraffin wax
  • an electrically conductive metal 31 e.g., gold, silver, etc.
  • FIGS. 8(a) and (b) Another approach to imparting increased rigidity to a microsieve is illustrated in FIGS. 8(a) and (b).
  • the object is to build up the thickness of the microsieve body to the point where it becomes appreciably more resistant to flex, yet without sacrificing the numerical density of apertures.
  • copper (or other electrically conductive metal) mandrel 40 possesses successive layers 41 to 53 of electroplated metal, e.g., nickel, surrounding fixed photoresist areas 53b which are in concentric alignment with the previously deposited areas of photoresist therebeneath.
  • electroplated metal e.g., nickel
  • This method of manufacturing a microsieve requires that each layer of electroplated metal be no higher, or thicker, than the adjacent areas of fixed photoresist.
  • each of layers 41 to 53 can be separated by a layer 54 of vapor deposited metal of only a few angstroms thickness.
  • the foregoing method makes it possible to vary the cross-sectional geometry of the aperture from one layer to the next and/or to stagger successive layers to obtain an aperture with a non-vertical bore.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Micromachines (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Gyroscopes (AREA)
  • Weting (AREA)
  • Filtering Materials (AREA)
US06/771,315 1985-08-30 1985-08-30 Manufacture of microsieves and the resulting microsieves Expired - Lifetime US4772540A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US06/771,315 US4772540A (en) 1985-08-30 1985-08-30 Manufacture of microsieves and the resulting microsieves
EP86306526A EP0213902B1 (fr) 1985-08-30 1986-08-22 Procédés de fabrication de microtamis et microtamis ainsi obtenus
IL79807A IL79807A (en) 1985-08-30 1986-08-22 Manufacture of microsieves and the resulting microsieves
AT86306526T ATE102664T1 (de) 1985-08-30 1986-08-22 Herstellung von mikrosieben sowie nach diesem verfahren hergestellte mikrosiebe.
DE3689701T DE3689701T2 (de) 1985-08-30 1986-08-22 Herstellung von Mikrosieben sowie nach diesem Verfahren hergestellte Mikrosiebe.
JP61205030A JPS62117610A (ja) 1985-08-30 1986-08-29 マイクロシ−ブおよびその製造法
CA000517223A CA1309689C (fr) 1985-08-30 1986-08-29 Fabrication amelioree des microtamis et microtamis ainsi fabriques
DK412586A DK412586A (da) 1985-08-30 1986-08-29 Fremgangsmaade til fremstilling af mikrosigter
CN86105330.3A CN1004124B (zh) 1985-08-30 1986-08-30 微孔筛的制造方法

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Application Number Priority Date Filing Date Title
US06/771,315 US4772540A (en) 1985-08-30 1985-08-30 Manufacture of microsieves and the resulting microsieves

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US4772540A true US4772540A (en) 1988-09-20

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US (1) US4772540A (fr)
EP (1) EP0213902B1 (fr)
JP (1) JPS62117610A (fr)
CN (1) CN1004124B (fr)
AT (1) ATE102664T1 (fr)
CA (1) CA1309689C (fr)
DE (1) DE3689701T2 (fr)
DK (1) DK412586A (fr)
IL (1) IL79807A (fr)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272081A (en) * 1982-05-10 1993-12-21 Bar-Ilan University System and methods for cell selection
US5282951A (en) * 1990-12-24 1994-02-01 Stork Screens, B.V. Method for forming a sieve material having low internal stress and sieve material so obtained
US5322763A (en) * 1992-05-06 1994-06-21 E. I. Du Pont De Nemours And Company Process for making metal ledge on stencil screen
US5413668A (en) * 1993-10-25 1995-05-09 Ford Motor Company Method for making mechanical and micro-electromechanical devices
US5573815A (en) * 1994-03-07 1996-11-12 E. I. Du Pont De Nemours And Company Process for making improved metal stencil screens for screen printing
US6036832A (en) * 1996-04-19 2000-03-14 Stork Veco B.V. Electroforming method, electroforming mandrel and electroformed product
WO2001021403A1 (fr) * 1999-09-04 2001-03-29 K S R Co., Ltd. Ecran escamotable et procede de fabrication
US6210910B1 (en) 1998-03-02 2001-04-03 Trustees Of Tufts College Optical fiber biosensor array comprising cell populations confined to microcavities
WO2002044318A1 (fr) * 2000-11-28 2002-06-06 Medis El Ltd. Grilles porteuses de cellules ameliorees
US20020132221A1 (en) * 1998-06-24 2002-09-19 Mark S. Chee Decoding of array sensors with microspheres
US20030038087A1 (en) * 2000-01-24 2003-02-27 Garvin Alex M. Physical separation of cells by filtration
US6752997B2 (en) 2001-01-24 2004-06-22 Taro Pharmaceuticals U.S.A., Inc. Process for preparing non-hygroscopic sodium valproate composition
US6794056B1 (en) * 1999-09-22 2004-09-21 Nord Impianti S.R.L. Laminar structure
US20050019954A1 (en) * 2003-07-23 2005-01-27 Eastman Kodak Company Photochromic dyes for microsphere based sensor
US20050158702A1 (en) * 2000-09-05 2005-07-21 Stuelpnagel John R. Cellular arrays comprising encoded cells
NL1030081C2 (nl) * 2005-09-30 2007-04-02 Stork Veco Bv Zeefmateriaal uit metaal en werkwijze voor de vervaardiging daarvan.
US20090114120A1 (en) * 2005-07-08 2009-05-07 Mcintyre Charles Rupert Process for Manufacturing Inks and Pigment Formulations and Ink Jet Inks Made By the Process
US7887752B2 (en) 2003-01-21 2011-02-15 Illumina, Inc. Chemical reaction monitor
WO2011139233A1 (fr) * 2010-05-04 2011-11-10 Agency For Science, Technology And Research Microtamis pour la filtration de cellules et de particules
CN103874788A (zh) * 2011-10-14 2014-06-18 日立化成株式会社 金属过滤器的制造方法
US10359573B2 (en) 1999-11-05 2019-07-23 Board Of Regents, The University Of Texas System Resonant waveguide-granting devices and methods for using same
US20190271287A1 (en) * 2018-03-01 2019-09-05 Robert Bosch Gmbh Method for producing an injector
CN110902642A (zh) * 2018-09-17 2020-03-24 新科实业有限公司 Mems封装件及制造其的方法

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* Cited by examiner, † Cited by third party
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NL8603278A (nl) * 1986-12-23 1988-07-18 Stork Veco Bv Membraan met perforaties en werkwijze voor het vervaardigen van een dergelijk membraan.
DE10219584A1 (de) * 2002-04-26 2003-11-20 Fraunhofer Ges Forschung Verfahren zur Herstellung von Mikrosieben
SE533276C2 (sv) * 2008-12-19 2010-08-10 Alfa Laval Corp Ab Centrifugalseparator med smörjanordning
CN101905214A (zh) * 2010-06-09 2010-12-08 李斌 一种高频振动筛筛体
CN105135188B (zh) * 2015-08-18 2018-01-19 南京中船绿洲机器有限公司 一种碟式分离机轴承润滑系统
JP2019181352A (ja) * 2018-04-06 2019-10-24 株式会社オプトニクス精密 メッシュ部材

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2968555A (en) * 1958-01-13 1961-01-17 Gen Motors Corp Treatment of metal surfaces
US3139392A (en) * 1959-08-10 1964-06-30 Norman B Mears Method of forming precision articles
US3190778A (en) * 1960-06-18 1965-06-22 Clevite Corp Method of fabricating masking sheets
US3329541A (en) * 1960-05-20 1967-07-04 Buckbee Mears Co Method of forming fine mesh screens
US3403024A (en) * 1965-03-22 1968-09-24 Philco Ford Corp Photolithographic etching of extremely detailed patterns
US4058432A (en) * 1975-03-19 1977-11-15 Siemens Aktiengesellschaft Process for producing a thin metal structure with a self-supporting frame
US4388351A (en) * 1979-08-20 1983-06-14 Western Electric Company, Inc. Methods of forming a patterned metal film on a support
US4415405A (en) * 1981-08-19 1983-11-15 Yale University Method for engraving a grid pattern on microscope slides and slips
US4497884A (en) * 1981-10-01 1985-02-05 Veb Zentrum Fur Forschung Und Technologie Mikroelektronik Method for the production of a self-supporting mask

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2832408A1 (de) * 1978-07-24 1980-02-14 Siemens Ag Verfahren zur herstellung von praezisionsflachteilen, insbesondere mit mikrooeffnungen

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2968555A (en) * 1958-01-13 1961-01-17 Gen Motors Corp Treatment of metal surfaces
US3139392A (en) * 1959-08-10 1964-06-30 Norman B Mears Method of forming precision articles
US3329541A (en) * 1960-05-20 1967-07-04 Buckbee Mears Co Method of forming fine mesh screens
US3190778A (en) * 1960-06-18 1965-06-22 Clevite Corp Method of fabricating masking sheets
US3403024A (en) * 1965-03-22 1968-09-24 Philco Ford Corp Photolithographic etching of extremely detailed patterns
US4058432A (en) * 1975-03-19 1977-11-15 Siemens Aktiengesellschaft Process for producing a thin metal structure with a self-supporting frame
US4388351A (en) * 1979-08-20 1983-06-14 Western Electric Company, Inc. Methods of forming a patterned metal film on a support
US4415405A (en) * 1981-08-19 1983-11-15 Yale University Method for engraving a grid pattern on microscope slides and slips
US4497884A (en) * 1981-10-01 1985-02-05 Veb Zentrum Fur Forschung Und Technologie Mikroelektronik Method for the production of a self-supporting mask

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Du Pont s Brochure, Riston Image Transfer Systems, Du Pont Photoproducts Dept., Wilmington, Del., 11/1981. *
Du Pont's Brochure, Riston Image Transfer Systems, Du Pont Photoproducts Dept., Wilmington, Del., 11/1981.

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272081A (en) * 1982-05-10 1993-12-21 Bar-Ilan University System and methods for cell selection
US5282951A (en) * 1990-12-24 1994-02-01 Stork Screens, B.V. Method for forming a sieve material having low internal stress and sieve material so obtained
US5322763A (en) * 1992-05-06 1994-06-21 E. I. Du Pont De Nemours And Company Process for making metal ledge on stencil screen
US5447757A (en) * 1992-05-06 1995-09-05 E. I. Du Pont De Nemours And Company Process for making improved metal stencil screens for screen printing
US5413668A (en) * 1993-10-25 1995-05-09 Ford Motor Company Method for making mechanical and micro-electromechanical devices
US5573815A (en) * 1994-03-07 1996-11-12 E. I. Du Pont De Nemours And Company Process for making improved metal stencil screens for screen printing
US6036832A (en) * 1996-04-19 2000-03-14 Stork Veco B.V. Electroforming method, electroforming mandrel and electroformed product
US6667159B1 (en) 1998-03-02 2003-12-23 Trustees Of Tufts College Optical fiber biosensor array comprising cell populations confined to microcavities
US6210910B1 (en) 1998-03-02 2001-04-03 Trustees Of Tufts College Optical fiber biosensor array comprising cell populations confined to microcavities
US6377721B1 (en) 1998-03-02 2002-04-23 Trustees Of Tufts College Biosensor array comprising cell populations confined to microcavities
US7226734B2 (en) 1998-06-24 2007-06-05 Illumina, Inc. Multiplex decoding of array sensors with microspheres
US20020132221A1 (en) * 1998-06-24 2002-09-19 Mark S. Chee Decoding of array sensors with microspheres
US9399795B2 (en) 1998-06-24 2016-07-26 Illumina, Inc. Multiplex decoding of array sensors with microspheres
US8460865B2 (en) 1998-06-24 2013-06-11 Illumina, Inc. Multiplex decoding of array sensors with microspheres
US20050233318A1 (en) * 1998-06-24 2005-10-20 Chee Mark S Decoding of array sensors with microspheres
US7033754B2 (en) 1998-06-24 2006-04-25 Illumina, Inc. Decoding of array sensors with microspheres
US7060431B2 (en) 1998-06-24 2006-06-13 Illumina, Inc. Method of making and decoding of array sensors with microspheres
US7455971B2 (en) 1998-06-24 2008-11-25 Illumina, Inc. Multiplex decoding of array sensors with microspheres
WO2001021403A1 (fr) * 1999-09-04 2001-03-29 K S R Co., Ltd. Ecran escamotable et procede de fabrication
US6794056B1 (en) * 1999-09-22 2004-09-21 Nord Impianti S.R.L. Laminar structure
US10359573B2 (en) 1999-11-05 2019-07-23 Board Of Regents, The University Of Texas System Resonant waveguide-granting devices and methods for using same
US20030038087A1 (en) * 2000-01-24 2003-02-27 Garvin Alex M. Physical separation of cells by filtration
US20050158702A1 (en) * 2000-09-05 2005-07-21 Stuelpnagel John R. Cellular arrays comprising encoded cells
WO2002044318A1 (fr) * 2000-11-28 2002-06-06 Medis El Ltd. Grilles porteuses de cellules ameliorees
US6495340B2 (en) * 2000-11-28 2002-12-17 Medis El Ltd. Cell carrier grids
KR100873228B1 (ko) * 2000-11-28 2008-12-10 메디스 엘 리미티드 개선된 세포 캐리어 그리드
US6752997B2 (en) 2001-01-24 2004-06-22 Taro Pharmaceuticals U.S.A., Inc. Process for preparing non-hygroscopic sodium valproate composition
US7887752B2 (en) 2003-01-21 2011-02-15 Illumina, Inc. Chemical reaction monitor
US8592214B2 (en) 2003-01-21 2013-11-26 Illumina, Inc. Chemical reaction monitor
US20050019954A1 (en) * 2003-07-23 2005-01-27 Eastman Kodak Company Photochromic dyes for microsphere based sensor
US8021473B2 (en) 2005-07-08 2011-09-20 Fujifilm Imaging Colorants Limited Process for manufacturing inks and pigment formulations and ink jet inks made by the process
US20090114120A1 (en) * 2005-07-08 2009-05-07 Mcintyre Charles Rupert Process for Manufacturing Inks and Pigment Formulations and Ink Jet Inks Made By the Process
US7651000B2 (en) 2005-09-30 2010-01-26 Stork Veco B.V. Sieve material of metal, and method for its production
EP1790405A1 (fr) * 2005-09-30 2007-05-30 Stork Veco B.V. Tamis métallique et procédé de fabrication
NL1030081C2 (nl) * 2005-09-30 2007-04-02 Stork Veco Bv Zeefmateriaal uit metaal en werkwijze voor de vervaardiging daarvan.
WO2011139233A1 (fr) * 2010-05-04 2011-11-10 Agency For Science, Technology And Research Microtamis pour la filtration de cellules et de particules
CN103874788A (zh) * 2011-10-14 2014-06-18 日立化成株式会社 金属过滤器的制造方法
US20140238863A1 (en) * 2011-10-14 2014-08-28 Hitachi Chemical Company, Ltd. Method for producing metal filters
CN103874788B (zh) * 2011-10-14 2018-08-21 日立化成株式会社 金属过滤器的制造方法
US10258906B2 (en) 2011-10-14 2019-04-16 Hitachi Chemical Company, Ltd. Metal filter and method for concentrating cancer cells
US20190271287A1 (en) * 2018-03-01 2019-09-05 Robert Bosch Gmbh Method for producing an injector
US11519373B2 (en) * 2018-03-01 2022-12-06 Robert Bosch Gmbh Method for producing an injector
CN110902642A (zh) * 2018-09-17 2020-03-24 新科实业有限公司 Mems封装件及制造其的方法

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DE3689701D1 (de) 1994-04-14
IL79807A0 (en) 1986-11-30
JPS62117610A (ja) 1987-05-29
CN1004124B (zh) 1989-05-10
CA1309689C (fr) 1992-11-03
DE3689701T2 (de) 1994-09-01
ATE102664T1 (de) 1994-03-15
DK412586D0 (da) 1986-08-29
EP0213902A3 (en) 1988-09-21
DK412586A (da) 1987-03-01
EP0213902A2 (fr) 1987-03-11
IL79807A (en) 1990-09-17
EP0213902B1 (fr) 1994-03-09
CN86105330A (zh) 1987-03-04

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